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LMV7255MWC

Description
IC COMPARATOR, 6000 uV OFFSET-MAX, 670 ns RESPONSE TIME, UUC, WAFER, Comparator
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size221KB,11 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

LMV7255MWC Overview

IC COMPARATOR, 6000 uV OFFSET-MAX, 670 ns RESPONSE TIME, UUC, WAFER, Comparator

LMV7255MWC Parametric

Parameter NameAttribute value
MakerNational Semiconductor(TI )
Parts packaging codeWAFER
package instructionDIE, WAFER
Reach Compliance Codeunknown
ECCN codeEAR99
Amplifier typeCOMPARATOR
Maximum average bias current (IIB)0.1 µA
Maximum input offset voltage6000 µV
JESD-30 codeX-XUUC-N
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions1
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output typeOPEN-DRAIN
Package body materialUNSPECIFIED
encapsulated codeDIE
Encapsulate equivalent codeWAFER
Package shapeUNSPECIFIED
Package formUNCASED CHIP
power supply1.8/5 V
Certification statusNot Qualified
Nominal response time670 ns
Maximum slew rate0.025 mA
Supply voltage upper limit5.5 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal locationUPPER

LMV7255MWC Related Products

LMV7255MWC LMV7255MDC
Description IC COMPARATOR, 6000 uV OFFSET-MAX, 670 ns RESPONSE TIME, UUC, WAFER, Comparator IC COMPARATOR, 6000 uV OFFSET-MAX, 670 ns RESPONSE TIME, UUC, DIE, Comparator
Maker National Semiconductor(TI ) National Semiconductor(TI )
Parts packaging code WAFER WAFER
package instruction DIE, WAFER DIE, DIE OR CHIP
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Amplifier type COMPARATOR COMPARATOR
Maximum average bias current (IIB) 0.1 µA 0.1 µA
Maximum input offset voltage 6000 µV 6000 µV
JESD-30 code X-XUUC-N X-XUUC-N
Number of functions 1 1
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Output type OPEN-DRAIN OPEN-DRAIN
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIE DIE
Encapsulate equivalent code WAFER DIE OR CHIP
Package shape UNSPECIFIED UNSPECIFIED
Package form UNCASED CHIP UNCASED CHIP
power supply 1.8/5 V 1.8/5 V
Certification status Not Qualified Not Qualified
Nominal response time 670 ns 670 ns
Maximum slew rate 0.025 mA 0.025 mA
Supply voltage upper limit 5.5 V 5.5 V
Nominal supply voltage (Vsup) 2.7 V 2.7 V
surface mount YES YES
technology BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD
Terminal location UPPER UPPER

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