5962-01-067-4972 datasheet, PDF

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5962-01-067-4972: DescriptionIC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC; Categorylogic logic; File Size133KB，3 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-067-4972 Overview

IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC

5962-01-067-4972 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T14
Logic integrated circuit type	BUS DRIVER
Number of digits	4
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output polarity	INVERTED
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC	Heat Sink Assembly	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC	HD1-6600-5	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,TTL,DIP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	-	DIP, DIP14,.3	DIP, DIP14,.3	-	-	DIP, DIP14,.3
Reach Compliance Code	not_compliant	_compli	-	not_compliant	not_compliant	not_compliant	_compli	_compli
JESD-30 code	R-XDIP-T14	R-XDIP-T14	-	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Number of digits	4	4	-	4	4	4	4	4
Number of functions	1	1	-	1	1	1	1	1
Number of terminals	14	14	-	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	-	125 °C	125 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-55 °C	-55 °C	-	-55 °C	-55 °C
Output polarity	INVERTED	INVERTED	-	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
Package body material	CERAMIC	CERAMIC	-	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	-	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	-	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class B (Modified)	-
surface mount	NO	NO	-	NO	NO	NO	NO	NO
technology	TTL	TTL	-	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	-	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL

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