Z8F3222VS020AG datasheet, PDF - EEWORLD Datasheet

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Z8F3222VS020AG: DescriptionIC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC68, LEAD FREE, PLASTIC, LCC-68, Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，61 Pages; ManufacturerZilog, Inc.; Websitehttps://www.zilog.com/; Environmental Compliance

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Z8F3222VS020AG Overview

IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC68, LEAD FREE, PLASTIC, LCC-68, Microcontroller

Z8F3222VS020AG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Zilog, Inc.
Parts packaging code	LCC
package instruction	QCCJ, LDCC68,1.0SQ
Contacts	68
Reach Compliance Code	unknown
Has ADC	YES
Address bus width
bit size	8
CPU series	Z8
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQCC-J68
JESD-609 code	e3
length	24.23 mm
Number of I/O lines	46
Number of terminals	68
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	2048
rom(word)	32768
ROM programmability	FLASH
Maximum seat height	4.57 mm
speed	20 MHz
Maximum slew rate	16 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	24.23 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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PS007226-0408

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Packaging

Product Specification

iii

Table of Contents

Ordering Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tape, Reel, Tray, and Tube Counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Mark Permanency (For Ink Mark). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Plastic Dual In-Line Packages (PDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Shrink Dual In-Line Packages (SDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Plastic Leaded Chip Carriers (PLCCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Low-Profile Quad Flat Packages (LQFPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Quad Flat No Lead (QFNs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Plastic Quad Flat Packages (QFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Small Outline Integrated Circuits (SOICs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Shrink Small Outline Packages (SSOPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Low-Profile Ball Grid Arrays (LBGAs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Transceiver Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Lead Type, Carrier Tape Size, and Reel Quantity . . . . . . . . . . . . . . . . . . . 41

Preferred Package Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Change Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

PS007226-0408

Table of Contents

Packaging

Product Specification

List of Figures

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Current Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Motor Control Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . 2

IR Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

ARM Part Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Previous Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . . 8

14-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

18-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

20-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

22-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

28-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 11

40-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

48-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

42-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 13

52-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 14

64-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 15

28-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 16

44-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 17

68-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

84-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

32-Lead Plastic Low-Profile Quad Flat

Package (7 x 7 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

44-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

64-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

64-Lead Plastic Low-Profile Quad Flat

Package (14 x 14 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

100-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 23

144-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 24

8 Quad Flat No Lead (5 x 6 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . . 25

20 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

28 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

32 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 27

PS007226-0408

List of Figures

Packaging

Product Specification

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44 Quad Flat No Lead (7 x 7 mm) . . . . . . . . . . . . . . . . . . . . . . . . . .

80-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . .

100-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

144-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

8-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . .

18-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

28-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

28-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

48-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

144-Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . .

196-Lead Low-Profile Ball Grid

Array (15 x 15 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

256-Lead Low-Profile Ball Grid

Array (17 x 17 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1203 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1223 Mechanical Specification . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1403 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1423 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1810 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1810 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1820 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1820 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18-/20-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28-Lead Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

40-/44-/48-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

100-/144-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PS007226-0408

List of Figures

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