Microprocessor, 8-Bit, 4MHz, MOS, CQCC44, CERAMIC, LCC-44
| Parameter Name | Attribute value |
| Maker | Zilog, Inc. |
| Parts packaging code | LCC |
| package instruction | QCCN, |
| Contacts | 44 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Other features | 3 MODES OF MASKABLE INTERRUPTS |
| Address bus width | 16 |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 4 MHz |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-CQCC-N44 |
| length | 16.51 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 2 |
| Number of serial I/Os | |
| Number of terminals | 44 |
| On-chip data RAM width | |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 2.286 mm |
| speed | 4 MHz |
| Maximum slew rate | 200 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 16.51 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |





| Z8400ALMBC | Z8400ALM | Z8400LMBC | Z8400CMJ | Z8400ACMBC | Z8400CMBC | Z8400LM | Z8400ACMJ | |
|---|---|---|---|---|---|---|---|---|
| Description | Microprocessor, 8-Bit, 4MHz, MOS, CQCC44, CERAMIC, LCC-44 | Microprocessor, 8-Bit, 4MHz, MOS, CQCC44, CERAMIC, LCC-44 | Microprocessor, 8-Bit, 2.5MHz, MOS, CQCC44, CERAMIC, LCC-44 | Microprocessor, 8-Bit, 2.5MHz, MOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 4MHz, MOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 2.5MHz, MOS, CDIP40, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 2.5MHz, MOS, CQCC44, CERAMIC, LCC-44 | Microprocessor, 8-Bit, 4MHz, MOS, CDIP40, CERAMIC, DIP-40 |
| Maker | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. |
| Parts packaging code | LCC | LCC | LCC | DIP | DIP | DIP | LCC | DIP |
| package instruction | QCCN, | QCCN, LCC44,.65SQ | QCCN, | DIP, | DIP, | DIP, | QCCN, LCC44,.65SQ | DIP, |
| Contacts | 44 | 44 | 44 | 40 | 40 | 40 | 44 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Other features | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS | 3 MODES OF MASKABLE INTERRUPTS |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| boundary scan | NO | NO | NO | NO | NO | NO | NO | NO |
| maximum clock frequency | 4 MHz | 4 MHz | 2.5 MHz | 2.5 MHz | 4 MHz | 2.5 MHz | 2.5 MHz | 4 MHz |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | S-CQCC-N44 | R-CDIP-T40 |
| low power mode | YES | YES | YES | YES | YES | YES | YES | YES |
| Number of external interrupt devices | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 44 | 44 | 44 | 40 | 40 | 40 | 44 | 40 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN | QCCN | QCCN | DIP | DIP | DIP | QCCN | DIP |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 2.286 mm | 2.286 mm | 4.699 mm | 4.699 mm | 4.699 mm | 2.286 mm | 4.699 mm |
| speed | 4 MHz | 4 MHz | 2.5 MHz | 2.5 MHz | 4 MHz | 2.5 MHz | 2.5 MHz | 4 MHz |
| Maximum slew rate | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | NO | YES | NO |
| technology | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| width | 16.51 mm | 16.51 mm | 16.51 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.51 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |