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XPC860MHCZP50C1

Description
IC,COMMUNICATIONS CONTROLLER,BGA,357PIN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,61 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

XPC860MHCZP50C1 Overview

IC,COMMUNICATIONS CONTROLLER,BGA,357PIN

XPC860MHCZP50C1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionBGA, BGA357,19X19,50
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B357
JESD-609 codee0
Number of terminals357
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA357,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
power supply3.3 V
Certification statusNot Qualified
Nominal supply voltage3.3 V
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM

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