K8D3216UBC-TI070 datasheet, PDF

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K8D3216UBC-TI070: DescriptionFlash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48; Categorystorage storage; File Size1MB，44 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8D3216UBC-TI070 Overview

Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48

K8D3216UBC-TI070 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	6 X 8.50 MM, 0.80 MM PITCH, TBGA-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	70 ns
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
length	8.5 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	1
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1 mm
Department size	8K,64K
Maximum standby current	0.000018 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	6 mm

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K8D3x16UTC / K8D3x16UBC

NOR FLASH MEMORY

Document Title

32M Bit (4M x8/2M x16) Dual Bank NOR Flash Memory

Revision History

Revision No. History

0.0

1.0

1.1

Initial Draft

Final Specification

Not support 48TSOP1 Package

Not support 16M/16M BANK partition

Support 48TSOP1 Package

Support 48TSOP1 Lead Free Package

Support 48FBGA Leaded/Lead Free Package

Complement status flag check algorithm

tCS timing is modified

"Asynchronous mode may not support read following four sequential

invalid read condition within 200ns." is added

Draft Date

June 18, 2002

November 13, 2002

Remark

Preliminary

November 18, 2003 Final

1.2

1.3

1.4

1.5

1.6

1.7

July 16, 2004

September 16,

2004

March 16, 2005

June 2, 2005

August 25,2006

September 7, 2006

Revision 1.7

September, 2006

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