WE128K32-300G2MA datasheet, PDF

WE128K32-300G2MA: DescriptionEEPROM Module, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size362KB，12 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WE128K32-300G2MA Overview

EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CQFP68, CERAMIC, QFP-68

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	QFP
package instruction	QFP,
Contacts	68
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	300 ns
Other features	USER CONFIGURABLE AS 256K X 16 OR 128K X 32; 10K ENDURANCE WRITE CYCLES
Spare memory width	16
Durability	10000 Write/Erase Cycles
JESD-30 code	S-CQFP-G68
length	22.4 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	5.1 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	22.4 mm

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