W19B320ABT8M datasheet, PDF - EEWORLD Datasheet

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W19B320ABT8M: DescriptionFlash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48; Categorystorage storage; File Size479KB，53 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W19B320ABT8M Overview

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48

W19B320ABT8M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	TSOP
package instruction	12 X 20 MM, LEAD FREE, TSOP-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	70 ns
Spare memory width	8
startup block	BOTTOM
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	12 mm

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W19B320AT/B Data Sheet

8/2M

16 BITS

3V FLEXIBLE BANK FLASH MEMORY

Table of Contents-

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATIONS ............................................................................................................ 5

BLOCK DIAGRAM ...................................................................................................................... 6

PIN DESCRIPTION..................................................................................................................... 6

FUNCTIONAL DESCRIPTION ................................................................................................... 7

6.1

Device Bus Operation..................................................................................................... 7

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

6.1.9

6.1.10

6.1.11

6.1.12

6.1.13

6.1.14

Word/Byte Configuration ..................................................................................................7

Reading Array Data ..........................................................................................................7

Writing Commands/Command Sequences.......................................................................7

Simultaneous Read/Write Operations with Zero Latency .................................................8

Standby Mode ..................................................................................................................8

Automatic Sleep Mode .....................................................................................................8

#RESET: Hardware Reset Pin..........................................................................................9

Output Disable Mode........................................................................................................9

Autoselect Mode...............................................................................................................9

Sector/Sector Block Protection and Unprotection...........................................................9

Write Protect (#WP) .....................................................................................................10

Temporary Sector Unprotect ........................................................................................10

Security Sector Flash Memory Region .........................................................................10

Hardware Data Protection ............................................................................................11

Reading Array Data ........................................................................................................12

Reset Command.............................................................................................................12

AUTOSELECT Command Sequence .............................................................................13

Byte/Word Program Command Sequence......................................................................13

Unlock Bypass Command Sequence .............................................................................14

Chip Erase Command Sequence ...................................................................................14

Sector Erase Command Sequence ................................................................................14

Erase Suspend/Erase Resume Commands ...................................................................15

DQ7: #Data Polling.........................................................................................................16

RY/#BY: Ready/#Busy ...................................................................................................16

DQ6: Toggle Bit I............................................................................................................16

6.2

Command Definitions ................................................................................................... 12

6.2.1

6.2.2

6.2.3

6.2.4

6.2.5

6.2.6

6.2.7

6.2.8

6.3

Write Operation Status ................................................................................................. 16

6.3.1

6.3.2

6.3.3

-1-

Publication Release Date: December 27, 2005

Revision A4

W19B320AT/B

6.3.4

6.3.5

6.3.6

6.3.7

DQ2: Toggle Bit II...........................................................................................................17

Reading Toggle Bits DQ6/DQ2 ......................................................................................17

DQ5: Exceeded Timing Limits ........................................................................................17

DQ3: Sector Erase Timer ...............................................................................................18

TABLE OF OPERATION MODES ............................................................................................ 19

7.1

7.2

7.3

7.4

7.5

Device Bus Operations ................................................................................................. 19

AUTOSELECT Codes (High Voltage Method) ............................................................. 19

Sector Address Table (Top Boot Block) ....................................................................... 20

Sector Address Table (Bottom Boot Block) .................................................................. 22

CFI Query Identification String...................................................................................... 26

7.5.1

7.5.2

7.5.3

7.5.4

7.5.5

System Interface String ..................................................................................................26

Device Geometry Definition ............................................................................................27

Primary Vendor-Specific Extended Query ......................................................................28

Command Definitions .....................................................................................................29

Write Operation Status ...................................................................................................30

7.6

7.7

7.8

7.9

7.10

7.11

7.12

8.1

8.2

8.3

8.4

Temporary Sector Unprotect Algorithm ........................................................................ 31

In-System Sector Protect/Unprotect Algorithms........................................................... 32

Security Sector Protect Verify....................................................................................... 33

Program Algorithm........................................................................................................ 33

Erase Algorithm ............................................................................................................ 34

Data Polling Algorithm .................................................................................................. 34

Toggle Bit Algorithm ..................................................................................................... 35

Absolute Maximum Ratings .......................................................................................... 36

Operating Ranges......................................................................................................... 36

DC Characteristics........................................................................................................ 37

8.3.1

8.4.1

8.4.2

CMOS Compatible..........................................................................................................37

Test Condition ................................................................................................................38

AC Test Load and Waveforms .......................................................................................38

ELECTRICAL CHARACTERISTICS......................................................................................... 36

AC Characteristics ........................................................................................................ 38

8.5

8.6

8.7

8.8

8.9

8.10

9.1

Read-Only Operations .................................................................................................. 39

Hardware Reset (#RESET) .......................................................................................... 39

Word/Byte Configuration (#BYTE)................................................................................ 39

Erase and Program Operation...................................................................................... 40

Temporary Sector Unprotect ........................................................................................ 40

Alternate #CE Controlled Erase and Program Operations........................................... 41

AC Read Waveform...................................................................................................... 42

-2-

TIMING WAVEFORMS ............................................................................................................. 42

W19B320AT/B

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

9.10

9.11

9.12

9.13

9.14

10.

11.

12.

13.

Reset Waveform ........................................................................................................... 42

#BYTE Waveform for Read Operation ......................................................................... 43

#BYTE Waveform for Write Operation ......................................................................... 43

Programming Waveform............................................................................................... 44

Accelerated Programming Waveform........................................................................... 44

Chip/Sector Erase Waveform ....................................................................................... 45

Back-to back Read/Write Cycle Waveform .................................................................. 45

#Data Polling Waveform (During Embedded Algorithms) ............................................ 46

Toggle Bit Waveform (During Embedded Algorithms) ................................................. 46

DQ 2 vs. DQ6 Waveform .............................................................................................. 47

Temporary Sector Unprotect Timing Diagram.............................................................. 47

Sector/Sector Block Protect and Unprotect Timing Diagram ....................................... 47

Alternate #CE Controlled Write (Erase/Program) Operation Timing............................ 48

LATCHUP CHARACTERISTICS .............................................................................................. 49

CAPACITANCE......................................................................................................................... 49

ORDERING INFORMATION .................................................................................................... 50

PACKAGE DIMENSIONS ......................................................................................................... 51

13.1

13.2

TFBGA48ball (6X8 mm^2, Ø=0.40mm)........................................................................ 51

48-Pin Standard Thin Small Outline Package .............................................................. 52

14.

VERSION HISTORY ................................................................................................................. 53

-3-

Publication Release Date: December 27, 2005

Revision A4

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