Axial Leaded – 3000W > 3KP series
Transient Voltage Suppressors - 30KPA Series
Features
1. Halogen-free
2. Rohs compliant
3. Typical maximum temperature coefficient
4. ΔV
BR
=0.1%xV
BR
@25°C x ΔT
5. Glass passivated Chip junction in P600 package
6. 30000W peak pulse capadility at 10x1000μs waveform,repetition rate
(duty cycles):0.01%
7. Fast response time:typically less than 1.0ps from 0 Volts to BV min
8. Excellent clamping capability
9. Low incremental surge resistance
10. Typical IR less than 5μA above 12V
11. High temperature soldering guaranteed: 260°C/40 seconds / 0.375”,
\(9.5mm) lead length, 5lbs., (2.3kg)tension
12. Plastic package has underwriters laboratory flammability classification
94v-0
UNI
Cathode
BI
Anode
BI
UNI
Applications
TVS devices are ideal for the protection of I/O interfaces,VCC bus and other vulnerable circuits used in telecom, computer,
industrial and consumer electronic applications.
Mechanical Characteristics
Rating
Peak Pulse Power Dissipation by 10x1000μs test waveform
(Fig.1)(Note 1)
Steady State Power Dissipation on
inifinite heat sink at TL=75°C (Fig. 5)
Peak Forward Surge Current, 8.3ms Single Half Sine Wave
Unidirectional only (Note 2)
Maximum Instantaneous Forward Voltage at 25A for
Unidirectional only (Note 3)
Operating junction and Storage Temperature Range.
Typical Thermal Resistance Junction to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
PPM
P
D
I
FSM
V
F
T
J
,
T
STG
R
uJL
R
uJA
Value
30000
8
400
3.5/5.0
-55°C to 175°C
8.0
40
Units
Watts
Watts
Amps
V
°C
°C/W
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 3 and derated above T
A
= 25°C per Fig. 2.
2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 perminute maximum.
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:1
Transient Voltage Suppressors - 30KPA Series
Ratings and Characteristic Curves
Figure 1 - Peak Pulse Power Rating Curve
Figure 2 - Pulse Derating Curve
Figure 3 - Pulse Waveform
Figure 4 - Typical Junction Capacitance
μ
fi
fi
μ
Figure 5 - Steady State Power Derating Curve
Figure 6 - Maximum Non-Repetitive Peak Forward
Surge Current
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:3
Transient Voltage Suppressors - 30KPA Series
Soldering Parameters
Feflow Condition
- Temperature Min (T s(min))
Pre Heat
- Temperature Max (T s(min))
- Time (min to max) (t s)
Average ramp up rate (Liquidus Temp (TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
Peak Temperature (T P)
Time within 5°C of actual peak Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
- Temperature (T L) (Liquidus)
- Time (min to max) (t s)
Lead-free assembly
150°C
200°C
60-180 secs
3°C/second max
3°C/second max
217°C
60-150 seconds
260+0/-5 °C
20-40 seconds
6°C/second max
8 minutes Max.
280°C
T
P
Ramp-up
t
p
one
Critical Z
P
T
L
to T
Physical Specifications
Weight
Case
Polarity
Termina
0.045oz., 1.2g
JEDEC DO-201 molded plastic body over
passivated junction.
Color band denotes the cathode except Bipolar.
Matte Tin axial leads, solderable per
JESD22-B102D.
t
L
T
L
Temperature (T)
T
s(max)
Ramp-down
T
s(min)
Preheat
t
s
Time (t)
Environmental Specifications
Temperature Cycle
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Pressure Cooker
265°C
10 seconds
1 time
High Temp. Storage
HTRB
Thermal Shock
Flow/Wave Soldering
Peak Temperature :
Dipping Time :
Soldering :
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:4
Embedded System
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