Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE (-55
O
+125
O
C)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC
ABSORPTION CHARACTERISTICS
• REFLOW SOLDERING APPLICABLE
• TAPE AND REEL PACKAGING
NSPC Series
SPECIFICATIONS
Capacitance Range
Voltage Ratings*
Capacitance Tolerance
Temperature Range
Dissipation Factor (20
o
C)
Insulation Resistance (20
o
C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
Case Sizes
0805
100pF ~ .01
µF
1206
3300pF ~ .047
µF
1210
.015
µ
F ~ .1
µF
±5% Std, ±2% Opt
-55
o
C ~ +125
o
C
0.6% max @ 1 KHz
3 Gigohms Minimum
175% of Rated Voltage (5 Seconds)
150% of Rated Voltage (60 Seconds)
±3%
∆
C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
16Vdc (12Vrms), 50Vdc (40Vrms)
1913
.047
µ
F ~ .1
µF
2416
0.12
µ
F ~ 0.22
µF
* -AC Voltage Ratings (Vrms) From 60 hz to 30Khz. Contact NIC For Derating At Higher Frequencies.
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125
o
C*:
1000 Hours at 125% of
Rated Voltage
Resistance to Soldering Heat:
+260 C Peak for 5 Seconds
o
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±2% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Within ±2% of Initial Value
0.90% Maximum
(1) 1 Gigohm Minimum
(2) 0.5 Gigohm Minimum
Flow and Reflow
Humidity Load Life (Note 1):
(1) 1000 Hours, +40 C
o
(2) 500 Hours, +60 C
o
Solderability with
10% Wt Rosin-Methanol Flux
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot
* +105°C for 2416 Case Size
NOTE 1: At 90 ~ 95% Relative Humidity and Rated Voltage
PART NUMBERING SYSTEM
NSPC 103 J 16 TR A2 F
Lead Free (Optional)
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
179
Stacked Film Capacitor Chips
STANDARD PRODUCTS AND SIZE CODE
Cap.
100 pF
120
150
180
220
270
330
390
470
560
680
820
0.001
µF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.18
0.22
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
Working Voltage
(Vdc)
16
50
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
B1
B1
B1
B1
B1
B2
B2
C1
C1
C2
C2
C2
C3
C3
D1
D1
D1
D2
D2
E1
E3
E4
E5
0.35 ±0.2
L
W
H
NSPC Series
Standard: Sn/Pb
Optional: 95.5% Sn,
4% Ag and 0.5% Cu over
phosphorus copper barrier
over copper base
DIMENSION (mm) AND CASE CODE
½½½½ ½½½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½
½½½½½½
½ ½½½½
½½½
½½
½
½½½½½
½
½½½½½½½½
½½½½½½½
½½½½½½
½ ½½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½½
½½½½
½½½
½½½
½½½½½½½
½½½½½½½
½½½½
½½½½
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
C2
C2
C3
C3
½½½
½½½½½½½
½½½½
RECOMMENDED LAND PATTERN (mm)
EIA Size
0805
1206
1210
1913
2416
A
1.0
2.2
2.2
2.6
3.8
B
2.7
3.8
3.8
6.6
7.8
C
1.1
1.4
2.3
3.0
3.8
C
A
B
Soldering
230°C Max.
Pre-Heat
150°C Max.
Cool
Down
5 Seconds Max.
2 1/2 Minutes Max.
Less than
15 Seconds
2 Minutes Min.
REFLOW SOLDERING
300
T
E
250
M
P
200
E
R °C 150
A
100
T
U
50
R
E
0
NSPC 103 J 50 TR B2 F
Lead Free
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
®
180
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
Embedded System
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