200mA, 25V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Diodes Incorporated |
| package instruction | IN-LINE, R-PSIP-W3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | LOW NOISE |
| Maximum collector current (IC) | 0.2 A |
| Collector-emitter maximum voltage | 25 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 100 |
| JESD-30 code | R-PSIP-W3 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 200 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 235 |
| Polarity/channel type | PNP |
| Certification status | Not Qualified |
| Guideline | CECC |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | AMPLIFIER |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 250 MHz |
| VCEsat-Max | 0.5 V |
| BCY72P | BCY70P | BCY77P | BC560P | BC416P | BCY78P | ZTX214 | BC415P | |
|---|---|---|---|---|---|---|---|---|
| Description | 200mA, 25V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 200mA, 40V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 100mA, 60V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 200mA, 45V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 100mA, 45V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 200mA, 32V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 200mA, 30V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 | 100mA, 30V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92 STYLE, E-LINE PACKAGE-3 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 | IN-LINE, R-PSIP-W3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE |
| Maximum collector current (IC) | 0.2 A | 0.2 A | 0.1 A | 0.2 A | 0.1 A | 0.2 A | 0.2 A | 0.1 A |
| Collector-emitter maximum voltage | 25 V | 40 V | 60 V | 45 V | 45 V | 32 V | 30 V | 30 V |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Minimum DC current gain (hFE) | 100 | 100 | 120 | 110 | 110 | 120 | 140 | 110 |
| JESD-30 code | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 | R-PSIP-W3 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 235 | 235 | 235 | 235 | 235 | 235 | 235 | 235 |
| Polarity/channel type | PNP | PNP | PNP | PNP | PNP | PNP | PNP | PNP |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | AMPLIFIER | AMPLIFIER | SWITCHING | AMPLIFIER | AMPLIFIER | SWITCHING | AMPLIFIER | AMPLIFIER |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Nominal transition frequency (fT) | 250 MHz | 250 MHz | 180 MHz | 300 MHz | 200 MHz | 180 MHz | 200 MHz | 200 MHz |
| VCEsat-Max | 0.5 V | 0.5 V | 0.25 V | 0.25 V | 0.3 V | 0.25 V | 0.25 V | 0.3 V |
| Maker | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated | - | - | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated |
| Guideline | CECC | CECC | CECC | CECC | CECC | CECC | - | CECC |
| Maximum power dissipation(Abs) | - | - | 0.4 W | 0.5 W | 0.3 W | 0.4 W | 0.5 W | 0.3 W |