Standard SRAM, 128KX8, 17ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DLCC |
| package instruction | SON, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.B |
| Maximum access time | 17 ns |
| JESD-30 code | R-CDSO-N32 |
| JESD-609 code | e0 |
| length | 20.828 mm |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | SON |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 2.54 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| IDT71024S17L8 | IDT71024S15D | IDT71024S15L8 | IDT71024S17D | IDT71024S20D | |
|---|---|---|---|---|---|
| Description | Standard SRAM, 128KX8, 17ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32 | Standard SRAM, 128KX8, 15ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Standard SRAM, 128KX8, 15ns, CMOS, CDSO32, 0.400 X 0.820 INCH, LCC-32 | Standard SRAM, 128KX8, 17ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Standard SRAM, 128KX8, 20ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 |
| Parts packaging code | DLCC | DIP | DLCC | DIP | DIP |
| package instruction | SON, | DIP, | SON, | DIP, | DIP, |
| Contacts | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | compliant | unknown | compliant | compli |
| ECCN code | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Maximum access time | 17 ns | 15 ns | 15 ns | 17 ns | 20 ns |
| JESD-30 code | R-CDSO-N32 | R-CDIP-T32 | R-CDSO-N32 | R-CDIP-T32 | R-GDIP-T32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Exportable | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | SON | DIP | SON | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| length | 20.828 mm | - | 20.828 mm | - | 41.91 mm |
| Maximum seat height | 2.54 mm | - | 2.54 mm | - | 5.334 mm |
| Terminal pitch | 1.27 mm | - | 1.27 mm | - | 2.54 mm |
| width | 10.16 mm | - | 10.16 mm | - | 10.16 mm |
| Is it lead-free? | - | Contains lead | - | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible |
| Peak Reflow Temperature (Celsius) | - | 225 | - | 225 | 225 |
| Maximum time at peak reflow temperature | - | 20 | - | 20 | 20 |