Important notice
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
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-
© Nexperia B.V. (year). All rights reserved.
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BSH121
N-channel enhancement mode field-effect transistor
Rev. 01 — 14 August 2000
Product specification
1. Description
N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS™
1
technology.
Product availability:
BSH121 in SOT323.
2. Features
s
s
s
s
TrenchMOS™ technology
Very fast switching
Low threshold voltage
Subminiature surface mount package.
3. Applications
s
Battery management
s
High speed switch
s
Logic level translator.
c
c
4. Pinning information
Table 1:
Pin
1
2
3
Pinning - SOT323, simplified outline and symbol
Description
gate (g)
3
d
Simplified outline
Symbol
source (s)
drain (d)
g
1
Top view
2
MBC870
s
03ab30
SOT323
N-channel MOSFET
1.
TrenchMOS is a trademark of Royal Philips Electronics.
Philips Semiconductors
BSH121
N-channel enhancement mode field-effect transistor
5. Quick reference data
Table 2:
V
DS
I
D
P
tot
T
j
R
DSon
Quick reference data
Conditions
T
j
= 25 to 150
°C
T
sp
= 25
°C;
V
GS
= 4.5 V
T
sp
= 25
°C
V
GS
= 4.5 V; I
D
= 500 mA
V
GS
= 2.5 V; I
D
= 75 mA
V
GS
= 1.8 V; I
D
= 75 mA
Typ
−
−
−
−
2.3
2.4
3.1
Max
55
300
0.7
150
4.0
5.0
8.0
Unit
V
mA
W
°C
Ω
Ω
Ω
drain-source voltage (DC)
drain current (DC)
total power dissipation
junction temperature
drain-source on-state resistance
Symbol Parameter
6. Limiting values
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
DS
V
DGR
V
GS
I
D
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
T
sp
= 25
°C;
V
GS
= 4.5 V;
Figure 2
and
3
T
sp
= 100
°C;
V
GS
= 4.5 V;
Figure 2
I
DM
P
tot
T
stg
T
j
I
S
I
SM
peak drain current
total power dissipation
storage temperature
operating junction temperature
source (diode forward) current (DC)
peak source (diode forward) current
T
sp
= 25
°C
T
sp
= 25
°C;
pulsed; t
p
≤
10
µs
T
sp
= 25
°C;
pulsed; t
p
≤
10
µs;
Figure 3
T
sp
= 25
°C;
Figure 1
Conditions
T
j
= 25 to 150
°C
T
j
= 25 to 150
°C;
R
GS
= 20 kΩ
Min
−
−
−
−
−
−
−
−65
−65
−
−
Max
55
55
±8
300
194
1.2
0.7
+150
+150
300
1.2
Unit
V
V
V
mA
mA
A
W
°C
°C
mA
A
Source-drain diode
9397 750 07302
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 01 — 14 August 2000
2 of 13
Philips Semiconductors
BSH121
N-channel enhancement mode field-effect transistor
03aa17
120
P
der
(%)
100
(%)
03aa25
120
Ider
100
80
80
60
60
40
40
20
20
0
0
25
50
75
100
125
Tsp
0
150
o
( C)
175
0
25
50
75
100
125
150 175
Tsp (oC)
P
tot
P
der
=
----------------------
×
100%
P
°
tot
(
25 C
)
V
GS
≥
4.5 V
I
D
I
der
=
------------------
×
100%
-
I
°
D
(
25 C
)
Fig 1. Normalized total power dissipation as a
function of solder point temperature.
10
ID
(A)
1
10-1
P
Fig 2. Normalized continuous drain current as a
function of solder point temperature.
03aa72
Tsp = 25oC
RDSon = VDS/ ID
tp = 10
µ
s
100
µ
s
δ
=
tp
T
D.C.
10-2
tp
1 ms
10 ms
100 ms
t
T
10-3
1
10
VDS (V) 102
T
sp
= 25
°C;
I
DM
is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 07302
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 01 — 14 August 2000
3 of 13
Philips Semiconductors
BSH121
N-channel enhancement mode field-effect transistor
7. Thermal characteristics
Table 4:
Symbol
R
th(j-sp)
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to solder
point
thermal resistance from junction to ambient
Conditions
mounted on metal clad substrate;
Figure 4
mounted on printed circuit board;
minimum footprint
Value
180
400
Unit
K/W
K/W
7.1 Transient thermal impedance
103
Zth(j-sp)
(K/W)
δ
= 0.5
102
0.2
0.1
10
0.05
0.02
single pulse
1
10-5
10-4
10-3
10-2
10-1
1
tp (s)
10
tp
T
t
P
03aa70
δ
=
tp
T
Mounted on metal clad substrate.
Fig 4. Transient thermal impedance from junction to solder point as a function of
pulse duration.
9397 750 07302
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 01 — 14 August 2000
4 of 13
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