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AM29DS323DB120WHI

Description
Flash, 4MX8, 120ns, PBGA48, 6 X 12 MM, 0.80 MM PITCH, FBGA-48
Categorystorage    storage   
File Size932KB,51 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM29DS323DB120WHI Overview

Flash, 4MX8, 120ns, PBGA48, 6 X 12 MM, 0.80 MM PITCH, FBGA-48

AM29DS323DB120WHI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeBGA
package instruction6 X 12 MM, 0.80 MM PITCH, FBGA-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time120 ns
Spare memory width16
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length12 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8,63
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply1.8/2.2 V
Programming voltage1.8 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)2.2 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
width6 mm
ADVANCE INFORMATION
Am29DS323D
32 Megabit (4 M x 8-Bit/2 M x 16-Bit)
CMOS 1.8 Volt-only, Simultaneous Operation Flash Memory
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
s
Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in other bank
— Zero latency between read and write operations
s
Multiple bank architectures
— Two devices available with different bank sizes (refer
to Table 3)
s
Secured Silicon (SecSi) Sector: Extra 64 KByte sector
Factory locked and identifiable:
16 bytes available for
secure, random factory Electronic Serial Number;
verifiable as factory locked through autoselect
function. ExpressFlash option allows entire sector to
be available for factory-secured data
Customer lockable:
Can be read, programmed, or
erased just like other sectors. Once locked, data
cannot be changed
s
Zero Power Operation
— Sophisticated power management circuits reduce
power consumed during inactive periods to nearly
zero
s
Package options
— 48-ball FBGA
— 48-pin TSOP (contact AMD for availability)
s
Top or bottom boot block
s
Manufactured on 0.23 µm process technology
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply flash standard
PERFORMANCE CHARACTERISTICS
s
High performance
— Access time as fast 100 ns
— Program time: 14 µs/word typical utilizing
Accelerate function
s
Ultra low power consumption (typical values)
— 1 mA active read current at 1 MHz
— 5 mA active read current at 5 MHz
— 200 nA in standby or automatic sleep mode
s
Minimum 1 million write cycles guaranteed per sector
s
20 Year data retention at 125°C
— Reliable operation for the life of the system
SOFTWARE FEATURES
s
Data Management Software (DMS)
— AMD-supplied software manages data programming
and erasing, enabling EEPROM emulation
— Eases sector erase limitations
s
Supports Common Flash Memory Interface (CFI)
s
Erase Suspend/Erase Resume
— Suspends erase operations to allow programming in
same bank
s
Data# Polling and Toggle Bits
— Provides a software method of detecting the status of
program or erase cycles
s
Unlock Bypass Program command
— Reduces overall programming time when issuing
multiple program command sequences
HARDWARE FEATURES
s
Any combination of sectors can be erased
s
Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase
cycle completion
s
Hardware reset pin (RESET#)
— Hardware method of resetting the internal state
machine to reading array data
s
WP#/ACC input pin
— Write protect (WP#) function allows protection of two
outermost boot sectors, regardless of sector protect status
— Acceleration (ACC) function provides accelerated
program times
s
Sector protection
— Hardware method of locking a sector, either
in-system or using programming equipment, to
prevent any program or erase operation within that
sector
— Temporary Sector Unprotect allows changing data in
protected sectors in-system
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication#
23480
Rev:
A
Amendment/0
Issue Date:
January 25, 2000
Refer to AMD’s Website (www.amd.com) for the latest information.

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