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IS61LV256-15NI

Description
Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Categorystorage    storage   
File Size211KB,7 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
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IS61LV256-15NI Overview

Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

IS61LV256-15NI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeDIP
package instruction0.300 INCH, PLASTIC, DIP-28
Contacts28
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time15 ns
Other featuresAUTOMATIC POWER-DOWN
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length35.306 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum standby current0.005 A
Minimum standby current3.13 V
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
This Material Copyrighted By Its Respective Manufacturer

IS61LV256-15NI Related Products

IS61LV256-15NI IS61LV256-20JI IS61LV256-12T IS61LV256-15J IS61LV256-20NI IS61LV256-12N IS61LV256-20J IS61LV256-25T IS61LV256-25NI
Description Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Standard SRAM, 32KX8, 12ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, TSOP1-28 Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Standard SRAM, 32KX8, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, TSOP-28 Standard SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code DIP SOJ TSOP SOJ DIP DIP SOJ TSOP DIP
package instruction 0.300 INCH, PLASTIC, DIP-28 SOJ-28 TSOP1-28 SOJ-28 0.300 INCH, PLASTIC, DIP-28 0.300 INCH, PLASTIC, DIP-28 SOJ-28 0.450 INCH, PLASTIC, TSOP-28 0.300 INCH, PLASTIC, DIP-28
Contacts 28 28 28 28 28 28 28 28 28
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 15 ns 20 ns 12 ns 15 ns 20 ns 12 ns 20 ns 25 ns 25 ns
Other features AUTOMATIC POWER-DOWN AUTOMATIC POWER DOWN AUTOMATIC POWER DOWN AUTOMATIC POWER DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T28 R-PDSO-J28 R-PDSO-G28 R-PDSO-J28 R-PDIP-T28 R-PDIP-T28 R-PDSO-J28 R-PDSO-G28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ TSOP1 SOJ DIP DIP SOJ TSOP1 DIP
Encapsulate equivalent code DIP28,.3 SOJ28,.34 TSSOP28,.53,22 SOJ28,.34 DIP28,.3 DIP28,.3 SOJ28,.34 TSSOP28,.53,22 DIP28,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.005 A 0.005 A 0.002 A 0.002 A 0.005 A 0.002 A 0.002 A 0.002 A 0.005 A
Maximum slew rate 0.1 mA 0.09 mA 0.1 mA 0.09 mA 0.09 mA 0.1 mA 0.08 mA 0.07 mA 0.08 mA
Maximum supply voltage (Vsup) 3.465 V 3.33 V 3.33 V 3.33 V 3.465 V 3.63 V 3.33 V 3.63 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 2.97 V 3.135 V 3.135 V 2.97 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO YES YES YES NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND GULL WING J BEND THROUGH-HOLE THROUGH-HOLE J BEND GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
length 35.306 mm - - - 35.306 mm 35.306 mm - 11.8 mm 35.306 mm
Number of ports 1 - - - 1 1 - 1 1
Peak Reflow Temperature (Celsius) NOT SPECIFIED - - - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V - - - 3.3 V 3.3 V - 3.3 V 3.3 V
Maximum seat height 4.572 mm - - - 4.572 mm 4.572 mm - 1.2 mm 4.572 mm
Minimum standby current 3.13 V - - - 3.13 V 3.13 V - 3.13 V 3.13 V
Terminal pitch 2.54 mm - - - 2.54 mm 2.54 mm - 0.55 mm 2.54 mm
Maximum time at peak reflow temperature NOT SPECIFIED - - - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 7.62 mm - - - 7.62 mm 7.62 mm - 8 mm 7.62 mm
Humidity sensitivity level - 3 3 3 - - 3 3 -

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