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74HC2G34GV

Description
Buffer
Categorylogic    logic   
File Size196KB,15 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC2G34GV Overview

Buffer

74HC2G34GV Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNexperia
package instructionTSOP,
Reach Compliance Codecompliant
seriesHC/UH
JESD-30 codeR-PDSO-G6
JESD-609 codee3
length2.9 mm
Logic integrated circuit typeBUFFER
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)125 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1.5 mm
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename
Nexperia.
Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use
http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com
(email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
-
© Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via
salesaddresses@nexperia.com).
Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia

74HC2G34GV Related Products

74HC2G34GV 74HCT2G34GV-G 74HC2G34GW-G 74HC2G34GV-G 74HC2G34GW 74HCT2G34GV 74HCT2G34GW 74HCT2G34GW-G
Description Buffer Buffer Buffer Buffer Buffer Buffer Buffer Buffer
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia
package instruction TSOP, TSOP, TSSOP, TSOP, TSSOP, TSOP, TSSOP, TSSOP,
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
series HC/UH HCT HC/UH HC/UH HC/UH HCT HCT HCT
JESD-30 code R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
length 2.9 mm 2.9 mm 2 mm 2.9 mm 2 mm 2.9 mm 2 mm 2 mm
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
Number of functions 2 2 2 2 2 2 2 2
Number of entries 1 1 1 1 1 1 1 1
Number of terminals 6 6 6 6 6 6 6 6
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP TSOP TSSOP TSOP TSSOP TSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 125 ns 29 ns 125 ns 125 ns 125 ns 29 ns 29 ns 29 ns
Maximum seat height 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 6 V 5.5 V 6 V 6 V 6 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 4.5 V 2 V 2 V 2 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.95 mm 0.95 mm 0.65 mm 0.95 mm 0.65 mm 0.95 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 1.5 mm 1.5 mm 1.25 mm 1.5 mm 1.25 mm 1.5 mm 1.25 mm 1.25 mm
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 - 260 NOT SPECIFIED
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 - 30 NOT SPECIFIED
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