8-Bit, High Speed, Multiplying D/A Converter
(Universal Digital Logic Interface)
DAC08
FEATURES
Fast settling output current: 85 ns
Full-scale current prematched to ±1 LSB
Direct interface to TTL, CMOS, ECL, HTL, PMOS
Nonlinearity to 0.1% maximum over temperature range
High output impedance and compliance: −10 V to +18 V
Complementary current outputs
Wide range multiplying capability: 1 MHz bandwidth
Low FS current drift: ±10 ppm/°C
Wide power supply range: ±4.5 V to ±18 V
Low power consumption: 33 mW @ ±5 V
Low cost
scale trimming in most applications. Direct interface to all
popular logic families with full noise immunity is provided by
the high swing, adjustable threshold logic input.
High voltage compliance complementary current outputs are
provided, increasing versatility and enabling differential
operation to effectively double the peak-to-peak output swing.
In many applications, the outputs can be directly converted to
voltage without the need for an external op amp. All DAC08
series models guarantee full 8-bit monotonicity, and nonlineari-
ties as tight as ±0.1% over the entire operating temperature
range are available. Device performance is essentially unchanged
over the ±4.5 V to ±18 V power supply range, with 33 mW
power consumption attainable at ±5 V supplies.
The compact size and low power consumption make the DAC08
attractive for portable and military/aerospace applications;
devices processed to MIL-STD-883, Level B are available.
DAC08 applications include 8-bit, 1 µs A/D converters, servo
motor and pen drivers, waveform generators, audio encoders
and attenuators, analog meter drivers, programmable power
supplies, LCD display drivers, high speed modems, and other
applications where low cost, high speed, and complete
input/output versatility are required.
GENERAL DESCRIPTION
The DAC08 series of 8-bit monolithic digital-to-analog convert-
ers provide very high speed performance coupled with low cost
and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very
low “glitch” energy and at low power consumption. Monotonic
multiplying performance is attained over a wide 20-to-1
reference current range. Matching to within 1 LSB between
reference and full-scale currents eliminates the need for full-
FUNCTIONAL BLOCK DIAGRAM
V+
13
V
LC
1
(MSB)
B1
5
B2
6
B3
7
B4
8
B5
9
B6
10
B7
11
(LSB)
B8
12
DAC08
BIAS
NETWORK
14
CURRENT
SWITCHES
4
2
I
OUT
V
REF
(+)
I
OUT
V
REF
(–)
15
REFERENCE
AMPLIFIER
00268-C-001
16
COMP
3
V–
Figure 1.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
DAC08
TABLE OF CONTENTS
Specifications..................................................................................... 3
Electrical Characteristics............................................................. 3
Typical Electrical Characteristics ............................................... 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Connections ............................................................................... 6
Test and Burn-In Circuits................................................................ 7
Typical Performance Characteristics ............................................. 8
Basic Connections .......................................................................... 11
Application Information................................................................ 13
Reference Amplifier Setup ........................................................ 13
Reference Amplifier Compensation for Multiplying
Applications ................................................................................ 13
Logic Inputs................................................................................. 13
Analog Output Currents ........................................................... 14
Power Supplies............................................................................ 14
Temperature Performance......................................................... 14
Multiplying Operation............................................................... 14
Settling Time............................................................................... 14
ADI Current Output DACs........................................................... 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 18
REVISION HISTORY
11/04—Rev. B to Rev. C
Changed SO to SOIC .........................................................Universal
Removed DIE ......................................................................Universal
Changes to Figure 30, Figure 31, Figure 32................................. 12
Change to Figure 33 ....................................................................... 15
Added Table 4.................................................................................. 16
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 18
2/02—Rev. A to Rev. B
Edits to SPECIFICATIONS............................................................. 2
Edits to ABSOLUTE MAXIMUM RATING ................................ 3
Edits to ORDERING GUIDE.......................................................... 3
Edits to WAFER TEST LIMITS ...................................................... 5
Edit to Figure 13 ............................................................................... 8
Edits to Figures 14 and 15 ............................................................... 9
Rev. C | Page 2 of 20
DAC08
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
V
S
= ±15 V, I
REF
= 2.0 mA, –55°C ≤ T
A
≤ +125°C for DAC08/DAC08A, 0°C ≤ T
A
≤ +70°C for DAC08E and DAC08H, −40°C to +85°C for
DAC08C, unless otherwise noted. Output characteristics refer to both I
OUT
and I
OUT
.
Table 1.
Parameter
Resolution
Monotonicity
Nonlinearity
Settling Time
Symbol
Conditions
DAC08A/DAC08H
Min Typ
Max
8
8
Min
8
8
DAC08E
Typ
Max
Min
8
8
DAC08C
Typ
Max
Unit
Bits
Bits
%FS
ns
NL
t
S
To ±1/2 LSB, all bits
switched on or off,
T
A
= 25°C
1
T
A
= 25°C
1
85
±0.1
135
85
±0.19
150
85
±0.39
150
Propagation Delay
Each Bit
All Bits Switched
Full-Scale Tempco
1
t
PLH
t
PHL
TCI
FS
35
35
±10
60
60
±50
35
35
±10
DAC08E
Output Voltage
Compliance
(True Compliance)
Full Range Current
Full Range Symmetry
Zero-Scale Current
Output Current
Range
V
OC
Full-scale current
Change <1/2 LSB, R
OUT
>
20 MΩ typ
V
REF
= 10.000 V R14, R15 =
5.000 kΩ T
A
= 25°C
I
FR4
− I
FR2
R14, R15 = 5.000 kΩ
V
REF
= +15.0 V,
V− = −10 V
V
REF
= +25.0 V,
V− = −12 V
I
REF
= 2 mA
60
60
±80
±50
35
35
±10
60
60
±80
ns
ns
ppm/°C
−10
1.984
1.992
±0.5
0.1
2.1
+18
2.000
±4
1
−10
1.94
1.99
±1
0.2
2.1
+18
2.04
±8
2
–10
1.94
1.99
±2
0.2
2.1
+18
2.04
±16
4
V
mA
µA
µA
mA
I
FR4
I
FRS
I
ZS
I
OR1
I
OR2
4.2
25
4.2
25
4.2
25
mA
nA
Output Current
Noise
Logic Input Levels
Logic 0
Logic 1
Logic Input Current
Logic 0
Logic 1
Logic Input Swing
Logic Threshold
Range
Reference Bias
Current
Reference Input
Slew Rate
Power Supply
Sensitivity
V
IL
V
IL
I
IL
I
IH
V
IS
V
THR
I
15
dI/dt
V
LC
= 0 V
2
V
LC
= 0 V
V
IN
= −10 V to +0.8 V
V
IN
= 2.0 V to 18 V
V− = −15 V
V
S
= ±15 V
1
0.8
2
−2
0.002
−10
−10
−1
−10
10
+18
+13.5
−3
4
−2
0.002
−10
−10
−1
8
0.8
2
−10
10
+18
+13.5
−3
4
−2
0.002
−10
−10
−1
8
0.8
V
V
µA
µA
V
V
µA
mA/µs
−10
10
+18
+13.5
−3
PSSI
FS+
PSSI
FS–
R
EQ
= 200 Ω
R
L
= 100 Ω
C
C
= 0 pF. See Figure 7.
1
V+ = 4.5 V to 18 V
V− = −4.5 V to −18 V
I
REF
= 1.0 mA
4
8
±0.0003
±0.002
±0.01
±0.01
±0.0003
±0.002
±0.01
±0.01
±0.0003
±0.002
±0.01
±0.01
%∆I
O
/%∆V+
%∆I
O
/%∆V−
Rev. C | Page 3 of 20
DAC08
Parameter
Power Supply Current
Symbol
I+
I−
I+
I−
I+
I−
P
D
Conditions
V
S
= ±5 V, I
REF
= 1.0 mA
V
S
= +5 V, −15 V,
I
REF
= 2.0 mA
V
S
= ±15 V,
I
REF
= 2.0 mA
±5 V, I
REF
= 1.0 mA +5 V,
−15 V,
I
REF
= 2.0 mA ±15 V, I
REF
=
2.0 mA
DAC08A/DAC08H
Min Typ
Max
2.3
−4.3
2.4
−6.4
2.5
−6.5
33
108
135
3.8
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
Min
DAC08E
Typ
Max
2.3
−4.3
2.4
−6.4
2.5
−6.5
33
103
135
3.8
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
Min
DAC08C
Typ
Max
2.3
−4.3
2.4
−6.4
2.5
−6.5
33
108
135
3.8
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
Unit
mA
mA
mA
mA
mA
mA
mW
mW
mW
Power Dissipation
1
Guaranteed by design.
TYPICAL ELECTRICAL CHARACTERISTICS
V
S
= ±15 V, and I
REF
= 2.0 mA, unless otherwise noted. Output characteristics apply to both I
OUT
and I
OUT
.
Table 2.
Parameter
Reference Input Slew Rate
Propagation Delay
Settling Time
Symbol
dI/dt
t
PLH
, t
PHL
t
S
Conditions
T
A
= 25°C, any bit
To ±1/2 LSB, all bits switched on or
off, T
A
= 25°C
All Grades Typical
8
35
85
Unit
mA/µs
ns
ns
Rev. C | Page 4 of 20
DAC08
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Operating Temperature
DAC08AQ, DAC08Q
DAC08HQ, DAC08EQ, DAC08CQ,
DAC08HP, DAC08EP
DAC08CP, DAC08CS
Junction Temperature (T
J
)
Storage Temperature Q Package
Storage Temperature P Package
Lead Temperature (Soldering, 60 sec)
V+ Supply to V− Supply
Logic Inputs
V
LC
Analog Current Outputs (at V
S−
= 15 V)
Reference Input (V
14
to V
15
)
Reference Input Differential Voltage
(V
14
to V
15
)
Reference Input Current (I
14
)
Rating
−55°C to +125°C
0°C to +70°C
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
−65°C to +125°C
300°C
36 V
V− to V− + 36 V
V− to V+
4.25 mA
V− to V+
±18 V
5.0 mA
Package Type
16-Lead CERDIP (Q)
16-Lead PDIP (P)
20-Terminal LCC (RC)
16-Lead SOIC (S)
θ
JA1
100
82
76
111
θ
JC
16
39
36
35
Unit
°C/W
°C/W
°C/W
°C/W
1
θ
JA
is specified for worst-case mounting conditions, that is,
θ
JA
is specified for
device in socket for CERDIP, PDIP, and LCC packages;
θ
JA
is specified for
device soldered to printed circuit board for SOIC package.
Stresses greater than those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 20
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