WPSMLBPF SERIES - 3225 (1210)
MULTILAYER CERAMIC BAND PASS FILTER
2.4 GHz ISM Band Working Frequency
WPSMLBPF001A
Page 1 of 7
Sep. -2001
FEATURES
1.
2.
3.
4.
5.
6.
Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology
Reflow solderable
Miniatured Size 3.2 x 2.5 x 1.5 mm
3
Low Insertion Loss
High attenuation on 2nd harmonic suppressed
Suitable for 2.45 GHz Working Frequency Operation
APPLICATIONS
1.
2.
2.4GHz ISM Band RF Application
Bluetooth, Wireless LAN, HomeRF
CONSTRUCTION
Fig 1. Outline of 2.4GHz Band Pass Filter
DESCRIPTION
Our new ceramic Band Pass Filter specified for 2.4 GHz ISM Band application, as
shown in fig-1. Both of Wireless LAN IEEE 802.11b, and Bluetooth
TM
typically located on this unlicensed frequency band
which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements, this Band
Pass Filter has been designed to a high suppression on 2
nd
harmonic as well as low insertion loss characteristics through
our advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM
Simulation Skill.
This Band Pass Filter has a rectangular ceramic body with a tiny dimension of 3.2 x 2.5 x 1.5 mm
3
future meet the SMT
automation and miniaturization requirements on modern portable devices.
DIMENSIONS
Figure
Symbol
L
W
T
D
A
B
C
D
Dimension
3.20 ± 0.20 mm
2.50 ± 0.20 mm
1.50 ± 0.10 mm
0.40 ± 0.20 mm
0.60 ± 0.20 mm
0.70 ± 0.20 mm
0.20 ± 0.15 mm
Page 2 of 7
Sep.-2001
SOLDER LAND PATTERN
Figure
Symbol
Dimension (mm)
3.40
±
0.10
1.50
±
0.10
1.20
±
0.10
2.80
±
0.10
0.30
±
0.10
0.90
±
0.10
0.60
±
0.10
0.50
±
0.10
0.40
±
0.10
L
W2
W1
B1
L1
A1
A
B
L
A
B
L1
A1
B1
W1
I/O Solder Pad
Ground Solder Pad
Ground Via
W2
Φ
Line width to be design to match 50Ω characteristic impedance,
depending on PCB material and thickness.
ELECTRICAL CHARACTERISTICS
n
WPSMLBPF001A Series
Item
Specification
2450
±
50 MHz
2.5 dB (max)
1.7
0.6 dB
40 dB @ 1500 MHz ~ 1550 MHz
45 dB @ 1800 MHz ~ 1900 MHz
Frequency range (MHz)
Insertion Loss
VSWR
Ripple
Attenuation (min.)
30 dB @ 2100 MHz
15 dB @ 2200 MHz
30 dB @ 4800 ~ 5000 MHz
*Note1: Rated power 5W MAX
*Note2: Maximum Input power: 10W for 5 minutes
Page 3 of 7
Sep.-2001
RELIABILITY TEST
n
Mechanical performance
Test item
Solderability
Test condition / Test method
Solder temp.
: 235
±
5°C
Immersion time: 2
±
1 sec
Solder: SN63
Specification
At least 95% of a surface of
each terminal electrode must
be covered by fresh solder.
Resistance to soldering heat
Solder: Sn63
Preheating temperature: 150
±
10°C
Solder Temperature: 260
±
5°C
Immersion time: 10
±
1 sec
Measurement to be made after keeping at room
temp. for 24±2 hrs.
No mechanical damage.
Ceramic surface shall not be
exposed in the middle of the
termination or on the
terminated product edge by
leaching.
Drop Test
Height : 75 cm
Direction : 3 directions
Times : 3 times for each direction.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
n
Environmental characteristics
Test item
Test condition / Test method
Humidity:90% to 95% R.H.
Tempertaure:40±2°C
Time: 500±24 hours.
Measurement: After placing for 24 hours Minimum.
Specification
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Humidity (steady conditions)
Temperature cycle
1.
2.
3.
4.
30±3 minutes at -40°C±3°C,
10~15 minutes at room temperature,
30±3 minutes at +85°±3°C,
10~15 minutes at room temperature,
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Total 100 continuous cycles
Measurement after placing for 48±2 hrs min.
High temperature
Temperature: 85°C±2°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
Low temperature
Temperature: -40°C±3°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Page 4 of 7
Sep.-2001
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
PACKING CODE : WPSMLBPF001A*
*
Packing
T : 7” Reeled
G : 10” Reeled
B : Bulk
X : SFC product
Page 5 of 7
Sep.-2001
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