MT46HC32M16LFCM-5IT:B datasheet, PDF

Datasheet> All Categories > storage> storage> MT46HC32M16LFCM-5IT:B

MT46HC32M16LFCM-5IT:B: DescriptionDDR DRAM, 32MX16, 5ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90; Categorystorage storage; File Size3MB，98 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

Download Datasheet Parametric View All

MT46HC32M16LFCM-5IT:B Overview

DDR DRAM, 32MX16, 5ns, CMOS, PBGA90, 10 X 13 MM, GREEN, PLASTIC, VFBGA-90

MT46HC32M16LFCM-5IT:B Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	90
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B90
JESD-609 code	e1
length	13 mm
memory density	536870912 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	90
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	10 mm

Preview

Download Datasheet

View All

512Mb: x16, x32 Mobile LPDDR SDRAM

Features

Mobile Low-Power DDR SDRAM

MT46H32M16LF – 8 Meg x 16 x 4 Banks

MT46H16M32LF – 4 Meg x 32 x 4 Banks

Features

•

DDQ

= 1.70–1.95V

1.2V I/O option V

DDQ

= 1.14–1.30V

Bidirectional data strobe per byte of data (DQS)

Internal, pipelined double data rate (DDR)architec-

ture; two data accesses per clock cycle

Differential clock inputs (CK and CK#)

Commands entered on each positive CK edge

DQS edge-aligned with data for READs;center-

aligned with data for WRITEs

4 internal banks for concurrent operation

Data masks (DM) for masking write data—one mask

per byte

Programmable burst lengths (BL): 2, 4, 8, or 16

Concurrent auto precharge option is supported

Auto refresh and self refresh modes

1.8V LVCMOS-compatible inputs

On-chip temp sensor to control self refresh rate

Partial-array self refresh (PASR)

Deep power-down (DPD)

Status read register (SRR)

Selectable output drive strength (DS)

Clock stop capability

64ms refresh

Table 1: Key Timing Parameters (CL = 3)

Speed Grade

-5

-54

-6

-75

Clock Rate (MHz)

200

185

166

133

Access Time

5.0ns

6.0ns

Options

•

DDQ

–

1.8V/1.8V

–

1.8V/1.2V

•

Configuration

–

32 Meg x 16 (8 Meg x 16 x 4 banks)

–

16 Meg x 32 (4 Meg x 32 x 4 banks)

•

Row-size option

–

JEDEC-standard option

–

Reduced page-size option

•

Plastic green package

–

60-ball VFBGA (8mm x 9mm)

–

90-ball VFBGA (10mm x 13mm)

–

90-ball VFBGA (9mm x 13mm)

•

Timing – cycle time

–

5ns @ CL = 3

–

5.4ns @ CL = 3

–

6ns @ CL = 3

–

7.5ns @ CL = 3

•

Power

–

Standard I

DD2

DD6

–

Low-power I

DD2

DD61

•

Operating temperature range

–

Commercial (0˚ to +70˚C)

–

Industrial (–40˚C to +85˚C)

•

Design revision

Notes:

Marking

32M16

16M32

-5

-54

-6

-75

None

1. Contact factory for availability.

2. Only available for x16 configuration.

3. Only available for x32 configuration.

PDF: 09005aef82d5d305

512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x16, x32 Mobile LPDDR SDRAM

General Description ......................................................................................................................................... 8

Functional Block Diagrams ............................................................................................................................... 9

Ball Assignments and Descriptions ................................................................................................................. 11

Package Dimensions ...................................................................................................................................... 15

Electrical Specifications .................................................................................................................................. 18

Electrical Specifications – I

Parameters ........................................................................................................ 22

Electrical Specifications – AC Operating Conditions ......................................................................................... 26

Output Drive Characteristics ........................................................................................................................... 30

Functional Description ................................................................................................................................... 34

Commands .................................................................................................................................................... 35

DESELECT ................................................................................................................................................ 36

NO OPERATION ........................................................................................................................................ 36

LOAD MODE REGISTER ............................................................................................................................ 36

ACTIVE ..................................................................................................................................................... 36

READ ........................................................................................................................................................ 37

WRITE ...................................................................................................................................................... 38

PRECHARGE ............................................................................................................................................. 39

BURST TERMINATE .................................................................................................................................. 40

AUTO REFRESH ........................................................................................................................................ 40

SELF REFRESH ........................................................................................................................................... 41

DEEP POWER-DOWN ................................................................................................................................ 41

Truth Tables ................................................................................................................................................... 42

State Diagram ................................................................................................................................................ 47

Initialization .................................................................................................................................................. 48

Standard Mode Register .................................................................................................................................. 51

Burst Length .............................................................................................................................................. 51

Burst Type ................................................................................................................................................. 52

CAS Latency .............................................................................................................................................. 53

Operating Mode ......................................................................................................................................... 54

Extended Mode Register ................................................................................................................................. 55

Temperature-Compensated Self Refresh .................................................................................................... 55

Partial-Array Self Refresh ........................................................................................................................... 56

Output Drive Strength ................................................................................................................................ 56

Status Read Register ....................................................................................................................................... 57

Bank/Row Activation ...................................................................................................................................... 59

READ Operation ............................................................................................................................................. 60

WRITE Operation ........................................................................................................................................... 71

PRECHARGE Operation .................................................................................................................................. 83

Auto Precharge ............................................................................................................................................... 83

Concurrent Auto Precharge ........................................................................................................................ 84

AUTO REFRESH Operation ............................................................................................................................. 89

SELF REFRESH Operation .............................................................................................................................. 90

Power-Down .................................................................................................................................................. 91

Deep Power-Down .................................................................................................................................... 93

Clock Change Frequency ................................................................................................................................ 95

Revision History ............................................................................................................................................. 96

Rev. I, Production – 12/09 ........................................................................................................................... 96

Rev. H, Production – 03/09 .......................................................................................................................... 96

Rev. G, Production – 02/09 .......................................................................................................................... 96

Rev. F, Production – 10/08 .......................................................................................................................... 96

Contents

PDF: 09005aef82d5d305

512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x16, x32 Mobile LPDDR SDRAM

Table 1: Key Timing Parameters (CL = 3) .......................................................................................................... 1

Table 2: Configuration Addressing 512 ............................................................................................................. 2

Table 3: VFBGA Ball Descriptions .................................................................................................................. 13

Table 4: Absolute Maximum Ratings .............................................................................................................. 18

Table 5: AC/DC Electrical Characteristics and Operating Conditions ............................................................... 18

Table 6: 1.2V I/O AC/DC Electrical Characteristics and Operating Conditions ................................................. 19

Table 7: Capacitance (x16, x32) ...................................................................................................................... 20

Table 8: I

Specifications and Conditions (x16) ............................................................................................ 22

Table 9: I

Specifications and Conditions (x32) ............................................................................................ 23

Table 10: I

DD6

Specifications and Conditions .................................................................................................. 24

Table 11: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 26

Table 12: Target Output Drive Characteristics (Full Strength) .......................................................................... 30

Table 13: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 31

Table 14: 1.2V I/O Target Output Drive Characteristics (Three-Quarter Strength) ............................................ 32

Table 15: Target Output Drive Characteristics (One-Half Strength) ................................................................. 33

Table 16: Truth Table – Commands ............................................................................................................... 35

Table 17: DM Operation Truth Table ............................................................................................................. 36

Table 18: Truth Table – Current State Bank

– Command to Bank

............................................................... 42

Table 19: Truth Table – Current State Bank

– Command to Bank

.............................................................. 43

Table 20: Truth Table – CKE .......................................................................................................................... 46

Table 21: Burst Definition Table .................................................................................................................... 52

List of Tables

PDF: 09005aef82d5d305

512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Recommended Resources

Line keyer circuit to prevent telephone outside line theft

High Output Level RF Modulator Circuit

Digital display temperature control circuit

Networked paging car alarm controlled by microcontroller

Adjustable symmetrical triangle wave oscillator

How to connect IR2130 to power tube

Hang Seng Electronics (Hangzhou) recruits mobile embedded developers: Familiar with k-java platform and wince platform. More than one year of experience in mobile software development. Experience in mobile securities software is preferred. Contact MSN: wohuosile@hotmail...; twobyte Embedded System

The realization method of simulating serial communication through IO port of 89c51 single chip microcomputer: The commonly used MCS51 and PIC series microcontrollers usually have only one (or no) UART asynchronous serial communication interface. If multiple serial interfaces are required in the application sy...; zzzzer16 51mcu

I would like to make a suggestion. After you have mastered the CNC power supply, it is recommended to DIY the electronic load.: In fact, we all have power supplies, but some are good and some are not. Most people don't have electronic loads. It is recommended to DIY electronic loads in the future....; daijun DIY/Open Source Hardware

Some questions about R5F100LEA serial port sending: [table=98%] [tr][td]Today I started to learn Renesas products. I have some doubts about the serial port part of the routine. I hope the seniors can give me some advice. Serial port reception is implem...; 我塑我心 Renesas Electronics MCUs

Please recommend a Chinese-English bilingual book on switching power supply: I want to improve my English while also improving my skills in switching power supplies. Could you recommend a book on switching power supplies with both Chinese and English translations so that we ca...; hfutdsplab Power technology

LM3S811 Development Sharing: I just received the LM3S811 evaluation board from EEWorld a few days ago. I did a simple UART debugging first. Now I post the program here for everyone to see. It is developed based on Keil....; kevinrobot ARM Technology

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components