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AD6642BBCZ

Description
Dual IF Receiver
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,33 Pages
ManufacturerADI
Websitehttps://www.analog.com
Environmental Compliance
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Dual IF Receiver

AD6642BBCZ Parametric

Parameter NameAttribute value
Brand NameAnalog Devices Inc
Is it lead-free?Contains lead
Is it Rohs certified?conform to
MakerADI
Parts packaging codeBGA
package instructionLFBGA, BGA144,12X12,32
Contacts144
Manufacturer packaging codeBC-144-1
Reach Compliance Codecompliant
ECCN code5A991.B
Samacsys DescriptionDual IF Receiver
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length10 mm
Humidity sensitivity level3
Number of functions1
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA144,12X12,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1.8 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum slew rate0.291 mA
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesRF AND BASEBAND CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width10 mm

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Dual IF Receiver
AD6642
FEATURES
11-bit, 200 MSPS output data rate per channel
Integrated noise shaping requantizer (NSR)
Performance with NSR enabled
SNR: 75.5 dBFS in 40 MHz band to 70 MHz @ 185 MSPS
SNR: 73.7 dBFS in 60 MHz band to 70 MHz @ 185 MSPS
Performance with NSR disabled
SNR: 66.5 dBFS to 70 MHz @ 185 MSPS
SFDR: 83 dBc to 70 MHz @ 185 MSPS
Low power: 0.62 W @ 185 MSPS
1.8 V analog supply operation
1.8 V LVDS (ANSI-644 levels) output
1-to-8 integer clock divider
Internal ADC voltage reference
1.75 V p-p analog input range (programmable to 2.0 V p-p)
Differential analog inputs with 800 MHz bandwidth
95 dB channel isolation/crosstalk
Serial port control
User-configurable built-in self-test (BIST) capability
Energy-saving power-down modes
FUNCTIONAL BLOCK DIAGRAM
AVDD
AGND
DRVDD
DRGND
AD6642
VIN+A
VIN–A
VCMA
VIN+B
VIN–B
VCMB
REFERENCE
CLOCK
DIVIDER
SERIAL PORT
PIPELINE
ADC
14
NOISE SHAPING
REQUANTIZER
11
PIPELINE
ADC
14
NOISE SHAPING
REQUANTIZER
11
DATA MULTIPLEXER
AND LVDS DRIVERS
DC0±AB
D0±AB
D10±AB
MODE
SYNC
PDWN
08563-001
SCLK
SDIO
CSB
CLK+ CLK–
Figure 1.
PRODUCT HIGHLIGHTS
1.
2.
Two ADCs are contained in a small, space-saving,
10 mm × 10 mm × 1.4 mm, 144-ball CSP_BGA package.
Pin selectable noise shaping requantizer (NSR) function
that allows for improved SNR within a reduced bandwidth
of up to 60 MHz at 185 MSPS.
LVDS digital output interface configured for low cost
FPGA families.
120 mW per ADC core power consumption.
Operation from a single 1.8 V supply.
Standard serial port interface (SPI) that supports various
product features and functions, such as data formatting
(offset binary or twos complement), NSR, power-down,
test modes, and voltage reference mode.
On-chip integer 1-to-8 input clock divider and multichip
sync function to support a wide range of clocking schemes
and multichannel subsystems.
APPLICATIONS
Communications
Diversity radio and smart antenna (MIMO) systems
Multimode digital receivers (3G)
WCDMA, LTE, CDMA2000
WiMAX, TD-SCDMA
I/Q demodulation systems
General-purpose software radios
3.
4.
5.
6.
7.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2009–2010 Analog Devices, Inc. All rights reserved.
AD6642* PRODUCT PAGE QUICK LINKS
Last Content Update: 11/29/2017
COMPARABLE PARTS
View a parametric search of comparable parts.
TOOLS AND SIMULATIONS
Visual Analog
EVALUATION KITS
AD6642 Evaluation Board
DESIGN RESOURCES
AD6642 Material Declaration
PCN-PDN Information
Quality And Reliability
Symbols and Footprints
DOCUMENTATION
Application Notes
AN-1142: Techniques for High Speed ADC PCB Layout
AN-282: Fundamentals of Sampled Data Systems
AN-345: Grounding for Low-and-High-Frequency Circuits
AN-501: Aperture Uncertainty and ADC System
Performance
AN-586: LVDS Outputs for High Speed A/D Converters
AN-737: How ADIsimADC Models an ADC
AN-741: Little Known Characteristics of Phase Noise
AN-742: Frequency Domain Response of Switched-
Capacitor ADCs
AN-756: Sampled Systems and the Effects of Clock Phase
Noise and Jitter
AN-807: Multicarrier WCDMA Feasibility
AN-808: Multicarrier CDMA2000 Feasibility
AN-827: A Resonant Approach to Interfacing Amplifiers to
Switched-Capacitor ADCs
AN-835: Understanding High Speed ADC Testing and
Evaluation
AN-851: A WiMax Double Downconversion IF Sampling
Receiver Design
AN-878: High Speed ADC SPI Control Software
AN-905: Visual Analog Converter Evaluation Tool Version
1.0 User Manual
AN-935: Designing an ADC Transformer-Coupled Front
End
Data Sheet
AD6642: Dual IF Receiver Data Sheet
User Guides
UG-232: Evaluating the AD6642/AD6657 Analog-to-
Digital Converters
DISCUSSIONS
View all AD6642 EngineerZone Discussions.
SAMPLE AND BUY
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TECHNICAL SUPPORT
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number.
DOCUMENT FEEDBACK
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This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not
trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.
AD6642
TABLE OF CONTENTS
Features .............................................................................................. 1
 
Applications....................................................................................... 1
 
Functional Block Diagram .............................................................. 1
 
Product Highlights ........................................................................... 1
 
Revision History ............................................................................... 2
 
General Description ......................................................................... 3
 
Specifications..................................................................................... 4
 
DC Specifications ......................................................................... 4
 
AC Specifications.......................................................................... 5
 
Digital Specifications ................................................................... 6
 
Switching Specifications .............................................................. 7
 
Timing Specifications .................................................................. 8
 
Absolute Maximum Ratings............................................................ 9
 
Thermal Characteristics .............................................................. 9
 
ESD Caution.................................................................................. 9
 
Pin Configuration and Function Descriptions........................... 10
 
Typical Performance Characteristics ........................................... 12
 
Equivalent Circuits ......................................................................... 15
 
Theory of Operation ...................................................................... 16
 
ADC Architecture ...................................................................... 16
 
Analog Input Considerations.................................................... 16
 
Clock Input Considerations ...................................................... 18
 
Power Dissipation and Standby Mode .................................... 20
 
Channel/Chip Synchronization................................................ 20
 
Digital Outputs ........................................................................... 21
 
Timing ......................................................................................... 21
 
Noise Shaping Requantizer (NSR) ............................................... 22
 
22% BW Mode (>40 MHz @ 184.32 MSPS)........................... 22
 
33% BW Mode (>60 MHz @ 184.32 MSPS)........................... 22
 
MODE Pin................................................................................... 23
 
Built-In Self-Test (BIST) and Output Test .................................. 24
 
Built-In Self-Test (BIST)............................................................ 24
 
Output Test Modes..................................................................... 24
 
Serial Port Interface (SPI).............................................................. 25
 
Configuration Using the SPI..................................................... 25
 
Hardware Interface..................................................................... 25
 
Memory Map .................................................................................. 26
 
Reading the Memory Map Register Table............................... 26
 
Memory Map Register Table..................................................... 27
 
Memory Map Register Descriptions........................................ 29
 
Applications Information .............................................................. 30
 
Design Guidelines ...................................................................... 30
 
Outline Dimensions ....................................................................... 31
 
Ordering Guide .......................................................................... 31
 
REVISION HISTORY
7/10—Rev. 0 to Rev. A
Changes to ADC Architecture Section........................................ 16
Changes to Figure 34 and Figure 35............................................. 18
Changes to Timing Section and Data Clock Output (DCO)
Section.............................................................................................. 21
Changes to 22% BW Mode (>40 MHz @ 184.32 MSPS) Section
and 33% BW Mode (>60 MHz @ 184.32 MSPS)
Section
......... 22
Changes to Design Guidelines Section........................................ 30
10/09—Revision 0: Initial Version
Rev. A | Page 2 of 32
AD6642
GENERAL DESCRIPTION
The AD6642 is an 11-bit, 200 MSPS, dual-channel intermediate
frequency (IF) receiver specifically designed to support multi-
antenna systems in telecommunication applications where high
dynamic range performance, low power, and small size are desired.
The device consists of two high performance analog-to-digital
converters (ADCs) and noise shaping requantizer (NSR) digital
blocks. Each ADC consists of a multistage, differential pipelined
architecture with integrated output error correction logic. The
ADC features a wide bandwidth switched-capacitor sampling
network within the first stage of the differential pipeline. An
integrated voltage reference eases design considerations. A duty
cycle stabilizer (DCS) compensates for variations in the ADC
clock duty cycle, allowing the converters to maintain excellent
performance.
Each ADC output is connected internally to an NSR block. The
integrated NSR circuitry allows for improved SNR performance
in a smaller frequency band within the Nyquist bandwidth. The
device supports two different output modes selectable via the
external MODE pin or the SPI.
With the NSR feature enabled, the outputs of the ADCs are
processed such that the AD6642 supports enhanced SNR
performance within a limited portion of the Nyquist bandwidth
while maintaining an 11-bit output resolution. The NSR block
can be programmed to provide a bandwidth of either 22% or
33% of the sample clock. For example, with a sample clock rate
of 185 MSPS, the AD6642 can achieve up to 75.5 dBFS SNR for
a 40 MHz bandwidth in the 22% mode and up to 73.7 dBFS
SNR for a 60 MHz bandwidth in the 33% mode.
With the NSR block disabled, the ADC data is provided directly to
the output with a resolution of 11 bits. The AD6642 can achieve
up to 66.5 dBFS SNR for the entire Nyquist bandwidth when
operated in this mode. This allows the AD6642 to be used in
telecommunication applications such as a digital predistortion
observation path where wider bandwidths are desired.
After digital signal processing, multiplexed output data is
routed into two 11-bit output ports such that the maximum
data rate is 400 Mbps (DDR). These outputs are set at 1.8 V
LVDS and support ANSI-644 levels.
The AD6642 receiver digitizes a wide spectrum of IF frequencies.
Each receiver is designed for simultaneous reception of a separate
antenna. This IF sampling architecture greatly reduces compo-
nent cost and complexity compared with traditional analog
techniques or less integrated digital methods.
Flexible power-down options allow significant power savings.
Programming for device setup and control is accomplished
using a 3-wire SPI-compatible serial interface with numerous
modes to support board-level system testing.
The AD6642 is available in a Pb-free/RoHS compliant, 144-ball,
10 mm × 10 mm chip scale package ball grid array (CSP_BGA)
and is specified over the industrial temperature range of −40°C
to +85°C.
Rev. A | Page 3 of 32
AD6642
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, f
S
= 185 MSPS, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and default SPI, unless
otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error
Differential Nonlinearity (DNL)
1
Integral Nonlinearity (INL)
1
MATCHING CHARACTERISTIC
Offset Error
Gain Error
TEMPERATURE DRIFT
Offset Error
Gain Error
ANALOG INPUT
Input Range
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
2
POWER SUPPLIES
Supply Voltage
AVDD
DRVDD
Supply Current
I
AVDD1
I
DRVDD1
(1.8 V LVDS)
POWER CONSUMPTION
Sine Wave Input
1
Standby Power
3
Power-Down Power
1
2
Temperature
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Min
11
Typ
Max
Unit
Bits
−4.5
Guaranteed
2
±3
±0.1
±0.2
2.5
±1
2
40
7.4
±7
±0.5
±0.5
8.3
±3
mV
% FSR
LSB
LSB
mV
% FSR
ppm/°C
ppm/°C
−2.4
1.4
1.75
0.9
20
5
2.0
V p-p
V
pF
Full
Full
Full
Full
Full
Full
Full
1.7
1.7
1.8
1.8
265
79
619
83
4.5
1.9
1.9
291
89
684
18
V
V
mA
mA
mW
mW
mW
Measured with a 10 MHz, 0 dBFS sine wave, with 100 Ω termination on each LVDS output pair.
Input capacitance refers to the effective capacitance between one differential input pin and AGND.
3
Standby power is measured with a dc input and the CLKx pins inactive (set to AVDD or AGND).
Rev. A | Page 4 of 32

AD6642BBCZ Related Products

AD6642BBCZ AD6642BBCZRL
Description Dual IF Receiver TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA144, 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MO-205AC, CSPBGA-144
Is it lead-free? Contains lead Lead free
Is it Rohs certified? conform to conform to
Maker ADI ADI
Parts packaging code BGA BGA
package instruction LFBGA, BGA144,12X12,32 LFBGA, BGA144,12X12,32
Contacts 144 144
Reach Compliance Code compliant compliant
ECCN code 5A991.B 5A991.B
Samacsys Description Dual IF Receiver Dual IF Receiver
JESD-30 code S-PBGA-B144 S-PBGA-B144
JESD-609 code e1 e3
length 10 mm 10 mm
Humidity sensitivity level 3 1
Number of functions 1 1
Number of terminals 144 144
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA
Encapsulate equivalent code BGA144,12X12,32 BGA144,12X12,32
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 225
power supply 1.8 V 1.8 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm
Maximum slew rate 0.291 mA 0.291 mA
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER MATTE TIN
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 NOT SPECIFIED
width 10 mm 10 mm

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