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UPSD3254BV

Description
8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80
Categorysemiconductor    The embedded processor and controller   
File Size912KB,175 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

UPSD3254BV Overview

8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80

UPSD3254BV Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals80
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
External data bus width8
Number of input and output buses63
Line speed24 MHz
Processing package descriptionROHS COMPLIANT, plastic, TQFP-80
Lead-freeYes
EU RoHS regulationsYes
stateDISCONTINUED
packaging shapeSQUARE
Package SizeFLATPACK, LOW PROFILE, FINE PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.5000 mm
terminal coatingMATTE Tin
Terminal locationFour
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
ADC channelYes
Address bus width12
Number of digits8
Maximum FCLK clock frequency40 MHz
Microprocessor typeMicrocontroller
PWM channelYes
ROM programmingFLASH
UPSD3254A, UPSD3254BV
UPSD3253B, UPSD3253BV
Flash Programmable System Devices
with 8032 Microcontroller Core
FEATURES SUMMARY
s
The uPSD325X devices combine a Flash PSD
architecture with an 8032 microcontroller core.
The uPSD325X devices of Flash PSDs feature
dual banks of Flash memory, SRAM, general
purpose I/O and programmable logic, supervi-
sory functions and access via USB, I
2
C, ADC,
DDC and PWM channels, and an on-board
8032 microcontroller core, with two UARTs,
three 16-bit Timer/Counters and two External
Interrupts. As with other Flash PSD families, the
uPSD325X devices are also in-system pro-
grammable (ISP) via a JTAG ISP interface.
s
Large 32KByte SRAM with battery back-up
option
s
Figure 1. 52-lead, Thin, Quad, Flat Package
TQFP52 (T)
Dual bank Flash memories
– 128KByte or 256KByte main Flash memory
– 32KByte secondary Flash memory
s
Content Security
– Block access to Flash memory
Programmable Decode PLD for flexible address
mapping of all memories within 8032 space.
High-speed clock standard 8032 core (12-cycle)
USB Interface (some devices only)
I
2
C interface for peripheral connections
5 Pulse Width Modulator (PWM) channels
Analog-to-Digital Converter (ADC)
Standalone Display Data Channel (DDC)
Six I/O ports with up to 46 I/O pins
3000 gate PLD with 16 macrocells
Supervisor functions with Watchdog Timer
In-System Programming (ISP) via JTAG
Zero-Power Technology
Single Supply Voltage
– 4.5 to 5.5V
– 3.0 to 3.6V
Figure 2. 80-lead, Thin, Quad, Flat Package
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TQFP80 (U)
September 2003
Rev. 1.2
1/175

UPSD3254BV Related Products

UPSD3254BV UPSD3254 9202 UPSD3254A UPSD3253BV UPSD3253B
Description 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP80
Number of functions 1 1 1 1 1 1
Number of terminals 80 80 80 80 80 80
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
Maximum supply/operating voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage 3 V 3 V 3 V 3 V 3 V 3 V
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
External data bus width 8 8 8 8 8 8
Number of input and output buses 63 63 63 63 63 63
Line speed 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz
Processing package description ROHS COMPLIANT, plastic, TQFP-80 ROHS COMPLIANT, plastic, TQFP-80 ROHS COMPLIANT, plastic, TQFP-80 ROHS COMPLIANT, plastic, TQFP-80 ROHS COMPLIANT, plastic, TQFP-80 ROHS COMPLIANT, plastic, TQFP-80
Lead-free Yes Yes Yes Yes Yes Yes
EU RoHS regulations Yes Yes Yes Yes Yes Yes
state DISCONTINUED DISCONTINUED DISCONTINUED DISCONTINUED DISCONTINUED DISCONTINUED
packaging shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package Size FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
surface mount Yes Yes Yes Yes Yes Yes
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal spacing 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm
terminal coating MATTE Tin MATTE Tin MATTE Tin MATTE Tin MATTE Tin MATTE Tin
Terminal location Four Four Four Four Four Four
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
ADC channel Yes Yes Yes Yes Yes Yes
Address bus width 12 12 12 12 12 12
Number of digits 8 8 8 8 8 8
Maximum FCLK clock frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Microprocessor type Microcontroller Microcontroller Microcontroller Microcontroller Microcontroller Microcontroller
PWM channel Yes Yes Yes Yes Yes Yes
ROM programming FLASH FLASH FLASH FLASH FLASH FLASH

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