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M58CR064C200ZB6

Description
Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56
Categorystorage    storage   
File Size380KB,61 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Download Datasheet Parametric Compare View All

M58CR064C200ZB6 Overview

Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56

M58CR064C200ZB6 Parametric

Parameter NameAttribute value
MakerNumonyx ( Micron )
Parts packaging codeBGA
package instruction0.75 MM PITCH, TFBGA-56
Contacts56
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time200 ns
startup blockTOP
JESD-30 codeR-PBGA-B56
length10 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals56
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
typeNOR TYPE
width6.5 mm
M58CR064C
M58CR064D
64 Mbit (4Mb x 16, Dual Bank, Burst )
1.8V Supply Flash Memory
PRODUCT PREVIEW
FEATURES SUMMARY
s
SUPPLY VOLTAGE
– V
DD
= 1.65V to 2V for Program, Erase and
Read
– V
DDQ
= 1.65V to 3.3V for I/O Buffers
– V
PP
= 12V for fast Program (optional)
s
Figure 1. Packages
SYNCHRONOUS / ASYNCHRONOUS READ
– Burst mode Read: 54MHz
– Page mode Read (4 Words Page)
– Random Access: 100, 120 ns
FBGA
s
PROGRAMMING TIME
– 10µs by Word typical
– Double/Quadruple Word programming option
TFBGA56 (ZB)
8 x 7 ball array
s
MEMORY BLOCKS
– Dual Bank Memory Array: 16/48 Mbit
– Parameter Blocks (Top or Bottom location)
s
DUAL OPERATIONS
– Read in one Bank while Program or Erase in
other
– No delay between Read and Write operations
s
BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WP for Block Lock-Down
s
SECURITY
– 64 bit user programmable OTP cells
– 64 bit unique device identifier
– One parameter block permanently lockable
s
s
COMMON FLASH INTERFACE (CFI)
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M58CR064C: 88CAh
– Bottom Device Code, M58CR064D: 88CBh
s
July 2001
This is preliminary information on a new product now in development. Details are subject to change without notice.
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M58CR064C200ZB6 Related Products

M58CR064C200ZB6 M58CR064D200ZB6 M58CR064D200ZB6T M58CR064C200ZB6T
Description Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56 Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56 Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56 Flash, 4MX16, 200ns, PBGA56, 0.75 MM PITCH, TFBGA-56
Maker Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code BGA BGA BGA BGA
package instruction 0.75 MM PITCH, TFBGA-56 0.75 MM PITCH, TFBGA-56 0.75 MM PITCH, TFBGA-56 0.75 MM PITCH, TFBGA-56
Contacts 56 56 56 56
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 200 ns 200 ns 200 ns 200 ns
startup block TOP BOTTOM BOTTOM TOP
JESD-30 code R-PBGA-B56 R-PBGA-B56 R-PBGA-B56 R-PBGA-B56
length 10 mm 10 mm 10 mm 10 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 16 16 16 16
Number of functions 1 1 1 1
Number of terminals 56 56 56 56
word count 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 2 V 2 V 2 V 2 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 0.75 mm 0.75 mm 0.75 mm 0.75 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 6.5 mm 6.5 mm 6.5 mm 6.5 mm
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