EEWORLDEEWORLDEEWORLD

Part Number

Search

BZV55C7V5E3

Description
Zener Diode, 7.45V V(Z), 6.04%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, LEADLESS, LL34, MELF-2
CategoryDiscrete semiconductor    diode   
File Size24KB,1 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

BZV55C7V5E3 Overview

Zener Diode, 7.45V V(Z), 6.04%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, LEADLESS, LL34, MELF-2

BZV55C7V5E3 Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionO-LELF-R2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresMETALLURGICALLY BONDED
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-213AA
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage7.5 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum voltage tolerance6.04%
Working test current5 mA
• ZENER DIODES
•LEADLESS PACKAGE FOR SURFACE MOUNT
• DOUBLE PLUG CONSTRUCTION
• METALLURGICALLY BONDED
BZV55 C2V4
thru
BZV55 C75
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Power Derating: 3.33 mW / °C above +50°C
Forward Voltage: @ 200mA: 1.1 Volts maximum
ELECTRICAL CHARACTERISTICS
@ 25°C, unless otherwise specified.
MAXIMUM
DIFFERENTIAL
RESISTANCE
rdiff @ I Z
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2
2
2
2
2
2
2
2
OHMS
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
150
170
180
200
215
240
255
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2
2
2
2
2
2
2
2
50
20
10
5
5
3
3
3
2
1
3
2
1
.700
.500
.200
.100
.100
.100
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
.050
MAXIMUM
REVERSE
CURRENT
IR @ VR
TYPE
ZENER VOLTAGE
(NOTE 1)
VZ @ I ZT
VOLTS
MIN
MAX
µ
A
VOLTS
1
1
1
1
1
1
1
2
2
2
4
4
5
5
6
7
8
8
8
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
30.1
32.9
35.7
39.2
43.4
47.6
52.2
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
BZV55
C2V4
C2V7
C3V0
C3V3
C3V6
C3V9
C4V3
C4V7
C5V1
C5V6
C6V2
C6V8
C7V5
C8V2
C9V1
C10
C11
C12
C13
C15
C16
C18
C20
C22
C24
C27
C30
C33
C36
C39
C43
C47
C51
C56
C62
2.2
2.5
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28.0
31.0
34.0
37.0
40.0
44.0
48.0
52.0
58.0
64.0
70.0
2.6
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32.0
35.0
38.0
41.0
46.0
50.0
54.0
60.0
66.0
72.0
79.0
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
D
1.60
1.70 0.063 0.067
F
0.41
0.55 0.016 0.022
G
3.30
3.70 .130 .146
G1
2.54 REF.
.100 REF.
S
0.03 MIN.
.001 MIN.
DESIGN DATA
CASE:
DO-213AA, Hermetically sealed
glass case. (MELF, SOD-80, LL34)
LEAD FINISH:
Tin / Lead
THERMAL RESISTANCE: (R
OJEC):
100 ÞC/W maximum at L = 0 inch
THERMAL IMPEDANCE: (Z
OJX): 35
ÞC/W maximum
POLARITY:
Diode to be operated with
the banded (cathode) end positive.
MOUNTING SURFACE SELECTION:
The Axial Coefficient of Expansion
(COE) Of this Device is Approximately
+6PPM/°C. The COE of the Mounting
Surface System Should Be Selected To
Provide A Suitable Match With This
Device.
BZV55 C68
BZV55 C75
NOTE 1
Nominal Zener voltage is measured with the device junction in thermal
equilibrium at an ambient temperature of 25°C + 3°C.
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841
PHONE (978) 620-2600
FAX (978) 689-0803
WEBSITE: http://www.microsemi.com
165
Cyclone III AS Configuration
I would like to ask you a question: Can I still use JTAG to debug after AS configuration?...
lan54160 FPGA/CPLD
Mobile phone module Internet access
I want to use a mobile phone module to simulate mobile phone Internet access. I plan to use PPP protocol to dial up to the Internet and then use HTTP to access the web page. I don’t know if mobile pho...
lijiamin11 Embedded System
Breaking news, breaking news, Launchpad has been upgraded~
Launchpad has released version 1.5~ Made some minor changes, as shown below:The pin headers are already soldered, and the included chips are replaced with the flagship G2553 and G2452 of the G2 series...
juring Microcontroller MCU
Recruiting software project engineer-Beijing or Shanghai
[align=left]The headhunting company is recruiting for a foreign company. If you are interested, please send your resume to [url=mailto:helen99@mjsearch.cn]helen99@mjsearch.cn[/url] [/align][align=left...
zmrjy99 Recruitment
Water Temperature Control System Based on 18B20 and 51 Single Chip Microcomputer
Regarding the water temperature control system, there are simulation diagrams and codes, which can be run directly. . . . . ....
她green 51mcu

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 802  1727  2652  2387  959  17  35  54  49  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号