ZMD31020BIF-R datasheet, PDF - EEWORLD Datasheet

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ZMD31020BIF-R: DescriptionAnalog Circuit, 1 Func, CMOS, PDSO14, 5.30 MM, SSOP-14; CategoryAnalog mixed-signal IC The signal circuit; File Size587KB，21 Pages; ManufacturerZentrum Mikroelektronik Dresden AG (IDT)

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ZMD31020BIF-R Overview

Analog Circuit, 1 Func, CMOS, PDSO14, 5.30 MM, SSOP-14

ZMD31020BIF-R Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Zentrum Mikroelektronik Dresden AG (IDT)
Parts packaging code	SSOP
package instruction	SSOP,
Contacts	14
Reach Compliance Code	compliant
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
length	6.2 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	1.99 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm

ZMD31020BIF-R Preview

ZMD31020

Sensor Signal Conditioner

Datasheet

Features

•

Digital compensation of sensor offset, sensitivity,

temperature drift and non-linearity

•

Adjustable to nearly all piezo-resistive bridge

sensor types

•

Digital one-shot calibration: quick and precise

•

Selectable temperature compensation reference:

internal or external diode

•

Output options: 0...5V analog ratiometric voltage

or 12 bit digital I

C interface

•

Product traceability by user-defined EEPROM

entries

•

Operation temperature range, depending on

product version, up to –40...+125°C

•

Supply voltage +4.5...+5.5V

•

Sampling rate

≥100Hz

•

Available in SSOP14 or as die

Brief Description

ZMD31020 is a CMOS integrated circuit for highly-

accurate amplification and sensor-specific correction

of bridge sensor signals. The device provides digital

compensation of sensor offset, sensitivity,

temperature drift and non-linearity by a 16-bit RISC

micro controller running a correction algorithm.

ZMD31020 accommodates nearly all piezo-resistive

bridge sensor types.

The bi-directional digital I

C interface can be used for

a simple PC-controlled one-shot calibration

procedure, in order to program a set of calibration

coefficients into an on-chip EEPROM. Thus a specific

sensor and a ZMD31020 are mated digitally: fast,

precise and without the cost overhead associated with

trimming by external devices or laser.

ZMD31020 has been designed for industrial and

consumer applications and is specifically suited for

most pressure sensors.

Demo kit available (incl. calibration PCB,

SSOP14 samples, software, technical

documentation)

Support for industrial calibration available

Quick circuit customization possible for large

production volumes

Benefits

•

No external trimming components required

PC-controlled configuration and calibration via

digital bus interface - simple, low cost

High accuracy (±0.1% FSO @ -25 to 85°C;

±0.25% FSO @ -40 to 125°C)

Application Circuit Example

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

Content

Pin Description ............................................................................................................................................. 2

Circuit Description ........................................................................................................................................ 3

2.1

Signal Flow ............................................................................................................................................... 3

2.2

Configuration Word................................................................................................................................... 4

2.3

Differential Sensor .................................................................................................................................... 4

2.4

Temperature Sensing ............................................................................................................................... 4

2.5

Analog Input Channel ............................................................................................................................... 5

2.5.1

Bridge Polarity Setting....................................................................................................................... 5

2.5.2

Programmable Gain Amplifier PGA................................................................................................... 5

2.5.3

Analog-to-digital Converter ADC ....................................................................................................... 5

2.5.4

Temperature Measurement............................................................................................................... 6

2.6

Correction Microcontroller CMC ............................................................................................................... 6

2.7

Parameter EEPROM ................................................................................................................................ 7

2.8

Sensor Signal Correction Method and Sequence .................................................................................... 8

2.9

Digital I

C Interface................................................................................................................................... 8

2.9.1

Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test............................. 8

2.9.2

Data Communication Specifics ......................................................................................................... 8

2.10

The Analog Output Stage ................................................................................................................... 10

Electrical specification ................................................................................................................................ 11

3.1

Absolute maximum ratings ..................................................................................................................... 11

3.2

Operating Conditions.............................................................................................................................. 11

3.3

Electrical Parameters ............................................................................................................................. 12

3.3.1

Power Supply .................................................................................................................................. 12

3.3.2

PGA & 12-bit Input ADC.................................................................................................................. 12

3.3.3

Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC

(4)

.............................. 13

3.3.4

12-bit ADC

(1)

................................................................................................................................... 13

3.3.5

EEPROM programming................................................................................................................... 13

3.3.6

Serial I

C Interface .......................................................................................................................... 13

3.3.7

11-bit Output DAC & Output BUFFER

(2)

........................................................................................ 15

3.3.8

Total System.................................................................................................................................... 15

Package Dimensions.................................................................................................................................. 16

Die Dimensions and Pad Coordinates ....................................................................................................... 17

5.1

Die Dimensions....................................................................................................................................... 17

5.2

Pad Coordinates ..................................................................................................................................... 18

Demo Kit ZMD31020DK............................................................................................................................. 19

Ordering Information .................................................................................................................................. 20

Related Documents.................................................................................................................................... 20

1/20

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

Pin Description

Number

Name

VOUT

VDDA (*)

VDD

VSS

SCL

SDA

VPP

VBN

VDDB2 (*)

VTN

VDDB1 (*)

VBP

VSSB (**)

VSSA (**)

Description

analog conditioned sensor signal output

analog device functions positive supply

digital device functions positive supply

digital device functions negative supply

I²C clock input, on-chip pull-up resistor

I²C data input / output, on-chip pull-up resistor

positive EEPROM programming voltage

differential sensor signal negative input

positive supply for sensor and temperature sensing diode

input for temperature sensing diode

positive supply for sensor and temperature sensing diode

differential sensor signal positive input

sensor negative supply

analog device functions negative supply

(*)

(**)

VDDA, VDDB1 and VDDB2 tied to common on-chip positive supply rail

VSSA and VSSB tied to common on-chip negative supply rail

2/20

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

2.1

Circuit Description

Signal Flow

Block diagram of ZMD31050

PGA

MUX

ADC

CMC

DAC

BAMP

EEPROM

ROM

programmable gain amplifier

multiplexer

analog-to-digital converter

calibration microcontroller

digital-to-analog converter

buffer amplifier

on-chip temperature sensor (pn-junction)

for calibration parameters and configuration

for correction formula and –algorithm

serial interface: I C data I/O, clock

The ZMD31020’s signal path is partly analog (blue) and partly digital (red). The differential signal from the

resistive bridge sensor is pre-amplified by the programmable gain amplifier (PGA). There are 3 different

adjustable gains.

The Multiplexer (MUX) transmits the differential signal or the temperature signal to the ADC in a certain

sequence. (The external temperature sensing diode or the internal temperature sensor can be used optionally.)

The ADC converts the differential signal with 12 bits resolution and the temperature signal with 10 bits resolution

into digital values.

The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special

correction formula located in the ROM and on a set of sensor-specific calibration parameters stored in the

EEPROM.

3/20

written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31020

Sensor Signal Conditioner

Datasheet

The resulting corrected sensor signal is output via the I

C-interface (with 12 bits resolution) , or, after conversion

by the DAC, as analog voltage (with 11 bits resolution) at the buffer amplifier (BAMP). The programming of the

configuration data and of the calibration parameters into the EEPROM (during the calibration procedure) is also

realized via the I

C interface.

2.2

Configuration Word

Many of the following sections, describing each block of ZMD31020 in detail, will refer to configuration bits, part

of the configuration word stored under address &H09 of the parameter EEPROM. These bits are settings for a

number of on-chip device functions and select specific functional or parametrical behaviour.

The contents of the parameter EEPROM are determined and calculated, written and stored under PC-control

during the calibration procedure. Hence the configuration bits are coded and non-volatile stored once calibration

of a ZMD31020 device / sensor pair has taken place, and will remain unchanged during regular sensing

operation, unless re-calibration is performed.

Configuration word, stored under address &H09 of the parameter EEPROM

Only 7 bits of the configuration word are relevant settings as follows:

Bit 0, Bit 1

O0, O1: select ADC’s offset compensation

Bit 2, Bit 3

G0, G1: select PGA’s gain

Bit 4

BP: cross-switches differential sensor inputs VBP and VBN

Bit 5

TS: selects on-chip vs. off-chip temperature sensor

Bit 6

CH: enables PGA’s chopper-stabilization

The possible options of these settings are shown in table form in the following paragraphs.

2.3

Differential Sensor

ZMD31020 has been specifically designed for ratiometric differential sensors, e.g. Wheatstone bridge type

sensors. A ratiometric sensor typically generates a differential output signal proportional to the supply voltage

applied to it.

The sensor is supplied from VDDB1 or VDDB2 (whichever pin/pad is more favourable layoutwise) at the + side

and tied to VSSB at the – side. The sensor's differential output signal is routed to VBP and VBN.

Sensor and signal conditioner ZMD31020 have the same supply (see block schematic in section 2.1, hence the

differential input voltage seen by ZMD31020 is ratiometric to it’s supply voltage.

2.4

Temperature Sensing

The characteristic of a sensor element tends to change with temperature. To compensate for this, ZMD31020 is

equipped to measure temperature by an external diode or by an on-chip pn-junction. TS – configuration bit 5 –

will select the desired sensor option as follows:

Temperature sensing diode

off chip

on chip

4/20

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ZMD31020BIF-R Related Products

	ZMD31020BIF-R	ZMD31020BIF-T
Description	Analog Circuit, 1 Func, CMOS, PDSO14, 5.30 MM, SSOP-14	Analog Circuit, 1 Func, CMOS, PDSO14, 5.30 MM, SSOP-14
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	Zentrum Mikroelektronik Dresden AG (IDT)	Zentrum Mikroelektronik Dresden AG (IDT)
Parts packaging code	SSOP	SSOP
package instruction	SSOP,	SSOP,
Contacts	14	14
Reach Compliance Code	compliant	compli
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT	ANALOG CIRCUIT
JESD-30 code	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e0	e0
length	6.2 mm	6.2 mm
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	14	14
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	240	240
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.99 mm	1.99 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	5.3 mm	5.3 mm

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