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M58LW032A110ZA6

Description
2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64
Categorystorage    storage   
File Size856KB,61 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M58LW032A110ZA6 Overview

2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64

M58LW032A110ZA6 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction10 X 13 MM, 1 MM PITCH, TBGA-64
Contacts64
Reach Compliance Codenot_compliant
ECCN code3A991.B.1.A
Maximum access time110 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
command user interfaceYES
Universal Flash InterfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B64
JESD-609 codee0
length13 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size64
Number of terminals64
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
page size4 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/3.3,3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size32K
Maximum standby current0.00004 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width10 mm
M58LW032A
32 Mbit (2Mb x16, Uniform Block, Burst)
3V Supply Flash Memory
FEATURES SUMMARY
s
WIDE x16 DATA BUS for HIGH BANDWIDTH
s
Figure 1. Packages
SUPPLY VOLTAGE
– V
DD
= 2.7 to 3.6V core supply voltage for Pro-
gram, Erase and Read operations
– V
DDQ
= 1.8V to V
DD
for I/O Buffers
s
SYNCHRONOUS/ASYNCHRONOUS READ
– Synchronous Burst read
– Asynchronous Random Read
– Asynchronous Address Latch Controlled
Read
– Page Read
TSOP56 (N)
14 x 20 mm
s
ACCESS TIME
– Synchronous Burst Read up to 56MHz
– Asynchronous Page Mode Read 90/25ns and
110/25ns
– Random Read 90ns, 110ns.
TBGA
TBGA64 (ZA)
10 x 13 mm
s
PROGRAMMING TIME
– 16 Word Write Buffer
– 18µs Word effective programming time
s
s
s
s
s
s
64 UNIFORM 32 KWord MEMORY BLOCKS
BLOCK PROTECTION/ UNPROTECTION
PROGRAM and ERASE SUSPEND
128 bit PROTECTION REGISTER
COMMON FLASH INTERFACE
100, 000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
– Device Code M58LW032A: 8816h
s
February 2003
1/61

M58LW032A110ZA6 Related Products

M58LW032A110ZA6 M58LW032A90N6 M58LW032A90ZA1 M58LW032A90ZA6 M58LW032A110N6 M58LW032A110ZA1 M58LW032A110N1 M58LW032A90N1
Description 2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 90ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 110ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 110ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 90ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code BGA TSOP BGA BGA TSOP BGA TSOP TSOP
package instruction 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 10 X 13 MM, 1 MM PITCH, TBGA-64 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 14 X 20 MM, PLASTIC, TSOP-56
Contacts 64 56 64 64 56 64 56 56
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 110 ns 90 ns 90 ns 90 ns 110 ns 110 ns 110 ns 90 ns
Other features SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
command user interface YES YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES YES
Data polling NO NO NO NO NO NO NO NO
JESD-30 code R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PDSO-G56 R-PDSO-G56
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 13 mm 18.4 mm 13 mm 13 mm 18.4 mm 13 mm 18.4 mm 18.4 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1
Number of departments/size 64 64 64 64 64 64 64 64
Number of terminals 64 56 64 64 56 64 56 56
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 70 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TSOP1 TBGA TBGA TSOP1 TBGA TSOP1 TSOP1
Encapsulate equivalent code BGA64,8X8,40 TSSOP56,.8,20 BGA64,8X8,40 BGA64,8X8,40 TSSOP56,.8,20 BGA64,8X8,40 TSSOP56,.8,20 TSSOP56,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
page size 4 words 4 words 4 words 4 words 4 words 4 words 4 words 4 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size 32K 32K 32K 32K 32K 32K 32K 32K
Maximum standby current 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL GULL WING BALL BALL GULL WING BALL GULL WING GULL WING
Terminal pitch 1 mm 0.5 mm 1 mm 1 mm 0.5 mm 1 mm 0.5 mm 0.5 mm
Terminal location BOTTOM DUAL BOTTOM BOTTOM DUAL BOTTOM DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit NO NO NO NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 10 mm 14 mm 10 mm 10 mm 14 mm 10 mm 14 mm 14 mm
Is Samacsys - N N N N N N -
Base Number Matches - 1 1 1 1 1 1 -
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