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IDT72V20120JG

Description
FIFO, 256X9, 12ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
Categorystorage    storage   
File Size137KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
Download Datasheet Parametric View All

IDT72V20120JG Overview

FIFO, 256X9, 12ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32

IDT72V20120JG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFJ
package instructionGREEN, PLASTIC, LCC-32
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time12 ns
period time20 ns
JESD-30 codeR-PQCC-J32
JESD-609 codee3
length13.9954 mm
memory density2304 bit
memory width9
Number of functions1
Number of terminals32
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256X9
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.55 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width11.4554 mm
3.3 VOLT CMOS SyncFIFO™
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9 and 8,192 x 9
IDT72V201, IDT72V211
IDT72V221, IDT72V231
IDT72V241, IDT72V251
FEATURES:
256 x 9-bit organization IDT72V201
512 x 9-bit organization IDT72V211
1,024 x 9-bit organization IDT72V221
2,048 x 9-bit organization IDT72V231
4,096 x 9-bit organization IDT72V241
8,192 x 9-bit organization IDT72V251
10 ns read/write cycle time
5V input tolerant
Read and Write clocks can be independent
Dual-Ported zero fall-through time architecture
Empty and Full Flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags can be set to
any depth
Programmable Almost-Empty and Almost-Full flags default to
Empty+7, and Full-7, respectively
Output Enable puts output data bus in high-impedance state
Advanced submicron CMOS technology
Available in 32-pin plastic leaded chip carrier (PLCC) and 32-pin
plastic Thin Quad FlatPack (TQFP)
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
DESCRIPTION:
The IDT72V201/72V211/72V221/72V231/72V241/72V251 SyncFIFOs™
are very high-speed, low-power First-In, First-Out (FIFO) memories with
clocked read and write controls. The architecture, functional operation and pin
assignments are identical to those of the IDT72201/72211/72221/72231/
72241/72251, but operate at a power supply voltage (Vcc) between 3.0V and
3.6V. These devices have a 256, 512, 1,024, 2,048, 4,096 and 8,192 x 9-bit
memory array, respectively. These FIFOs are applicable for a wide variety of
data buffering needs such as graphics, local area networks and interprocessor
communication.
These FIFOs have 9-bit input and output ports. The input port is
controlled by a free-running clock (WCLK), and two Write Enable pins
(WEN1, WEN2). Data is written into the Synchronous FIFO on every rising
clock edge when the Write Enable pins are asserted. The output port is
controlled by another clock pin (RCLK) and two Read Enable pins (REN1,
REN2).
The Read Clock can be tied to the Write Clock for single clock
operation or the two clocks can run asynchronous of one another for dual-
clock operation. An Output Enable pin (OE) is provided on the read port
for three-state control of the output.
The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF).
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are
provided for improved system control. The programmable flags default to
Empty+7 and Full-7 for
PAE
and
PAF,
respectively. The programmable flag
offset loading is controlled by a simple state machine and is initiated by asserting
the Load pin (LD).
These FIFOs are fabricated using IDT's high-speed submicron CMOS
technology.
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN1
WEN2
INPUT REGISTER
OFFSET REGISTER
EF
PAE
PAF
FF
D
0
- D
8
LD
WRITE CONTROL
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9, 8,192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RCLK
REN1
REN2
RS
OE
Q
0
- Q
8
4092 drw 01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. SyncFIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2006
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2006
DSC-4092/4
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