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WEDF1M32B-90G2TM5

Description
Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size342KB,8 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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WEDF1M32B-90G2TM5 Overview

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68

WEDF1M32B-90G2TM5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction4.60 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time90 ns
Other featuresUSER CONFIGURABLE AS 4M X 8
startup blockBOTTOM
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width22.36 mm
White Electronic Designs
1Mx32 5V Flash Module
FEATURES
Access Times of 70, 90, 120ns
Packaging:
• 66 pin, PGA Type, 1.185” square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, 22mm Low Profile CQFP, 4.6mm
(0.180”), (Package 509)
Sector Architecture
• One 16KByte Sectors
• Two 8KByte Sectors
• One 32KByte Sectors
• Fifteen 64KByte Sectors
1,000,000 Erase/Program Cycles
WEDF1M32B-XXX5
ADVANCED*
Organized as 1Mx32, user configurable as 2Mx16
or 4Mx8.
Commercial, Industrial and Military Temperature
Ranges
5V ± 10% for Read and Write Operations.
Low Power CMOS
Embedded Erase and Program Algorithm
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WEDF1M32B-XG2TX5 - 8 grams typical
WEDF1M32B-XHX5 - 13 grams typical
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
PIN CONFIGURATION FOR WF1M32B-XHX5
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
RESET#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
A
19
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
NC
I/O
27
A
4
A
5
A
6
NC
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
RESET#
WE#
OE#
A0-19
PIN DESCRIPTION
I/O0-31
A0-19
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Selects
Output Enable
Reset
Power Supply
Ground
Not Connected
56
WE#
CS1-4#
OE#
RESET#
V
CC
GND
NC
Block Diagram
CS1#
CS2#
CS3#
CS4#
1M x 8
1M x 8
1M x 8
1M x 8
I/O
20
66
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
May 1999
Rev.1
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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