BZD27C20P_R2_00001 datasheet, PDF

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BZD27C20P_R2_00001: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; File Size108KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZD27C20P_R2_00001 Overview

Zener Diode,

BZD27C20P_R2_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-F2
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	15 Ω
JESD-30 code	R-PDSO-F2
Maximum knee impedance	750 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	1 W
Nominal reference voltage	20 V
Maximum reverse current	1 µA
Reverse test voltage	15 V
surface mount	YES
technology	ZENER
Terminal form	FLAT
Terminal location	DUAL
Maximum voltage tolerance	5%
Working test current	25 mA

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BZD27C3V6P~BZD27C75P

VOLTAGE REGULATOR DIODES

VOLTAGE

FEATURES

0.075(1.90)

0.067(1.70)

3.6 to 75 Volts

POWER

800 mW

•

Sillicon Planar Zener Diode

•

Low profile surface-mount package

•

Zener and surge current specification

•

Low leakage current

•

Excellent stability

•

High temperature soldering : 260 C/10 sec. at terminals

•

Lead free in comply with EU RoHS 2011/65/EU directives

•

Green molding compound as per IEC61249 Std. . (Halogen Free)

0.145(3.70)

0.137(3.50)

0.115(2.90)

0.106(2.70)

MECHANICAL DATA

Case: SOD-123FL

Terminals : Solderable per MIL-STD-750,Method 2026

Approx Weight: 0.0168 grams

0.030(0.75)

0.017(0.45)

Cathode

Anode

ABSOLUTE MAXIMUM RATINGS

(TA=25

C , unless otherwise specified)

Parameter

Power dissipation

Test conditon

=80

=25

100

s square pulse(note 2)

Non-repetitive peak pulse power dissipation

10/1000

s waveform (BZD27-C7V5P to BZD27-C75P)

RSM

150

Symbol

TOT

ZSM

Value

2.3

0.8 (note 1)

300

Units

THERMAL CHARACTERISTICS

(TA=25

C , unless otherwise noted)

P a ra me te r

The r m a l r e s i s t a nc e j unc t i o n t o a m b i e nt a i r

The r m a l r e s i s t a nc e j unc t i o n t o l e a d

M a xi m um j unc t i o n t e m p e r a t ur e

S t o r a g e t e m p e r a t ur e r a ng e

Te s t c o n d i t i o n

S ym b o l

J A

J L

Va l ue

180

150

-5 5 to + 1 5 0

U ni t

K /W

0.008(0.20)

0.004(0.10)

ELCTRICAL CHARACTERISTICS

PA RA M E TE R

F o r w a r d vo l t a g e

Te s t c o n d i t i o n

= 0 . 2 A

S ym b o l

Mi n

Ty p

Max

1.2

0.044(1.10)

0.031(0.80)

0.043(1.08)

0.038(0.98)

U ni t s

NOTES:

1. Mounted on epoxy-glass PCB with 3X3 mm Cu pads (>40m thick)

2. T

=25

C prior to surge

STAD-JAN.12.2007

PAGE . 1

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