D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Data Device Corporation |
| Parts packaging code | DIP |
| package instruction | HERMETIC SEALED, DDIP-24 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Maximum analog output voltage | 10 V |
| Minimum analog output voltage | -10 V |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | R-CDIP-P24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.012% |
| Nominal negative supply voltage | -15 V |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | +-5,+-15 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.01 mm |
| Maximum stabilization time | |
| Maximum slew rate | 100 mA |
| Nominal supply voltage | 15 V |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| DAC-02320-302 | DAC-02320-102 | DAC-02320-103 | DAC-02320-303 | DAC-02320-123 | DAC-02320-122 | |
|---|---|---|---|---|---|---|
| Description | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, HERMETIC SEALED, DDIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | HERMETIC SEALED, DDIP-24 | HERMETIC SEALED, DDIP-24 | DIP, DIP24,.6 | DIP, DIP24,.6 | HERMETIC SEALED, DDIP-24 | HERMETIC SEALED, DDIP-24 |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum analog output voltage | 10 V | 10 V | 10 V | 10 V | 10 V | 10 V |
| Minimum analog output voltage | -10 V | -10 V | -10 V | -10 V | -10 V | -10 V |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.012% | 0.012% | 0.006% | 0.006% | 0.006% | 0.012% |
| Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V | +-5,+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.01 mm | 4.01 mm | 4.01 mm | 4.01 mm | 4.01 mm | 4.01 mm |
| Maximum slew rate | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Maker | Data Device Corporation | Data Device Corporation | Data Device Corporation | - | Data Device Corporation | Data Device Corporation |
| ECCN code | - | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C |