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MPC7410TRX500LE

Description
32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size930KB,73 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MPC7410TRX500LE Overview

32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

MPC7410TRX500LE Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeBGA
package instructionBGA,
Contacts360
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width32
bit size32
boundary scanYES
maximum clock frequency133 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
length25 mm
low power modeYES
Number of terminals360
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height3.2 mm
speed500 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
MPC7410EC
Rev. 2, 10/2003
MPC7410 RISC
Microprocessor
Hardware Specifications
The MPC7410 is a PowerPC™ microprocessor. The MPC7410 is a reduced instruction set
computing (RISC) microprocessor that implements the PowerPC instruction set architecture.
This document describes pertinent electrical and physical characteristics of the MPC7410. For
functional characteristics of the processor, refer to the
MPC7410 RISC Microprocessor User’s
Manual
.
This document contains the following topics:
Topic
Section 1.1, “Overview”
Section 1.2, “Features”
Section 1.3, “General Parameters”
Section 1.4, “Electrical and Thermal Characteristics”
Section 1.5, “Pin Assignments”
Section 1.6, “Pinout Listings”
Section 1.7, “Package Description”
Section 1.8, “System Design Information”
Section 1.9, “Document Revision History”
Section 1.10, “Ordering Information”
Page
2
2
7
8
24
25
29
31
44
47
To locate any published errata or updates for this document, refer to the web site at
http://www.motorola.com/semiconductors.

MPC7410TRX500LE Related Products

MPC7410TRX500LE MPC7410THX450LE
Description 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
Maker Motorola ( NXP ) Motorola ( NXP )
Parts packaging code BGA BGA
package instruction BGA, BGA,
Contacts 360 360
Reach Compliance Code unknown unknown
ECCN code 3A001.A.3 3A001.A.3
Address bus width 32 32
bit size 32 32
boundary scan YES YES
maximum clock frequency 133 MHz 133 MHz
External data bus width 64 64
Format FLOATING POINT FLOATING POINT
Integrated cache YES YES
JESD-30 code S-CBGA-B360 S-CBGA-B360
length 25 mm 25 mm
low power mode YES YES
Number of terminals 360 360
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code BGA BGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified
Maximum seat height 3.2 mm 3.2 mm
speed 500 MHz 450 MHz
Maximum supply voltage 1.9 V 1.9 V
Minimum supply voltage 1.7 V 1.7 V
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
width 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC

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