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RSMT23AP-11004/11004D

Description
Array/Network Resistor, Divider, Thin Film, 0.25W, 100V, 0.5% +/-Tol, 150ppm/Cel, Surface Mount, 0911, CHIP
CategoryPassive components    The resistor   
File Size30KB,1 Pages
ManufacturerMini-Systems Inc (MSI)
Websitehttp://www.mini-systemsinc.com
Download Datasheet Parametric View All

RSMT23AP-11004/11004D Overview

Array/Network Resistor, Divider, Thin Film, 0.25W, 100V, 0.5% +/-Tol, 150ppm/Cel, Surface Mount, 0911, CHIP

RSMT23AP-11004/11004D Parametric

Parameter NameAttribute value
package instruction, 0911
Reach Compliance Codecompli
ECCN codeEAR99
The first element resistor11000000 Ω
Manufacturer's serial numberRSMT-23
Installation featuresSURFACE MOUNT
Network TypeDIVIDER
Number of components2
Number of functions1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)0.25 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
Second/last element resistor11000000 Ω
size code0911
surface mountYES
technologyTHIN FILM
Temperature Coefficient150 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.5%
Operating Voltage100 V
Base Number Matches1
THIN FILM SURFACE MOUNT RESISTORS
RSMT-23
RSMT-23
(23:) Direct Replacement for SOT-23
MINI-SMT RSMT-23
MINI-SMT
T M
RSMT-23 SERIES RESISTOR
DAT
MECHANICAL DATA
SIZE: RSMT(23)
H
MINI-SMT-23
1Ω
500MΩ.
MINI-SMT-23
TM
thin film resistors offer maximum benefits in ohmic value ranges from 1
through 500M
Ω.
T.C.R.'s to ±5ppm/°C - and absolute tolerances to 0.05%. These packaged resistors provide proven thin
film performance in a surface mount solderable style.
0.112" x 0.090" (±0.005") x 0.050"MAX NOM.
ALUMINA
PROPRIETARY
PROPRIETARY
GOLD OR SOLDER, PALLADIUM SILVER OPTIONAL
0.018" x 0.020" ±0.003"
SUBSTRATE
SUBSTRATE
RESISTOR
MATERIAL
BONDING MATERIAL
BOND PAD SIZE (23)
DAT
ELECTRICAL DATA
RESISTANCE
RESISTANCE RANGE
TOLERANCES
T.C.R.
50MΩ
1
TO 50M
50MΩ 500MΩ
50M
TO 500M
500MΩ
1
TO 500M
0.1%, 0.5%, 1%, 2%, 5%, 10%: TO 0.05% AVAILABLE
STANDARD:
±150ppm/°C STANDARD: OPTIONAL TO ±5ppm/°C
STANDARD:
±300ppm/°C STANDARD: OPTIONAL TO ±100ppm/°C
W
R1
L
R2
0.090
DAT
SERIES DATA
CURRENT NOISE
DIELECTRIC BREAKDOWN
INSULATION RESISTANCE
INSULATION RESISTANCE
OPERATING VOLT
OPERATING VOLTAGE
RATING
POWER RATING
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
101Ω
250KΩ
101
TO 250K
: -40dB
100Ω 250KΩ
100
,
250K
: -30dB
400 V MIN.
10
12
MIN.
100 V MAX.
DERATED LINEARLY
250 mW (70°C DERATED LINEARLY TO 150°C) P = E ²/R
RATED
25°
±0.
0.2
5X RATED POWER, 25°C, 5 SEC., ±0.25% MAX.
R/R: ±0.1% MSI TYPICAL
±0.25%
0.03
03%
150°C, 100 HRS., ±0.25% MAX.
R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX.
R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX.
R/R: ±0.1% MSI TYPICAL
70°C, 125mW, ±0.5%
1000 HRS., 70°C, 125mW, ±0.5% MAX.
R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +150°C
0.112
DESIGNATION
PART NUMBER DESIGNATION
RSMT 23
SERIES
A
SUBSTRATE
SUBSTRATE
P
RESISTIVE
FILM
XXXXX/XXXXX
OHMIC VALUE
R1 / R2
5-Digit
Number: 1st
4 Digits Are
Significant
With "R" As
Decimal
Point When
Required.
5th Digit
Represents
Number of
Zeros.
X
TOLERANCE
Q = 0.05%**
B = 0.1%**
D = 0.5%
F = 1%
G = 2%
J = 5%
K = 10%
X
OPTION
DESIGNATOR
DESIGNATOR
(If Required)
A = ±50ppm/°C
B = ±25ppm/°C**
C = ±10ppm/°C**
D = ±5ppm/°C**
F = ±100ppm/°C
T = Solder
Terminations
T3 = Leadfree Solder
Terminations
U = Untinned
TR = Tape & Reel*
PS = Pd Silver Bond
Pads
G = Gold Bond Pads
RATIO
RA = ±0.01% RATIO
RATIO
RB = ±0.05% RATIO
RATIO
RC = ±0.1% RATIO
±0.25%RATIO
RE = ±0.25%RATIO
RATIO
RD = ±0.5% RATIO
(23): 0.112x A = Alumina P = Proprietary
0.090x0.050
PACKAGED
RESISTORS
5MΩ
Tol.,
EXAMPLES: RSMT 23 AP-50003B-CT = 0505, 5M
, ±0.1% Tol., ±10ppm/°C with
Termination.
Solder Termination.
MINI-SYSTEMS, INC.
THIN FILM DIVISION
DAVID
ATTLEBORO,
20 DAVID ROAD, N. ATTLEBORO, MA 02760
508-695-0203 FAX: 508-695-6076
DCN TF 148-B-0306
*CONSULT
AV
*CONSULT SALES FOR AVAILABILITY
**VALUE DEPENDENT
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