Z8F6422AR020AG datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> Z8F6422AR020AG

Z8F6422AR020AG: DescriptionIC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP64, LEAD FREE, LQFP-64, Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，61 Pages; ManufacturerZilog, Inc.; Websitehttps://www.zilog.com/; Environmental Compliance

Download Datasheet Parametric View All

Z8F6422AR020AG Overview

IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP64, LEAD FREE, LQFP-64, Microcontroller

Z8F6422AR020AG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Zilog, Inc.
Parts packaging code	QFP
package instruction	LFQFP, QFP64,.47SQ,20
Contacts	64
Reach Compliance Code	unknown
Has ADC	YES
Address bus width
bit size	8
CPU series	Z8
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G64
JESD-609 code	e3
length	10 mm
Number of I/O lines	46
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP64,.47SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	4096
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	20 MHz
Maximum slew rate	16 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

Preview

Download Datasheet

View All

Packaging

Product Specification

PS007226-0408

www.zilog.com

Packaging

Product Specification

iii

Table of Contents

Ordering Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package Designators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Environmental Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tape, Reel, Tray, and Tube Counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Mark Permanency (For Ink Mark). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Plastic Dual In-Line Packages (PDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Shrink Dual In-Line Packages (SDIPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Plastic Leaded Chip Carriers (PLCCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Low-Profile Quad Flat Packages (LQFPs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Quad Flat No Lead (QFNs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Plastic Quad Flat Packages (QFPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Small Outline Integrated Circuits (SOICs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Shrink Small Outline Packages (SSOPs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Low-Profile Ball Grid Arrays (LBGAs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Transceiver Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Lead Type, Carrier Tape Size, and Reel Quantity . . . . . . . . . . . . . . . . . . . 41

Preferred Package Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Change Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

PS007226-0408

Table of Contents

Packaging

Product Specification

List of Figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

Figure 28.

Figure 29.

Figure 30.

Current Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Motor Control Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . 2

IR Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

ARM Part Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Previous Part-Numbering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . . 8

14-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

18-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . . 9

20-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

22-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 10

28-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 11

40-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

48-Lead Plastic Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 12

42-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 13

52-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 14

64-Lead Shrink Dual In-Line Package . . . . . . . . . . . . . . . . . . . . . . . 15

28-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 16

44-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 17

68-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

84-Lead Plastic Leaded Chip Carrier . . . . . . . . . . . . . . . . . . . . . . . . 18

32-Lead Plastic Low-Profile Quad Flat

Package (7 x 7 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

44-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

64-Lead Plastic Low-Profile Quad Flat

Package (10 x 10 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

64-Lead Plastic Low-Profile Quad Flat

Package (14 x 14 x 1.4 mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

100-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 23

144-Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . . . . . 24

8 Quad Flat No Lead (5 x 6 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . . 25

20 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

28 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 26

32 Quad Flat No Lead (5 x 5 x 0.9 mm) . . . . . . . . . . . . . . . . . . . . . . 27

PS007226-0408

List of Figures

Packaging

Product Specification

Figure 31.

Figure 32.

Figure 33.

Figure 34.

Figure 35.

Figure 36.

Figure 37.

Figure 38.

Figure 39.

Figure 40.

Figure 41.

Figure 42.

Figure 43.

Figure 44.

Figure 45.

Figure 46.

Figure 47.

Figure 48.

Figure 49.

Figure 50.

Figure 51.

Figure 52.

Figure 53.

Figure 54.

Figure 55.

Figure 56.

44 Quad Flat No Lead (7 x 7 mm) . . . . . . . . . . . . . . . . . . . . . . . . . .

80-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . . .

100-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

144-Lead Plastic Quad Flat Package . . . . . . . . . . . . . . . . . . . . . . . .

8-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . . .

18-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

28-Lead Small Outline Integrated Circuit . . . . . . . . . . . . . . . . . . . . .

20-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

28-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

48-Lead Shrink Small Outline Package . . . . . . . . . . . . . . . . . . . . . .

144-Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . .

196-Lead Low-Profile Ball Grid

Array (15 x 15 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

256-Lead Low-Profile Ball Grid

Array (17 x 17 mm, 1.0 mm pitch) . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1203 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1223 Mechanical Specification . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1403 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1423 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1810 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1810 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ZHX1820 Transceiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate ZHX1820 Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18-/20-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28-Lead Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

40-/44-/48-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

100-/144-Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PS007226-0408

List of Figures

Recommended Resources

Varactor diode direct frequency modulation circuit

Half-point time-stopping circuit g

Multi-channel signal centralized monitoring circuit

C523 double column vertical lathe control circuit 02

Simple inverter circuit

555 timer circuit with adjustable intermittent time

write an os for myself: I have always wanted to write an operating system. Currently, I can only write the startup program. I want to write one that can run my own applications. I have seen LINUX and MINX source codes, but t...; erxu Embedded System

The 200-meter line signal has irregular jumps after the op amp output: [i=s]This post was last edited by Tiantian1 on 2022-7-26 15:15[/i]At present, the signal is amplified by AD623, then bandpass filtered and fully amplified by OP07. The sensor is connected with a 1-met...; 天天1 Analog electronics

Ask for help with a question [Questions about AIR debugging]: A very basic watchdog example: int main(void) { tRectangle sRect; // // Set the clocking to run directly from the crystal. // SysCtlClockSet(SYSCTL_SYSDIV_1 | SYSCTL_USE_OSC | SYSCTL_OSC_MAIN | SYSCTL...; xiaoyedeng ARM Technology

【GD32F307E-START】+ Completed driving LCD19264 display: [i=s]This post was last edited by hujj on 2020-11-12 17:47[/i]I originally planned to test the serial communication first, but the two examples of serial port interrupt and serial port DMA provided by...; hujj Domestic Chip Exchange

15 websites that changed the world in 15 years: In August 1991, the United States officially changed the use of Internet technology from military to civilian use, which triggered a global Internet boom and brought about earth-shaking changes in hum...; soso Talking

How is the format of ROM/bin files processed?: What is the format of the ROM/bin file and how to process it? For example, in the [Display Settings], 1234512345 is found to be DF5FBBB9BA in the ROM of the mobile phone/MP4. What processing has been ...; xbj0627 Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components