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WE128K32-150G1TC

Description
EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68
Categorystorage    storage   
File Size348KB,16 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WE128K32-150G1TC Overview

EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQFP68, 23.90 MM, CERAMIC, LQFP-68

WE128K32-150G1TC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction23.90 MM, CERAMIC, LQFP-68
Reach Compliance Codeunknown
Maximum access time150 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
Data pollingYES
Data retention time - minimum10
Durability10000 Write/Erase Cycles
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length23.88 mm
memory density4194304 bit
Memory IC TypeEEPROM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
page size128 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.06 mm
Maximum standby current0.0025 A
Maximum slew rate0.25 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width23.88 mm
Maximum write cycle time (tWC)10 ms
write protectSOFTWARE
White Electronic Designs
128Kx32 EEPROM MODULE, SMD 5962-94585
FEATURES
Access Times of 120*, 140, 150, 200, 250, 300ns
Packaging:
• 66-pin, PGA Type, 27.3mm (1.075") square,
Hermetic Ceramic HIP (Package 400)
• 68 lead, 22.4mm sq. CQFP (G2U), 4.57mm
(0.180") high, (Package 509)
• 68 lead, 23.9mm sq. Low Profile CQFP (G1U)
1
,
3.57mm (0.140") high, (Package 519)
• 68 lead, 23.9mm sq. Low Profile CQFP (G1T),
4.06mm (0.160") high, (Package 524)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Write Endurance 10,000 Cycles
Data Retention Ten Years Minimum (at +25°C)
Commercial, Industrial and Military Temperature
Ranges
WE128K32-XXX
Low Power CMOS
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
Weight
WE128K32-XG2UX - 8 grams typical
WE128K32-XG1UX - 5 grams typical
WE128K32-XG1TX
1
- 5 grams typical
WE128K32-XH1X - 13 grams typical
*
120ns not available for SMD product
Note 1: Package Not Recommended For New Design
F
IG
. 1
P
IN
C
ONFIGURATION FOR
WE128K32N-XH1X
TOP VIEW
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
May 2003 Rev. 7
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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