|
L10C23KC20 |
L10C23KC50 |
L10C23KMB35 |
L10C23KMB60 |
| Description |
Correlator, 1-Bit, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 |
Correlator, 1-Bit, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 |
Correlator, 1-Bit, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 |
Correlator, 1-Bit, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
QLCC |
QLCC |
QLCC |
QLCC |
| package instruction |
QCCN, LCC28,.45SQ |
QCCN, LCC28,.45SQ |
QCCN, LCC28,.45SQ |
QCCN, LCC28,.45SQ |
| Contacts |
28 |
28 |
28 |
28 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
| Other features |
SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
| boundary scan |
NO |
NO |
NO |
NO |
| maximum clock frequency |
50 MHz |
20 MHz |
30.3 MHz |
17.2 MHz |
| External data bus width |
1 |
1 |
1 |
1 |
| JESD-30 code |
S-CQCC-N28 |
S-CQCC-N28 |
S-CQCC-N28 |
S-CQCC-N28 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| length |
11.4935 mm |
11.4935 mm |
11.4935 mm |
11.4935 mm |
| low power mode |
NO |
NO |
NO |
NO |
| Humidity sensitivity level |
3 |
3 |
3 |
3 |
| Number of terminals |
28 |
28 |
28 |
28 |
| Maximum operating temperature |
70 °C |
70 °C |
125 °C |
125 °C |
| Output data bus width |
7 |
7 |
7 |
7 |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QCCN |
QCCN |
QCCN |
QCCN |
| Encapsulate equivalent code |
LCC28,.45SQ |
LCC28,.45SQ |
LCC28,.45SQ |
LCC28,.45SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
225 |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Maximum slew rate |
100 mA |
100 mA |
100 mA |
100 mA |
| Maximum supply voltage |
5.25 V |
5.25 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.75 V |
4.75 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
11.4935 mm |
11.4935 mm |
11.4935 mm |
11.4935 mm |
| uPs/uCs/peripheral integrated circuit type |
DSP PERIPHERAL, CORRELATOR |
DSP PERIPHERAL, CORRELATOR |
DSP PERIPHERAL, CORRELATOR |
DSP PERIPHERAL, CORRELATOR |
| Maker |
LOGIC Devices |
LOGIC Devices |
- |
LOGIC Devices |
| ECCN code |
3A001.A.3 |
- |
3A001.A.2.C |
3A001.A.2.C |