IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18, Digital to Analog Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Parts packaging code | DIP |
| package instruction | HERMETIC SEALED, CERAMIC, DIP-18 |
| Contacts | 18 |
| Reach Compliance Code | unknown |
| Maximum analog output voltage | 10 V |
| Minimum analog output voltage | -10 V |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | R-GDIP-T18 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.05% |
| Nominal negative supply voltage | -15 V |
| Number of digits | 11 |
| Number of functions | 1 |
| Number of terminals | 18 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Nominal settling time (tstl) | 1.5 µs |
| Maximum slew rate | 12 mA |
| Nominal supply voltage | 15 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| DAC210FX | DAC210GR | DAC210N | DAC210EX | DAC210GX | DAC210G | |
|---|---|---|---|---|---|---|
| Description | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, UUC18, 0.118 X 0.087 INCH, DIE-18, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, UUC18, 0.118 X 0.087 INCH, DIE-18, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 11-BIT DAC, UUC18, 0.118 X 0.087 INCH, DIE-18, Digital to Analog Converter |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | ADI | ADI | ADI | ADI | ADI | ADI |
| Parts packaging code | DIP | DIE | DIE | DIP | DIP | DIE |
| package instruction | HERMETIC SEALED, CERAMIC, DIP-18 | 0.118 X 0.087 INCH, DIE-18 | 0.118 X 0.087 INCH, DIE-18 | HERMETIC SEALED, CERAMIC, DIP-18 | HERMETIC SEALED, CERAMIC, DIP-18 | 0.118 X 0.087 INCH, DIE-18 |
| Contacts | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | compliant |
| Maximum analog output voltage | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| Minimum analog output voltage | -10 V | -10 V | -10 V | -10 V | -10 V | -10 V |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | R-GDIP-T18 | R-XUUC-N18 | R-XUUC-N18 | R-GDIP-T18 | R-GDIP-T18 | R-XUUC-N18 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.05% | 0.2% | 0.05% | 0.05% | 0.1% | 0.1% |
| Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of digits | 11 | 11 | 11 | 11 | 11 | 11 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| encapsulated code | DIP | DIE | DIE | DIP | DIP | DIE |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | UNCASED CHIP | UNCASED CHIP | IN-LINE | IN-LINE | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal settling time (tstl) | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
| Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | YES | NO | NO | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | UPPER | UPPER | DUAL | DUAL | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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