Spark Gap Protectors (SPG)
UNB Series
Features
u
u
u
u
u
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u
Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance (≤1.0pF) and high isolation
(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Working temperature: -25℃~ +65
℃
Storage temperature: -25
℃
~ +85℃
Meets MSL level 1, per J-STD-020
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Part Numbering
UNB - 201
(1)
(2)
M
(3)
(1) Series
(2) V
S
Voltage, e.g. 201=20X10
1
=200V
(3) V
S
Voltage tolerance: L -
±15%,
M -
±20%,
N -
±30%
Dimensions
Symbol
L1
L
d
D
Inches
1.102±0.118
0.157±0.012
0.020±0.002
0.102±0.012
Millimeters
28.0±3.0
4.0±0.3
0.5±0.05
2.6±0.3
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
1/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB Series
Electrical Characteristics
DC Spark-over
Voltage
Vs(V)
140(98~182)
180(126~234)
200(160~240)
250(200~300)
300(240~360)
400(320~480)
470(400~560)
500(400~600)
600(480~720)
1000(800~1200)
1500(1200~1800)
Minimum
Insulation
Resistance
IR(OHM)/DC
100M / 50V
100M / 50V
100M /100V
100M /100V
100M /100V
100M / 250V
100M / 250V
100M / 250V
100M / 250V
100M / 500V
100M / 500V
Maximum
Capacitance
1KHZ-6Vmax
C (pF)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Surge Current
Capacity
8/20
μS
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
Part Number
Surge Life Test
UNB-141N
UNB-181N
UNB-201M
UNB-251M
UNB-301M
UNB-401M
UNB-471M
UNB-501M
UNB-601M
UNB-102M
UNB-152M
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
10KV / 150A , >200T
Color Code
Part Number
UNB-141N
UNB-181N
UNB-201M
UNB-301M
UNB-401M
UNB-471M
UNB-501M
UNB-601M
UNB-102M
UNB-152M
Color Code1
Yellow
Gray
Red
Brown
Yellow
Yellow
Green
Blue
Black
Black
Color Code2
Black
-
-
-
-
-
-
-
-
Green
Color Code3
-
-
-
-
-
-
-
-
-
Red
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
2/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB Series
Test Methods and Results
Items
Test Method
Measure starting discharge voltage (Vs) by gradually
increasing applied DC voltage. Test current is 0.5mA
DC Spark-over Voltage
max. And the DC voltage ascends up within
100V/s(Vs＜1000V) or 500V/s(Vs≥1000V).
Measure the insulation resistance across the terminal
Insulation Resistance
at regular voltage. But the test voltage doesn’t over
the DC spark-over voltage.
Measure the electrostatic capacitance by applying a
Capacitance
voltage of less than 6V (at 1KHz) between terminals.
∣△
Vs/Vs
∣
≤30%
Standard
Rate-of-change, within±30%
insulation resistance & capacitance,
conformed to rated spec.
10KV with 1500pf condenser is discharged through
Static Life
2KΩ resistor. 200 times at an interval of 10sec.
the specified value
1.2/50μs & 8/20μs, 1000A, electrically connected with
Surge Current
Capacity
a resistor (1~2
Ω), ±5
times, each time interval 60
No crack and no failures
seconds. Thereafter, outer appearance shall be
visually examined.
Measurement after -40
℃
/1000 HRS & normal
Cold Resistance
temperature/2 HRS.
Measurement after 125
℃
/1000 HRS & normal
Heat Resistance
temperature/2 HRS.
Measurement after humidity 90~95℃(45℃ ) /1000
Humidity Resistance
HRS & normal temperature/2 HRS.
10 times repetition of cycle -40℃ /30min
→normal,
Temperature Cycle
temp/2
min
→125
℃
/30min,
measurement
after
Features are conformed to rated spec
Characteristics of other items must meet
normal temp/2 HRS.
Apply flux and immerse in molten solder
Solder Ability
for 3sec up to the point of 1.5mm from
for solder adhesion.
Measurement after lead wire is dipped up to the point
Solder Heat
of 1.5mm from body into 260±5℃
Pull Strength
Flexural Strength
0.25 load and back to its original point. Repeat 1 time.
Apply 0.5kg load for 10sec
Bend lead wire at the point of 2mm from body under
Lead shall not pull out to snap
solder for 10sec
Conformed to rated spec
230±5℃
Lead wire is evenly covered by solder
body. Check
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
3/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB Series
Recommended Soldering Conditions
Flow Soldering Conditions
Air Preheat
Soldering
260℃
Temperature (℃)
250
Temperature (℃)
ΔT
200
150
100
50
0
60~120 sec
3~4 sec
Cooling
250
ΔT
200
150
100
50
0
60~120 sec
10 sec. or less
Reflow Soldering Conditions
Air Preheat
Soldering
260℃
Cooling
150~180℃
150~180℃
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃ .
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
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High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur.
For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding
200℃ to fewer than 50 seconds.
Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to
remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or
a decrease in the adherence of the termination, we recommend that you use the conditions below:
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
4/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNB Series
Packaging
Tape
Symbol
W
P
T
Z
L1-L2
S
t
L
D1
D
R
Dimension (mm)
52+2.0/-1.0
5.0±0.5
6.0±1.0
1.2 Max
1.0 Max
0.8 Max
3.2 Max
4.0±0.3
Φ0.5±0.05
Φ2.6±0.3
1.0 Max
Inner Box
Item
Length
Width
Height
Quantity
Description
A=255 mm
B=75 mm
C=68 mm
2000 PCS
There are upper and bottom
board to protect the parts
from damage.
Package
UN Semiconductor Co., Ltd.
Revision January 06, 2014
www.unsemi.com.tw
5/5
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
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