BX805573070 datasheet, PDF - EEWORLD Datasheet

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BX805573070: DescriptionMicroprocessor, 64-Bit, 2660MHz, CMOS, CBGA775, LGA-775; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，102 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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BX805573070 Overview

Microprocessor, 64-Bit, 2660MHz, CMOS, CBGA775, LGA-775

BX805573070 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
Parts packaging code	LGA
package instruction	LGA,
Contacts	775
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	36
bit size	64
boundary scan	YES
maximum clock frequency	1066 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-N775
low power mode	YES
Number of terminals	775
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	LGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
speed	2660 MHz
Maximum supply voltage	1.365 V
Minimum supply voltage	0.85 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

BX805573070 Preview

Dual-Core Intel

Xeon

Processor

3000

Series

Datasheet

on 65 nm Process in the 775-land LGA Package and supporting Intel

and supporting Intel

Virtualization Technology

September 2006

Document Number: 314915-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel

64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64.

Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and

software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support Intel 64, or consult

with your system vendor for more information.

±Intel

Virtualization Technology requires a computer system with an enabled Intel

processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

The Dual-Core Intel

Xeon

processor 3000 series may contain design defects or errors known as errata which may cause the product to deviate from

published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Xeon, Intel Inside, Intel Leap ahead, Intel SpeedStep, Intel Virtualization Technology, and the Intel logo are trademarks or registered

trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Contents

Introduction

............................................................................................................ 11

1.1

Terminology ..................................................................................................... 11

1.1.1 Processor Terminology ............................................................................ 12

1.2

References ....................................................................................................... 13

Electrical Specifications

........................................................................................... 15

2.1

Power and Ground Lands.................................................................................... 15

2.2

Decoupling Guidelines ........................................................................................ 15

2.2.1 VCC Decoupling ..................................................................................... 15

2.2.2 Vtt Decoupling ....................................................................................... 15

2.2.3 FSB Decoupling...................................................................................... 16

2.3

Voltage Identification ......................................................................................... 16

2.4

Market Segment Identification (MSID) ................................................................. 18

2.5

Reserved, Unused, and TESTHI Signals ................................................................ 18

2.6

Voltage and Current Specification ........................................................................ 19

2.6.1 Absolute Maximum and Minimum Ratings .................................................. 19

2.6.2 DC Voltage and Current Specification ........................................................ 20

2.6.3 V

Overshoot ....................................................................................... 24

2.6.4 Die Voltage Validation ............................................................................. 24

2.7

Signaling Specifications...................................................................................... 25

2.7.1 FSB Signal Groups.................................................................................. 25

2.7.2 CMOS and Open Drain Signals ................................................................. 27

2.7.3 Processor DC Specifications ..................................................................... 27

2.7.3.1 GTL+ Front Side Bus Specifications ............................................. 29

2.7.4 Clock Specifications ................................................................................ 29

2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

2.7.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.7.7 Phase Lock Loop (PLL) and Filter .............................................................. 30

2.7.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.7.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

Package Mechanical Specifications

.......................................................................... 33

3.1

Package Mechanical Drawing............................................................................... 34

3.1.1 Processor Component Keep-Out Zones ...................................................... 38

3.1.2 Package Loading Specifications ................................................................ 38

3.1.3 Package Handling Guidelines.................................................................... 38

3.1.4 Package Insertion Specifications............................................................... 38

3.1.5 Processor Mass Specification .................................................................... 39

3.1.6 Processor Materials................................................................................. 39

3.1.7 Processor Markings................................................................................. 39

3.1.8 Processor Land Coordinates ..................................................................... 40

Land Listing and Signal Descriptions

....................................................................... 43

4.1

Processor Land Assignments ............................................................................... 43

4.2

Alphabetical Signals Reference ............................................................................ 66

Thermal Specifications and Design Considerations

.................................................. 73

5.1

Processor Thermal Specifications ......................................................................... 73

5.1.1 Thermal Specifications ............................................................................ 73

5.1.2 Thermal Metrology ................................................................................. 77

5.2

Processor Thermal Features ................................................................................ 77

5.2.1 Thermal Monitor..................................................................................... 77

5.2.2 Thermal Monitor 2 .................................................................................. 78

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

5.3

5.2.3 On-Demand Mode ...................................................................................79

5.2.4 PROCHOT# Signal ..................................................................................80

5.2.5 THERMTRIP# Signal ................................................................................80

Platform Environment Control Interface (PECI) ......................................................81

5.3.1 Introduction ...........................................................................................81

5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......81

5.3.1.2 Processor Thermal Data Sample Rate and Filtering.........................82

5.3.2 PECI Specifications .................................................................................83

5.3.2.1 PECI Device Address..................................................................83

5.3.2.2 PECI Command Support .............................................................83

5.3.2.3 PECI Fault Handling Requirements ...............................................83

5.3.2.4 PECI GetTemp0() Error Code Support ..........................................83

5.3.3 Thermal Diode........................................................................................84

Features

..................................................................................................................87

6.1

Power-On Configuration Options ..........................................................................87

6.2

Clock Control and Low Power States .....................................................................87

6.2.1 Normal State .........................................................................................88

6.2.2 HALT and Extended HALT Powerdown States ..............................................88

6.2.2.1 HALT Powerdown State ..............................................................88

6.2.2.2 Extended HALT Powerdown State ................................................89

6.2.3 Stop Grant State ....................................................................................89

6.2.4 Extended HALT Snoop or HALT Snoop State,

Stop Grant Snoop State...........................................................................90

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2 Extended HALT Snoop State .......................................................90

6.3

Enhanced Intel® SpeedStep® Technology ............................................................90

Boxed Processor Specifications................................................................................93

7.1

Mechanical Specifications ....................................................................................94

7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94

7.1.2 Boxed Processor Fan Heatsink Weight .......................................................95

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95

7.2

Electrical Requirements ......................................................................................95

7.2.1 Fan Heatsink Power Supply ......................................................................95

7.3

Thermal Specifications........................................................................................97

7.3.1 Boxed Processor Cooling Requirements......................................................97

7.3.2 Variable Speed Fan .................................................................................99

Debug Tools Specifications

.................................................................................... 101

8.1

Logic Analyzer Interface (LAI) ........................................................................... 101

8.1.1 Mechanical Considerations ..................................................................... 101

8.1.2 Electrical Considerations ........................................................................ 101

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Figures

2-1

2-2

2-3

2-4

2-5

2-6

2-7

3-1

3-2

3-3

3-4

3-5

3-6

3-7

4-1

4-2

5-1

5-2

5-3

5-4

5-5

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

Static and Transient Tolerance for Processors with 4 MB L2 Cache.......................... 22

Static and Transient Tolerance for Processors with 2 MB L2 Cache.......................... 23

Overshoot Example Waveform .......................................................................... 24

Differential Clock Waveform.................................................................................... 31

Differential Clock Crosspoint Specification................................................................. 31

Differential Measurements ...................................................................................... 31

Differential Clock Crosspoint Specification................................................................. 32

Processor Package Assembly Sketch ........................................................................ 33

Processor Package Drawing Sheet 1 of 3 .................................................................. 35

Processor Package Drawing Sheet 2 of 3 .................................................................. 36

Processor Package Drawing Sheet 3 of 3 .................................................................. 37

Processor Top-Side Markings Example for the Dual-Core Intel

Xeon

Processor 3000 Series with 4 MB L2 Cache ............................................................... 39

Processor Top-Side Markings Example for the Dual-Core Intel

Xeon

Processor 3000 Series with 2 MB L2 Cache ............................................................... 40

Processor Land Coordinates and Quadrants (Top View)............................................... 41

land-out Diagram (Top View – Left Side) .................................................................. 44

land-out Diagram (Top View – Right Side) ................................................................ 45

Thermal Profile (Dual-Core Intel

Xeon

Processor 3000 Series

with 4 MB L2 Cache).............................................................................................. 75

Thermal Profile (Dual-Core Intel

Xeon

Processor 3000 Series

with 2 MB L2 Cache).............................................................................................. 76

Case Temperature (TC) Measurement Location.......................................................... 77

Thermal Monitor 2 Frequency and Voltage Ordering ................................................... 79

Temperature Data Format Comparison — Thermal Diode vs. PECI Digital

Thermal Sensor .................................................................................................... 82

Processor Low Power State Machine......................................................................... 88

Mechanical Representation of the Boxed Processor..................................................... 93

Space Requirements for the Boxed Processor (Side View) ........................................... 94

Space Requirements for the Boxed Processor (Top View) ............................................ 94

Space Requirements for the Boxed Processor (Overall View) ....................................... 95

Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 96

Baseboard Power Header Placement Relative to Processor Socket ................................ 97

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) ................ 98

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) ................ 98

Boxed Processor Fan Heatsink Set Points.................................................................. 99

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

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BX805573070 Related Products

	BX805573070	BX805573060
Description	Microprocessor, 64-Bit, 2660MHz, CMOS, CBGA775, LGA-775	Microprocessor, 64-Bit, 2400MHz, CMOS, CBGA775, LGA-775
Is it Rohs certified?	conform to	conform to
Maker	Intel	Intel
Parts packaging code	LGA	LGA
package instruction	LGA,	LGA,
Contacts	775	775
Reach Compliance Code	unknown	unknown
ECCN code	3A001.A.3	3A001.A.3
Address bus width	36	36
bit size	64	64
boundary scan	YES	YES
maximum clock frequency	1066 MHz	1066 MHz
External data bus width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES
JESD-30 code	S-CBGA-N775	S-CBGA-N775
low power mode	YES	YES
Number of terminals	775	775
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	LGA	LGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified
speed	2660 MHz	2400 MHz
Maximum supply voltage	1.365 V	1.365 V
Minimum supply voltage	0.85 V	0.85 V
surface mount	YES	YES
technology	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD
Terminal location	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR

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