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LFP
AK
56
BUK7K134-100E
2 September 2015
D
Dual N-channel 100 V, 121 mΩ standard level MOSFET
Product data sheet
1. General description
Dual Standard level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package
using TrenchMOS technology. This product has been designed and qualified to AEC
Q101 standard for use in high performance automotive applications.
2. Features and benefits
•
•
•
•
•
Dual MOSFET
Q101 Compliant
Repetitive avalanche rated
Suitable for thermally demanding environments due to 175 °C rating
True standard level gate with V
GS(th)
rating of greater than 1 V at 175 °C
3. Applications
•
•
•
•
12 V, 24 V and 48 V Automotive systems
Motors, lamps and solenoid control
Transmission control
Ultra high performance power switching
4. Quick reference data
Table 1.
Symbol
V
DS
I
D
P
tot
R
DSon
Quick reference data
Parameter
drain-source voltage
drain current
total power dissipation
Conditions
T
j
≥ 25 °C; T
j
≤ 175 °C
V
GS
= 10 V; T
mb
= 25 °C;
Fig. 2
T
mb
= 25 °C;
Fig. 1
V
GS
= 10 V; I
D
= 5 A; T
j
= 25 °C;
Fig. 11
Min
-
-
-
Typ
-
-
-
Max
100
9.8
32
Unit
V
A
W
Static characteristics FET1 and FET2
drain-source on-state
resistance
gate-drain charge
-
97
121
mΩ
Dynamic characteristics FET1 and FET2
Q
GD
I
D
= 5 A; V
DS
= 80 V; V
GS
= 10 V;
T
j
= 25 °C;
Fig. 13; Fig. 14
-
4.3
-
nC
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NXP Semiconductors
BUK7K134-100E
Dual N-channel 100 V, 121 mΩ standard level MOSFET
5. Pinning information
Table 2.
Pin
1
2
3
4
5
6
7
8
Pinning information
Symbol Description
S1
G1
S2
G2
D2
D2
D1
D1
source1
gate1
source2
gate2
drain2
drain2
drain1
drain1
1
2
3
4
S1
G1
S2
G2
mbk725
Simplified outline
8
7
6
5
Graphic symbol
D1 D1
D2 D2
LFPAK56D (SOT1205)
6. Ordering information
Table 3.
Ordering information
Package
Name
BUK7K134-100E
LFPAK56D
Description
Plastic single ended surface mounted package
(LFPAK56D); 8 leads
Version
SOT1205
Type number
7. Marking
Table 4.
Marking codes
Marking code
713410E
Type number
BUK7K134-100E
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
DGR
V
GS
P
tot
I
D
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
total power dissipation
drain current
Conditions
T
j
≥ 25 °C; T
j
≤ 175 °C
R
GS
= 20 kΩ
T
j
≤ 175 °C; DC
T
mb
= 25 °C;
Fig. 1
T
mb
= 25 °C; V
GS
= 10 V;
Fig. 2
T
mb
= 100 °C; V
GS
= 10 V;
Fig. 2
I
DM
BUK7K134-100E
Min
-
-
-20
-
-
-
-
Max
100
100
20
32
9.8
6.9
39
Unit
V
V
V
W
A
A
A
2 / 13
peak drain current
T
mb
= 25 °C; pulsed; t
p
≤ 10 µs;
Fig. 3
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
2 September 2015
NXP Semiconductors
BUK7K134-100E
Dual N-channel 100 V, 121 mΩ standard level MOSFET
Symbol
T
stg
T
j
T
sld(M)
I
S
I
SM
E
DS(AL)S
Parameter
storage temperature
junction temperature
peak soldering temperature
Conditions
Min
-55
-55
-
Max
175
175
260
Unit
°C
½½C
°C
Source-drain diode FET1 and FET2
source current
peak source current
T
mb
= 25 °C
pulsed; t
p
≤ 10 µs; T
mb
= 25 °C
I
D
= 9.8 A; V
sup
≤ 100 V; R
GS
= 50 Ω;
V
GS
= 10 V; T
j(init)
= 25 °C; unclamped;
Fig. 4
[1]
[2]
120
P
der
(%)
80
-
-
9.8
39
A
A
Avalanche Ruggedness FET1 and FET2
non-repetitive drain-source
avalanche energy
[1][2]
-
10.9
mJ
Refer to application note AN10273 for further information
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C
03aa16
I
D
(A)
12
10
8
6
003aak388
40
4
2
0
0
50
100
150
T
mb
(°C)
200
0
0
25
50
75
100
125
150 175
T
mb
(°C)
200
Fig. 1.
Normalized total power dissipation as a
function of mounting base temperature
Fig. 2.
Continuous drain current as a function of
mounting base temperature
BUK7K134-100E
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
2 September 2015
3 / 13
NXP Semiconductors
BUK7K134-100E
Dual N-channel 100 V, 121 mΩ standard level MOSFET
I
D
(A)
10
2
Limit R
DSon
= V
DS
/ I
D
10
DC
1
t
p
= 10 us
100 us
003aak387
10
-1
1 ms
10 ms
100 ms
10
-2
1
10
10
2
V
DS
(V)
10
3
Fig. 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
I
AL
(A)
10
2
003aak389
10
(1)
1
(2)
10
-1
(3)
10
-2
10
-3
10
-2
10
-1
1
t
AL
(ms)
10
Fig. 4.
Avalanche rating; avalanche current as a function of avalanche time
9. Thermal characteristics
Table 6.
Symbol
R
th(j-mb)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
Fig. 5
Min
-
Typ
-
Max
4.68
Unit
K/W
R
th(j-a)
Minimum footprint; mounted on a
printed circuit board
-
95
-
K/W
BUK7K134-100E
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
2 September 2015
4 / 13
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