Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
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Nexperia.
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
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© Nexperia B.V. (year). All rights reserved.
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BCM857BV; BCM857BS;
BCM857DS
PNP/PNP matched double transistors
Rev. 06 — 28 August 2009
Product data sheet
1. Product profile
1.1 General description
PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic
packages. The transistors are fully isolated internally.
Table 1.
Product overview
Package
NXP
BCM857BV
BCM857BS
BCM857DS
SOT666
SOT363
SOT457
JEITA
-
SC-88
SC-74
NPN/NPN
complement
BCM847BV
BCM847BS
BCM847DS
Matched version of
BC857BV
BC857BS
-
Type number
1.2 Features
I
Current gain matching
I
Base-emitter voltage matching
I
Drop-in replacement for standard double transistors
1.3 Applications
I
Current mirror
I
Differential amplifier
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
h
FE
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
V
CE
=
−5
V;
I
C
=
−2
mA
Conditions
open base
Min
-
-
200
Typ
-
-
290
Max
−45
−100
450
Unit
V
mA
Per transistor
NXP Semiconductors
BCM857BV/BS/DS
PNP/PNP matched double transistors
Quick reference data
…continued
Parameter
h
FE
matching
V
BE
matching
Conditions
V
CE
=
−5
V;
I
C
=
−2
mA
V
CE
=
−5
V;
I
C
=
−2
mA
[1]
Table 2.
Symbol
Per device
h
FE1
/h
FE2
V
BE1
−V
BE2
Min
0.9
-
Typ
1
-
Max
-
2
Unit
[2]
mV
[1]
[2]
The smaller of the two values is taken as the numerator.
The smaller of the two values is subtracted from the larger value.
2. Pinning information
Table 3.
Pin
1
2
3
4
5
6
Pinning
Description
emitter TR1
base TR1
collector TR2
emitter TR2
base TR2
collector TR1
1
2
3
001aab555
sym018
Simplified outline
6
5
4
Symbol
6
5
4
TR2
TR1
1
2
3
3. Ordering information
Table 4.
Ordering information
Package
Name
BCM857BV
BCM857BS
BCM857DS
-
SC-88
SC-74
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 6 leads
plastic surface-mounted package (TSOP6); 6 leads
Version
SOT666
SOT363
SOT457
Type number
4. Marking
Table 5.
Marking codes
Marking code
[1]
3B
A9*
R8
Type number
BCM857BV
BCM857BS
BCM857DS
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
BCM857BV_BS_DS_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 28 August 2009
2 of 15
NXP Semiconductors
BCM857BV/BS/DS
PNP/PNP matched double transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
total power dissipation
SOT666
SOT363
SOT457
Per device
P
tot
total power dissipation
SOT666
SOT363
SOT457
T
j
T
amb
T
stg
[1]
[2]
Conditions
open emitter
open base
open collector
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
[1][2]
[1]
[1]
Min
-
-
-
-
-
Max
−50
−45
−5
−100
−200
Unit
V
V
V
mA
mA
Per transistor
-
-
-
200
200
250
mW
mW
mW
T
amb
≤
25
°C
[1][2]
[1]
[1]
-
-
-
-
−65
−65
300
300
380
150
+150
+150
mW
mW
mW
°C
°C
°C
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT666
SOT363
SOT457
Conditions
in free air
[1][2]
[1]
[1]
Min
Typ
Max
Unit
Per transistor
-
-
-
-
-
-
625
625
500
K/W
K/W
K/W
BCM857BV_BS_DS_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 28 August 2009
3 of 15
NXP Semiconductors
BCM857BV/BS/DS
PNP/PNP matched double transistors
Thermal characteristics
…continued
Parameter
thermal resistance from
junction to ambient
SOT666
SOT363
SOT457
Conditions
in free air
[1][2]
[1]
[1]
Table 7.
Symbol
Per device
R
th(j-a)
Min
Typ
Max
Unit
-
-
-
-
-
-
416
416
328
K/W
K/W
K/W
[1]
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8.
Characteristics
T
amb
= 25
°
C unless otherwise specified
Symbol
I
CBO
Parameter
collector-base cut-off
current
Conditions
V
CB
=
−30
V;
I
E
= 0 A
V
CB
=
−30
V;
I
E
= 0 A;
T
j
= 150
°C
I
EBO
h
FE
emitter-base cut-off
current
DC current gain
V
EB
=
−5
V;
I
C
= 0 A
V
CE
=
−5
V;
I
C
=
−10 µA
V
CE
=
−5
V;
I
C
=
−2
mA
V
CEsat
collector-emitter
saturation voltage
I
C
=
−10
mA;
I
B
=
−0.5
mA
I
C
=
−100
mA;
I
B
=
−5
mA
V
BEsat
base-emitter
saturation voltage
I
C
=
−10
mA;
I
B
=
−0.5
mA
I
C
=
−100
mA;
I
B
=
−5
mA
V
BE
base-emitter voltage
V
CE
=
−5
V;
I
C
=
−2
mA
V
CE
=
−5
V;
I
C
=
−10
mA
C
c
collector capacitance V
CB
=
−10
V;
I
E
= i
e
= 0 A;
f = 1 MHz
emitter capacitance
V
EB
=
−0.5
V;
I
C
= i
c
= 0 A;
f = 1 MHz
[1]
Min
-
-
Typ
-
-
Max
−15
−5
Unit
nA
µA
Per transistor
-
-
200
-
-
-
-
−600
-
-
-
250
290
−50
−200
−760
−920
−650
-
-
−100
-
450
−200
−400
-
-
−700
−760
2.2
nA
mV
mV
mV
mV
mV
mV
pF
[1]
[2]
[2]
C
e
-
10
-
pF
BCM857BV_BS_DS_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 28 August 2009
4 of 15
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