MPC562CZP40 datasheet, PDF - EEWORLD Datasheet

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MPC562CZP40: Description32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388; CategoryThe embedded processor and controller Microcontrollers and processors; File Size20MB，1497 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MPC562CZP40 Overview

32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

MPC562CZP40 Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	BGA,
Contacts	388
Reach Compliance Code	unknown
Has ADC	NO
Address bus width	24
bit size	32
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width	32
JESD-30 code	S-PBGA-B388
length	27 mm
Number of I/O lines	16
Number of terminals	388
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
ROM programmability	FLASH
Maximum seat height	2.55 mm
speed	40 MHz
Maximum supply voltage	2.7 V
Minimum supply voltage	2.5 V
Nominal supply voltage	2.6 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Contents

Paragraph

Section

Number

Title

About This Book

Audience ............................................................................................................ lxxv

Organization....................................................................................................... lxxv

Suggested Reading............................................................................................ lxxix

Conventions and Nomenclature......................................................................... lxxx

Notational Conventions .................................................................................... lxxxi

Acronyms and Abbreviations ........................................................................... lxxxi

References....................................................................................................... lxxxiii

Chapter 1

Overview

1.1

1.2

1.3

1.3.1

1.3.1.1

1.3.1.2

1.3.1.3

1.3.1.4

1.3.1.5

1.3.1.6

1.3.1.7

1.3.1.8

1.3.2

1.3.3

1.3.3.1

1.3.3.2

1.3.3.3

1.3.3.4

1.3.3.5

1.3.3.6

1.4

MOTOROLA

Page

Number

Introduction.......................................................................................................... 1-1

Block Diagram ..................................................................................................... 1-2

Key Features ........................................................................................................ 1-3

High-Performance CPU System ...................................................................... 1-3

RISC MCU Central Processing Unit (RCPU) ............................................. 1-4

Unified System Interface Unit (USIU) ........................................................ 1-4

Burst Buffer Controller (BBC) Module....................................................... 1-4

Flexible Memory Protection Unit................................................................ 1-5

Memory Controller ...................................................................................... 1-5

512-Kbytes of CDR3 Flash EEPROM Memory (UC3F) –

MPC563/MPC564 Only .......................................................................... 1-5

32-Kbyte Static RAM (CALRAM) ............................................................. 1-6

General Purpose I/O Support (GPIO).......................................................... 1-6

Nexus Debug Port (Class 3)............................................................................. 1-6

Integrated I/O System ...................................................................................... 1-6

Two Time Processor Units (TPU3).............................................................. 1-6

22-Channel Modular I/O System (MIOS14) ............................................... 1-7

Two Enhanced Queued Analog-to-Digital Converter Modules

(QADC64E)............................................................................................. 1-7

Three CAN 2.0B Controller (TouCAN) Modules ....................................... 1-7

Queued Serial Multi-Channel Module (QSMCM) ...................................... 1-8

Peripheral Pin Multiplexing (PPM) ............................................................. 1-8

MPC561/MPC563 Optional Features .................................................................. 1-9

Contents

iii

Contents

Paragraph

Number

1.5

1.6

1.7

1.8

1.9

Title

Page

Number

Comparison of MPC561/MPC563 and MPC555 ................................................ 1-9

Additional MPC561/MPC563 Differences........................................................ 1-10

SRAM Keep-Alive Power Behavior.................................................................. 1-11

MPC561/MPC563 Address Map ....................................................................... 1-12

Supporting Documentation List......................................................................... 1-14

Chapter 2

Signal Descriptions

2.1

2.2

2.2.1

2.2.2

2.3

2.4

2.5

2.5.1

2.5.2

2.5.3

2.6

2.6.1

2.6.2

2.6.3

2.6.4

2.6.4.1

2.6.4.2

2.6.4.3

2.6.4.4

2.6.5

Signal Groupings ................................................................................................. 2-1

Signal Summary................................................................................................... 2-3

MPC561/MPC563 Signal Multiplexing ........................................................ 2-20

READI Port Signal Sharing........................................................................... 2-21

Pad Module Configuration Register (PDMCR)................................................. 2-22

Pad Module Configuration Register (PDMCR2)............................................... 2-23

MPC561/MPC563 Development Support Signal Sharing................................. 2-26

JTAG Mode Selection.................................................................................... 2-27

BDM Mode Selection .................................................................................... 2-28

Nexus Mode Selection ................................................................................... 2-29

Reset State.......................................................................................................... 2-30

Signal Functionality Configuration Out of Reset .......................................... 2-30

Signal State During Reset .............................................................................. 2-30

Power-On Reset and Hard Reset ................................................................... 2-31

Pull-Up/Pull-Down ........................................................................................ 2-31

Pull-Up/Pull-Down Enable and Disable for 5-V Only and 2.6-V Only

Signals ................................................................................................... 2-31

Pull-Down Enable and Disable for 5-V/2.6-V Multiplexed Signals ......... 2-31

Special Pull Resistor Disable Control Functionality (SPRDS) ................. 2-32

Pull Device Select (PULL_SEL) ............................................................... 2-32

Signal Reset States......................................................................................... 2-32

Chapter 3

Central Processing Unit

3.1

3.2

3.3

3.4

3.4.1

3.4.2

3.4.3

3.4.4

RCPU Block Diagram ......................................................................................... 3-2

RCPU Key Features............................................................................................. 3-3

Instruction Sequencer .......................................................................................... 3-3

Independent Execution Units............................................................................... 3-4

Branch Processing Unit (BPU) ........................................................................ 3-5

Integer Unit (IU) .............................................................................................. 3-6

Load/Store Unit (LSU) .................................................................................... 3-6

Floating-Point Unit (FPU) ............................................................................... 3-7

MPC561/MPC563 Reference Manual

MOTOROLA

MPC562CZP40 Related Products

	MPC562CZP40	MPC561MZP56	MPC561CZP40	MPC562MZP56	MPC563CZP40	MPC564MVR56	MPC564CZP66
Description	32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 56MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 56 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 56 MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	32-BIT, FLASH, 66MHz, RISC MICROCONTROLLER, PBGA388, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	BGA,	BGA,	27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388	BGA,	27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Contacts	388	388	388	388	388	388	388
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Has ADC	NO	NO	NO	NO	NO	NO	NO
Address bus width	24	24	24	24	24	24	24
bit size	32	32	32	32	32	32	32
maximum clock frequency	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO
External data bus width	32	32	32	32	32	32	32
JESD-30 code	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388
length	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm
Number of I/O lines	16	16	16	16	16	16	16
Number of terminals	388	388	388	388	388	388	388
Maximum operating temperature	85 °C	125 °C	85 °C	125 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	2.55 mm	2.55 mm	2.55 mm	2.55 mm	2.55 mm	2.55 mm	2.55 mm
speed	40 MHz	56 MHz	40 MHz	56 MHz	40 MHz	56 MHz	66 MHz
Maximum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Nominal supply voltage	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	Rochester Electronics	-	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics
Is it lead-free?	-	Contains lead	-	-	Contains lead	Contains lead	Contains lead
JESD-609 code	-	e0	-	-	e0	e0	e0
Humidity sensitivity level	-	3	-	-	3	3	3
Peak Reflow Temperature (Celsius)	-	240	-	-	240	240	240
Terminal surface	-	TIN LEAD	-	-	TIN LEAD	TIN LEAD	TIN LEAD
Maximum time at peak reflow temperature	-	30	-	-	30	30	30

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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