MRT-001-32.768kHz
SMT LOW POWER REAL TIME OSCILLATOR
Low Power Consumption
+1.2 VDC to +5.50 VDC Operation
Small SMT Ceramic Package
RoHS Compliant
Tight Frequency Tolerance
ELECTRICAL CHARACTERTICS
Parameter
Frequency Output
Frequency Tolerance (Tighter Tolerance on request)
Supply Voltage (Vdd )
Supply Current (Vdd = +3.00 VDC)
Output
I
OH
Output Current
I
OL
Symmetry
Logic “1” (V
OH
)
Logic “0” (V
OL
)
Rise / Fall Time
Start Up Time
Enable/Disable Enable (High)
Enable/Disable Enable (Low)
Voltage Coefficient
Aging first year max at +25°C
Turnover Temperature
Frequency vs. Temperature
Storage Temperature Range
Operating Temperature Range
Value
32.768kHz
±20 ppm
+1.20 VDC to +5.50 VDC
0.30 µA typ / 0.50µA max
CMOS
+1mA
-1mA
40%/60%
V
DD
– 0.40 VDC min
GND + 0.40 VDC max
70 nSec max
0.5 Sec max
80% V
DD
min
20% V
DD
max
±1.5 ppm/V max
±3.0 ppm
+25°C ±5°C typ
-.035 ppm/°C
2
(T-T
o
)
2
±10% ppm
-55°C to +125°C
-40°C to +85°C
ENVIRONMENTAL & MECHANICAL SPECIFICATION
Shock
Solderability
Solvent Resistance
Vibration
Gross Leak Test
Fine Leak Test
MSL
Reflow Conditions
MIL-STD-883, Method 2002, Cond B
MIL-STD-883, Method 2003
MIL-STD-202, Method 215
MIL-STD-883, Method 2007, Cond A
MIL-STD-883, Method 1014, Cond C
MIL-STD-883, Method, Method 1014, Cond A2
Level 3 per IPC/JEDEC J-STD 20
+260°C max 20 Sec per IPC/JEDEC J-STD 20
MMD Components,
30400 Esperanza, Rancho Santa Margarita, CA, 92688
Phone: (949) 709-5075, Fax: (949) 709-3536,
www.mmdcomp.com
Sales@mmdcomp.com
Specifications subject to change without notice
Pb
RoHS
Free
Compliant
Page 1 of 2
Revision: 130205B
MRT-001-32.768kHz
SMT LOW POWER REAL TIME OSCILLATOR
NOTES:
1. APPLICABLE STANDARDS / SPECIFICATION: ANSI Y14.5M, DIMENSIONS AND TOLERANCES.
2. DIMENSIONS ARE MILLIMETERS [INCHES]. MILLIMETERS ARE THE CONTROLLING DIMENSIONS, INCHES ARE FOR REFERENCE
ONLY.
3. THE PINS NUMBERS ARE FOR REFERENCE ONLY AND ARE NOT TO BE MARKED ON THE UNIT.
4. AN EXTERNAL BYPASS CAPACITOR IS RECOMMENDED.
5. TOLERANCES ARE ±0.25 [.010] FOR TWO PLACE DECIMALS AND ±0.5 [.02] FOR ONE PLACE DECIMALS.
6. PADS MATL
6.1.
BASE OR UNDER CONDUCTOR: NICKEL THICKNESS 1.3 MICRONS TO 1.8 MICRONS
6.2.
FINAL PLATING: GOLD (99.97%) 0.8 MICRONS TO 1.2 MICRONS
3.20 [.126]
2.70 [.106]
M32.768
SYWW
1.50 [.059]
1.20 [.047]
0.80 [.031]
PIN 1 INDICATOR
1.00 [.039]
1.00 [.039]
SUGGESTED SOLDER PADS
PIN CONNECTIONS
ENABLE/DISABLE
PIN 1
GROUND
PIN 2
PIN 3
OUTPUT
PIN 4
SUPPLY
0.40 [.016]
1
4
0.50 [.020]
2
3
ENABLE/ DISABLE
PIN 1
80% Vdd MIN
20% Vdd MAX
PIN 3
OUTPUT
HIGH
IMPEDANCE
0.75 [.030]
MARKING DETAIL
First Line = M32.768
M = MMD
32.768 = 32.768 kHz Output Frequency
Second Line = SYWW (Not be exceed 5 characters)
S = Internal Code (can be 1 or 2 characters)
YWW = Date Code (Year/Week)
Y = First digit of Year of Manufacture
WW = Week of Manufacture
Pin 1 Indicator
DO NOT SCALE DRAWING
THIRD ANGLE PROJECTION
Specifications subject to change without notice
Page 2 of 2
Revision: 130205B
PCB Design
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