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TC86R4400YS-S7G

Description
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,32 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC86R4400YS-S7G Overview

IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor

TC86R4400YS-S7G Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codePGA
package instructionHIPGA,
Contacts447
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresMMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES
Address bus width64
bit size64
boundary scanYES
maximum clock frequency75 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheNO
JESD-30 codeS-CPGA-P447
JESD-609 codee0
length52.32 mm
low power modeYES
Number of DMA channels
Number of external interrupt devices2
Number of serial I/Os
Number of terminals447
On-chip data RAM width
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeHIPGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
RAM (number of words)0
Maximum seat height6.24 mm
speed75 MHz
Maximum slew rate3000 mA
Maximum supply voltage3.6 V
Minimum supply voltage3.3 V
Nominal supply voltage3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width52.32 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

TC86R4400YS-S7G Related Products

TC86R4400YS-S7G TC86R4400Y-MAH TC86R4400YS-M7G TC86R4400Y-PAH TC86R4400Y-P7G TC86R4400Y-M7G TC86R4400Y-S7G TC86R4400Y-SAH TC86R4400YS-SAH TC86R4400YS-MAH
Description IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA179, Microprocessor IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA179, Microprocessor IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction HIPGA, HIPGA, HIPGA, PGA, PGA, HIPGA, HIPGA, HIPGA, HIPGA, HEAT SINK, PGA-447
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
Other features MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES
Address bus width 64 64 64 64 64 64 64 64 64 64
bit size 64 64 64 64 64 64 64 64 64 64
boundary scan YES YES YES YES YES YES YES YES YES YES
maximum clock frequency 75 MHz 100 MHz 75 MHz 100 MHz 75 MHz 75 MHz 75 MHz 100 MHz 100 MHz 100 MHz
External data bus width 64 64 64 64 64 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache NO NO NO NO NO NO NO NO NO NO
JESD-30 code S-CPGA-P447 S-CPGA-P447 S-CPGA-P447 S-CPGA-P179 S-CPGA-P179 S-CPGA-P447 S-CPGA-P447 S-CPGA-P447 S-CPGA-P447 S-CPGA-P447
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 52.32 mm 52.32 mm 52.32 mm 47.24 mm 47.24 mm 52.32 mm 52.32 mm 52.32 mm 52.32 mm 52.32 mm
low power mode YES YES YES YES YES YES YES YES YES YES
Number of external interrupt devices 2 2 2 7 7 2 2 2 2 2
Number of terminals 447 447 447 179 179 447 447 447 447 447
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code HIPGA HIPGA HIPGA PGA PGA HIPGA HIPGA HIPGA HIPGA HIPGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY GRID ARRAY GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 6.24 mm 6.24 mm 6.24 mm 4.52 mm 4.52 mm 6.24 mm 6.24 mm 6.24 mm 6.24 mm 6.24 mm
speed 75 MHz 100 MHz 75 MHz 100 MHz 75 MHz 75 MHz 75 MHz 100 MHz 100 MHz 100 MHz
Maximum supply voltage 3.6 V 3.62 V 3.6 V 3.62 V 3.6 V 3.6 V 3.6 V 3.62 V 3.62 V 3.62 V
Minimum supply voltage 3.3 V 3.28 V 3.3 V 3.28 V 3.3 V 3.3 V 3.3 V 3.28 V 3.28 V 3.28 V
Nominal supply voltage 3.3 V 3.45 V 3.3 V 3.45 V 3.3 V 3.3 V 3.3 V 3.45 V 3.45 V 3.45 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD
Terminal form PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 52.32 mm 52.32 mm 52.32 mm 47.24 mm 47.24 mm 52.32 mm 52.32 mm 52.32 mm 52.32 mm 52.32 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker Toshiba Semiconductor - - - - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code PGA PGA PGA - - PGA PGA PGA PGA PGA
Contacts 447 447 447 - - 447 447 447 447 447
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 -
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