SODF151T-SH thru SODF157T-SH
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers
Reverse Voltage 50 to 1000V Forward Current 1.5A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically
bonded construction
* Cavity-free glass passivated junction
* Capable of meeting environmental standards
of MIL-S-19500
* Typical IR less than 1.0µA
* High temperature soldering guaranteed:
260°C/10 seconds
Mechanical Data
Case:
JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE
Terminals:
Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0155 g
We declare that the material of product is
Haloggen free (green epoxy compound)
Handling precautin:None
Electrical Characteristic
1.Maximum & Thermal Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
lead length at T
A
= 75°C(Note 2)
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
Typical reverse recovery time (Note 1)
Typical thermal resistance (Note 1)
Operating junction temperature range
storage temperature range
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
trr
RθJ
A
RθJ
C
T
J
T
STG
100
110
40
–55
to +150
–65
to +175
symbol
SOD
F151T-
SH
SOD
F152T-
SH
SOD
F153T-
SH
SOD
F154T-
SH
SOD
F155T-
SH
SOD
F156T-
SH
SOD
F157T-
SH
Unit
G1T
50
35
50
G2T
100
70
100
G3T
200
140
200
G4T
400
280
400
1.5
50
G5T
600
420
600
G6T
800
560
800
G7T
1000
700
1000
V
V
V
A
A
150
160
ns
°C/W
°C
°C
Electrical Characteristics Ratings
at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
Maximum instantaneous forward voltage at 1.5A
Maximum DC reverse current at rated DC blocking
voltage T
A
= 25℃
Tj = 100℃
Typical junction capacitance at 4.0V, 1MHz (Note 2)
NOTES:
1. I
F
= 0.5A, I
R
= 1.0A, I
RR
= 0.25A
2. 8.0mm
2
(.013mm thick) land areas
symbol
V
F
I
R
C
J
SOD
F151T-
SH
SOD
F152T-
SH
SOD
F153T-
SH
SOD
F154T-
SH
SOD
F155T-
SH
SOD
F156T-
SH
SOD
F157T-
SH
Unit
V
µA
PF
1.3
5.0
100
15.0
SODF151T-SH thru SODF157T-SH
2. Characteristic Curves
( TA = 25°C unless otherwise noted )
Fig. 1
–
Forward Current Derating Curve
Average Forward Rectified Current (A)
60 Hz
Resistive or
Inductive Load
Fig. 2
–
Maximum Non-repetitive Peak
Forward Surge Current
Average Forward Rectified Current (A)
TJ = TJ max
8.3ms Single Half Sine-wave
(JEDEC Method)
1.5
50
0.75
25
0.375" (9.5mm) Lead Length
0
0
25 50 75 100 125 150 175
Ambient Temperature,
°C
Fig 3.
–
Typical Instantaneous Forward
Characteristics
0
1
10
Number of Cycles at 60Hz
100
Fig 4.
–
Typical Reverse Characteristics
Instantaneous Reverse Current (µA)
100
10
Instantaneous Forward Current (A)
1.0
10
Tj=125℃
0.1
1.0
Tj=75℃
0.01
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0.1
Tj=25℃
0.001
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage
1.6
0.01
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 6.
–
Typical Junction Capacitance
Fig 5.
–typical
transient thermal
impedance
Transient thermal impedance(°C/W)
100
Junction Capacitance (pF)
100
10
10
1.0
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
0.1
0.01
0.1
1.0
10
t,Pulse duration,sec
100
1.0
0.1
1
10
Reverse Voltage (V)
100
SODF151T-SH thru SODF157T-SH
Reel packing
PACKAGE
SOD123-FL
REEL SIZE
7"
REEL
(PCS)
3,000
COMPONENT
SPACING
(mm)
4.0
BOX
(pcs)
30,000
INNER BOX
(mm)
183*183*123
REEL DIA.
(mm)
178
CARTON
SIZE
(mm)
382*262*387
APPOX.
CARTON
(PCS)
240,000
GROSS
WEIGHT
(kg)
8.7
5.Suggested thermal profile for soldering process
1. Storage environment：Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(t
s
)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time(t
L
)
Peak Temperature(T
P
)
Time within 5℃ of actual Peak
Temperature(T
P
)
Ramp-down Rate
Time 25℃ to Peak Temperature
217℃
60-260sec
255 -0/+5℃
10~30sec
<6℃/sec
<6minutes
<3sec
Soldering Condition
<3℃/sec
150℃
200℃
60~120sec
FPGA/CPLD
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