LTPH245
LINE THERMAL PRINTER MECHANISM
TECHNICAL REFERENCE
U00027926850
Seiko Instruments Inc.
LTPH245 TECHNICAL REFERENCE
Document Number U00027926850
First Edition
December 1999
Copyright © 1999 by Seiko Instruments Inc.
All rights reserved.
Seiko Instruments Inc. (SII) has prepared this manual for use by SII personnel, licensees, and customers.
The information contained herein is the property of SII and shall not be reproduced in whole or in part
without the prior written approval of SII.
SII reserves the right to make changes without notice to the specifications and materials contained herein
and shall not be responsible for any damages (including consequential) caused by reliance on the
materials presented, including but not limited to typographical, arithmetic, or listing errors.
SII is a trademark of Seiko Instruments Inc.
PREFACE
This reference manual describes the specifications and basic operating procedures for the LTPH245 Line
Thermal Printer Mechanism (hereinafter referred to as “printer”).
Chapter 1 “Precautions” describes safety, design and operational precautions. Read it thoroughly before
designing so that you are able to use the printer properly.
SII has not investigated the intellectual property rights of the sample circuits included in this manual. Fully
investigate the intellectual property rights of these circuits before using.
iii
TABLE OF CONTENTS
Section
CHAPTER 1 PRECAUTIONS
1.1
1.2
SAFETY PRECAUTIONS .............................................................................................
DESIGN AND HANDLING PRECAUTIONS .................................................................
1.2.1 Design Precautions..........................................................................................
1.2.2 Handling Precautions.......................................................................................
Page
1-1
1-2
1-2
1-4
CHAPTER 2 FEATURES
CHAPTER 3 SPECIFICATIONS
3.1
3.2
3.3
3.4
GENERAL SPECIFICATIONS......................................................................................
HEAT ELEMENT DIMENSIONS...................................................................................
PAPER FEED CHARACTERISTICS ............................................................................
STEP MOTOR CHARACTERISTICS ...........................................................................
3.4.1 Motor Drive Circuit ...........................................................................................
3.4.2 Motor Timing ....................................................................................................
3.4.3 Precautions for Driving the Motor ....................................................................
THERMAL HEAD..........................................................................................................
3.5.1 Structure of the Thermal Head ........................................................................
3.5.2 Printed Position of the Data .............................................................................
3.5.3 Head Resistance..............................................................................................
3.5.4 Head Voltage ...................................................................................................
3.5.5 Peak Current....................................................................................................
3.5.6 Thermal Head Electrical Characteristics..........................................................
3.5.7 Timing Chart ....................................................................................................
CONTROLLING THE HEAD ACTIVATION (DST) PULSE WIDTH .............................
3.6.1 Calculation of Head Activation Pulse Width.....................................................
3.6.2 Calculation of Applied Energy..........................................................................
3.6.3 Calculation of Head Activation Voltage............................................................
3.6.4 Calculation of Head Resistance.......................................................................
3.6.5 Determination of Activation Pause Time and Activation Pulse Period.............
3.6.6 Head Activation Pulse Term Coefficient ..........................................................
3.6.7 Head Storage Coefficient.................................................................................
3.6.8 Calculation Sample for the Head Activation Pulse Width ................................
3.6.9 Thermistor Resistance.....................................................................................
3.6.10 Detecting Abnormal Temperatures of the Thermal Head................................
PAPER DETECTOR .....................................................................................................
3.7.1 General Specifications .....................................................................................
3.7.2 Sample External Circuit ...................................................................................
3-1
3-3
3-4
3-5
3-6
3-8
3-10
3-12
3-12
3-14
3-15
3-16
3-16
3-17
3-18
3-19
3-19
3-19
3-20
3-20
3-21
3-21
3-22
3-23
3-24
3-26
3-27
3-27
3-28
3.5
3.6
3.7
iv
Section
3.8
PLATEN POSITION SENSOR......................................................................................
3.8.1 General Specification.......................................................................................
3.8.2 Sample External Circuit ..................................................................................
Page
3-29
3-29
3-29
CHAPTER 4 CONNECTING EXTERNAL CIRCUITS
4.1
4.2
4.3
THERMAL HEAD CONTROL TERMINALS .................................................................
MOTOR AND DETECTOR TERMINALS .....................................................................
CAUTION IN CONNECTION........................................................................................
4-1
4-3
4-4
CHAPTER 5 DRIVE METHOD
5.1
5.2
THERMAL HEAD DRIVE TIMING ................................................................................
MOTOR DRIVE TIMING ...............................................................................................
5-1
5-2
CHAPTER 6 HOUSING DESIGN GUIDE
6.1
SECURING THE PRINTER ..........................................................................................
6.1.1 Printer Mounting Method..................................................................................
6.1.2 Mounting Platen Block .....................................................................................
6.1.3 Precautions for Securing the Printer ................................................................
LAYOUT OF PRINTER AND PAPER ...........................................................................
WHERE TO MOUNT THE PAPER HOLDER...............................................................
SETTING THE PAPER .................................................................................................
POSITIONING THE PAPER CUTTER .........................................................................
OUTER CASE STRUCTURE .......................................................................................
6-1
6-1
6-2
6-3
6-4
6-4
6-4
6-5
6-6
6.2
6.3
6.4
6.5
6.6
CHAPTER 7 APPEARANCE AND DIMENSIONS
CHAPTER 8 LOADING/UNLOADING PAPER AND HEAD CLEANING
8.1
8.2
LOADING/UNLOADING PAPER PRECAUTIONS .......................................................
HEAD CLEANING PROCEDURE AND PRECAUTIONS .............................................
8.2.1 PRECAUTIONS ...............................................................................................
8.2.2 PROCEDURE ..................................................................................................
8-1
8-3
8-3
8-3
v
京公网安备 11010802033920号
EEWORLD
