IS63WV1024LL-20T datasheet, PDF

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IS63WV1024LL-20T: DescriptionStandard SRAM, 128KX8, 20ns, CMOS, PDSO32, PLASTIC, TSOP2-32; Categorystorage storage; File Size105KB，14 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS63WV1024LL-20T Overview

Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, PLASTIC, TSOP2-32

IS63WV1024LL-20T Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP2
package instruction	PLASTIC, TSOP2-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	20 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.95 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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IS63WV1024LL

128K x 8 HIGH-SPEED CMOS STATIC RAM

ISSI

DESCRIPTION

PRELIMINARY INFORMATION

APRIL 2003

FEATURES

• High-speed access time: 20ns

• High-performance, low-power CMOS process

• Multiple center power and ground pins for

greater noise immunity

• Easy memory expansion with

and

options

•

power-down

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Single 2.5V-3.6V V

power supply

• Packages available:

– 32-pin TSOP (Type II)

– 32-pin sTSOP (Type I)

– 36-Ball miniBGA (6mm x 8mm)

– 44-pin TSOP (Type II)

The

ISSI

IS63WV1024LL is a very high-speed, low

power, 131,072-word by 8-bit CMOS static RAM. The

IS63WV1024LL is fabricated using

ISSI

high-performance CMOS technology. This highly reliable

process coupled with innovative circuit design

techniques, yields higher performance and low power

consumption devices.

When

is HIGH (deselected), the device assumes a

standby mode at which the power dissipation can be

reduced down to 250 µW (typical) with CMOS input

levels.

The IS63WV1024LL operates from a single V

power

supply. The IS63WV1024LL is available in 32-pin TSOP

(Type II), 32-pin sTSOP (Type I), 36-Ball miniBGA (6mm

x 8mm), and 44-pin TSOP (Type II) packages.

FUNCTIONAL BLOCK DIAGRAM

A0-A16

DECODER

128K X 8

MEMORY ARRAY

VDD

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. — www.issi.com —

1-800-379-4774

Rev. 00A

04/23/03

IS63WV1024LL-20T Related Products

	IS63WV1024LL-20T	IS63WV1024LL-20B	IS63WV1024LL-20H	IS63WV1024LL-20T2I	IS63WV1024LL-20T2
Description	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, PLASTIC, TSOP2-32	Standard SRAM, 128KX8, 20ns, CMOS, PBGA36, 6 X 8 MM, MINI, BGA-36	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP1-32	Standard SRAM, 128KX8, 20ns, CMOS, PDSO44, PLASTIC, TSOP2-44	Standard SRAM, 128KX8, 20ns, CMOS, PDSO44, PLASTIC, TSOP2-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP2	BGA	TSOP1	TSOP2	TSOP2
package instruction	PLASTIC, TSOP2-32	6 X 8 MM, MINI, BGA-36	8 X 13.40 MM, PLASTIC, STSOP1-32	PLASTIC, TSOP2-44	PLASTIC, TSOP2-44
Contacts	32	36	32	44	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compli
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	20 ns	20 ns	20 ns	20 ns	20 ns
JESD-30 code	R-PDSO-G32	R-PBGA-B36	R-PDSO-G32	R-PDSO-G44	R-PDSO-G44
JESD-609 code	e0	e0	e0	e0	e0
length	20.95 mm	8 mm	11.8 mm	18.415 mm	18.415 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8
Humidity sensitivity level	3	3	3	3	3
Number of functions	1	1	1	1	1
Number of terminals	32	36	32	44	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TFBGA	LSSOP	TSOP2	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.25 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	BALL	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.75 mm	0.5 mm	0.8 mm	0.8 mm
Terminal location	DUAL	BOTTOM	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	6 mm	8 mm	10.16 mm	10.16 mm

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