Table of Contents
1. Overview of the Evaluation Board (EVB) ................................................................................. 3
2. Key Features ............................................................................................................................... 5
3. Specifications ............................................................................................................................. 6
3.1. Safety Precautions ***** WARNING ***** .................................................................7
3.2. Test Configuration #1 .......................................................................................................9
3.3. Test Configuration #2 .....................................................................................................10
3.4. Test Configuration #3 .....................................................................................................11
4. External Connections ............................................................................................................... 12
5. Schematics ................................................................................................................................ 13
6. PCB and Assembly Images ...................................................................................................... 19
7. Bill of Materials........................................................................................................................ 22
8. Key Parameter Design .............................................................................................................. 24
8.1. Current-Sensing Circuit ..................................................................................................24
8.2. Short Circuit Protection(SCP) Circuit ............................................................................25
9. V
BUS
Sense Circuit.................................................................................................................... 26
10. Test Waveforms ...................................................................................................................... 26
10.1. Bulk Capacitor Ripple Current .......................................................................................26
10.2. NTC Temperature ...........................................................................................................27
11. References ............................................................................................................................... 27
12. Revision History ..................................................................................................................... 28
© 2012 Fairchild Semiconductor Corporation
2
FEBSPM3SPM45_M01MTCA • Rev. 1.0.1
This user guide supports the SPM3V2_V4 / SPM45H evaluation board, identifiable by
the marking FEBSPM3SPM45_M01MTCA on the topside of the PCB. It should be used
in conjunction with SPM3V2_V4 / SPM45H product datasheets, as well as Fairchild
Semiconductor’s application notes and technical support team available through the
website at
http://www.fairchildsemi.com.
1. Overview of the Evaluation Board
This motion Smart Power Module (SPM®) evaluation board is designed to evaluate
Fairchild Semiconductor’s SPM3V2_V4 and SPM45H SPM families of parts. The motion
SPM is installed as the motor power module on the evaluation board to drive a three-phase
AC Induction Motor (ACIM), Brushless DC (BLDC) motor, Brushless AC (BLAC)
motor, or Permanent-Magnet Synchronous Motor (PMSM). A Switched-Mode Power
Supply (SMPS) is integrated into the design, along with the necessary bulk capacitors and
microcontroller (MCU) interface circuitry. This allows evaluation of Fairchild’s motion
SPM products with a minimum investment of time, expense, and peripheral equipment. As
this board is designed for a wide variety of motor types, not all included circuitry is
required for all types of motors. Some motor types may require some additional circuitry be
added, depending on the control algorithms being implemented.
By default, the FNB41560 (600 V/15 A SPM45H) is installed as the motor power
module, as shown in Figure 9. It is possible to replace the provided SPM45H module
with a part from the SPM3_V2 family (i.e. FSBB30CH60, 600 V/30 A) per Figure 10 or
the SPM3_V4 family (i.e. FSBB30CH60C, 600 V/30 A) per Figure 11. Depending on the
power level of the device, some additional discrete component value changes may be
required. The most common reason to consider a SPM3V2_V4 device over the SPM45H
family is to increase motor power level.
The evaluation board is designed to connect to either AC or DC power sources feeding
current to the motor. There are three example test configurations in Section 3. The three-
phase motor output terminals (U, V, W) from the SPM should be connected to the motor
windings. Three bootstrap power supply circuits are designed into the evaluation board,
one per phase. A bootstrap capacitor, charge resistor for charging the capacitor, and the
blocking diode for high-voltage isolation make up each bootstrap supply. With SPM45H
and SPM3_V4 modules, R50-55 and D5-7 are not required. These extra bootstrap
positions are provided for compatibility with SPM3_V2 modules.
The microcontroller (MCU) or motion-controller development board connects to this
SPM board via the provided connector. Six low-pass filters are used between the signal
input connector and the gate input signal pins of the FNB41560. Short-circuit current
protection is provided by a single shunt resistor, op amp, and low-pass filter. Additional
circuitry is included to monitor bus voltage, inverter phase current, and module
temperature. This evaluation board is designed to support a wide array of test conditions
and requirements.
© 2012 Fairchild Semiconductor Corporation
3
FEBSPM3SPM45_M01MTCA • Rev. 1.0.1
2. Key Features
AC Line Input Connection
On-Board Bulk Capacitors
Bulk Capacitor Charge Indicator
On-Board High-Voltage SMPS
-
+
15.75 V
DC
,
+
5 V
DC
,
+
3.3 V
DC
Outputs
Short-Circuit Current Protection
Triple Open-Emitter Connections to Negative DC Link
MCU Interface Connections
-
3 High-Side, 3 Low-Side Gate Drive Inputs
-
Fault Output
-
Bus Voltage Sense Output
-
3-Phase Current Sensing, Amplified
NTC Output Signal (when applicable)
Current Sense Resistors (when applicable)
1
J1
2
3
4
J2
1
UH
2
VH
VIU
VIV
VIW
GND
3
WH
Over- Current Sense
4
UL
UH
3
P
5
VL
A
B
C
VH
WH
SPM Module
6
WL
UL
VL
WL
4
U
7
Fo
5
V
8
Rth
6
W
9
Vfo
A
10
+5V
Fo
11
+3.3V
Rth
Vfo
12
GND
7
8
9
B
C
Shunt
N
Resistors
13
+15.75V
+5v
+3.3V
Bridge Rectifier
SMPS
+15.75V
GND
L
N
Bulk Capacitors
N
P
14
n/c
J4
1
Vbus_sense
2
GND
J3
1
3
Figure 3.
Block Diagram
© 2012 Fairchild Semiconductor Corporation
5
FEBSPM3SPM45_M01MTCA • Rev. 1.0.1
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