DAC101C085CIMM datasheet, PDF - EEWORLD Datasheet

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DAC101C085CIMM: Description10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface; CategoryAnalog mixed-signal IC converter; File Size518KB，24 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Related ProductsFound1parts with similar functions to DAC101C085CIMM

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DAC101C085CIMM Overview

10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface

DAC101C085CIMM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	MSOP-8
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum analog output voltage	5.5 V
Minimum analog output voltage
Converter type	D/A CONVERTER
Enter bit code	BINARY
Input format	SERIAL
JESD-30 code	S-PDSO-G8
JESD-609 code	e0
length	3 mm
Maximum linear error (EL)	0.1953%
Humidity sensitivity level	1
Number of digits	10
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.19
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.09 mm
Maximum stabilization time	6 µs
Nominal settling time (tstl)	4.5 µs
Maximum slew rate	0.152 mA
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3 mm

DAC101C085CIMM Related Products

	DAC101C085CIMM	DAC101C081CIMK	DAC101C081CIMKX	DAC101C081CISD	DAC101C081CISDX	DAC101C085CIMMX	DAC101C08XEB
Description	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface	10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface
Is it Rohs certified?	incompatible	conform to	conform to	incompatible	incompatible	incompatible	-
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	-	-	National Semiconductor（TI ）	-
package instruction	MSOP-8	VSSOP, TSOP6,.11,37	VSSOP, TSOP6,.11,37	LLP-6	LLP-6	MSOP-8	-
Reach Compliance Code	_compli	compli	compli	_compli	_compli	_compli	-
ECCN code	EAR99	-	-	EAR99	EAR99	EAR99	-
Maximum analog output voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	-
Enter bit code	BINARY	BINARY	BINARY	BINARY	BINARY	BINARY	-
Input format	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	-
JESD-30 code	S-PDSO-G8	R-PDSO-G6	R-PDSO-G6	R-XDSO-G6	R-XDSO-G6	S-PDSO-G8	-
JESD-609 code	e0	e4	e4	e0	e0	e0	-
length	3 mm	2.97 mm	2.97 mm	2.5 mm	2.5 mm	3 mm	-
Maximum linear error (EL)	0.1953%	0.1953%	0.1953%	0.1953%	0.1953%	0.1953%	-
Humidity sensitivity level	1	1	1	1	1	1	-
Number of digits	10	10	10	10	10	10	-
Number of functions	1	1	1	1	1	1	-
Number of terminals	8	6	6	6	6	8	-
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	-
encapsulated code	TSSOP	VSSOP	VSSOP	HVSSOP	HVSSOP	TSSOP	-
Encapsulate equivalent code	TSSOP8,.19	TSOP6,.11,37	TSOP6,.11,37	-	-	TSSOP8,.19	-
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
Peak Reflow Temperature (Celsius)	260	-	-	260	260	260	-
power supply	3/5 V	3/5 V	3/5 V	-	-	3/5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.09 mm	1 mm	1 mm	0.8 mm	0.8 mm	1.09 mm	-
Maximum stabilization time	6 µs	6 µs	6 µs	-	-	6 µs	-
Nominal settling time (tstl)	4.5 µs	4.5 µs	4.5 µs	4.5 µs	4.5 µs	4.5 µs	-
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	-
surface mount	YES	YES	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
Terminal surface	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	-
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	0.65 mm	0.95 mm	0.95 mm	0.65 mm	0.65 mm	0.65 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	40	-	-	40	40	40	-
width	3 mm	1.65 mm	1.65 mm	2.2 mm	2.2 mm	3 mm	-

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