Specification of Automotive MLCC
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
①
①
Series
②
Size
③
Dielectric
④
Capacitance
⑤
Capacitance
tolerance
⑥
Rated Voltage
⑦
Thickness
31
②
B
③
225
④
K
⑤
B
⑥
H
⑦
4
⑧
P
⑨
N
⑩
E
⑪
CL31B225KBH4PNE
CAP, 2.2㎌, 50V, ±10%, X7R, 1206
Description :
AEC-Q 200 Specified
Samsung P/N :
Samsung Multi-layer Ceramic Capacitor
1206 (inch code)
L: 3.2 ± 0.2
X7R
2.2
㎌
±10 %
50 V
1.6 ± 0.2
mm
W:
1.6 ± 0.2 mm
Ni
Metal Epoxy
Sn 100%
Automotive
Standard
(Pb Free)
mm
⑧
Inner electrode
Termination
Plating
⑨
Product
⑩
Grade code
⑪
Packaging
Embossed Type, 7" reel
B. Reliability Test and Judgement condition
Performance
High Temperature
Exposure
Capacitance Change : Within ±10%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Temperature Cycling
Appearance : No abnormal exterior appearance 1000Cycles
Capacitance Change : Within ±10%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Destructive Physical
Analysis
Moisture Resistance
Appearance : No abnormal exterior appearance 10Cycles, t=24hrs/cycle
Capacitance Change : Within ±12.5%
Tan
δ
: 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Humidity Bias
Appearance : No abnormal exterior appearance 1000hrs 85℃/85%RH, Rated Voltate and 1.3~1.5V,
Capacitance Change : Within ±12.5%
Tan
δ
: 0.035 max
IR : More than 500㏁ or 25㏁×㎌
Whichever is Smaller
High Temperature
Operating Life
Appearance : No abnormal exterior appearance 1000hrs @ TA=125℃, 200% Rated Voltage,
Capacitance Change : Within ±12.5%
Tan
δ
: 0.035 max
IR : More than 1000㏁ or 50㏁×㎌
Whichever i S ll
Whi h
is Smaller
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
Add 100kohm resistor
Measurement at 24±2hrs after test conclusion
The charge/discharge current is less than 50mA.
Heat (25~65℃) and humidity (80~98%), Unpowered
measurement at 24±2hrs after test conclusion
No Defects or abnormalities
Measurement at 24±2hrs after test conclusion
1 cycle condition :
-55+0/-3℃(15±3min) -> Room Temp(1min.)
-> 125+3/-0℃(15±3min) -> Room Temp(1min.)
Per EIA 469
Test condition
Measurement at 24±2hrs after test conclusion
Appearance : No abnormal exterior appearance Unpowered, 1000hrs@T=150℃
Performance
External Visual
Physical Dimensions
Mechanical Shock
No abnormal exterior appearance
Within the specified dimensions
Microscope (´10)
Using The calipers
Test condition
Appearance : No abnormal exterior appearance Three shocks in each direction should be applied along
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
3 mutually perpendicular axes of the test specimen (18 shocks)
Peakvalue
1,500G
Duration
0.5ms
Wave
Half sine
Velocity
4.7m/sec.
Vibration
Appearance : No abnormal exterior appearance 5g's for 20min., 12cycles each of 3 orientations,
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2000㎐.
Resistance to
Solder Heat
Appearance : No abnormal exterior appearance Solder pot : 260±5℃, 10±1sec.
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Thermal Shock
Appearance : No abnormal exterior appearance -55℃/+125℃.
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Note: Number of cycles required-300,
Maximum transfer time-20 sec, Dwell time-15min. Air-Air
ESD
Appearance : No abnormal exterior appearance AEC-Q200-002
Capacitance Change : Within ±10%
Tan
δ,
IR : initial spec.
Solderability
95% of the terminations is to be soldered
l
d
ti
l
evenly and continuously
a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
b) Steam aging f 8 h
St
i for hours, I
Immerse i solder f 5 at 245 5℃
in ld for 5s t 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
Electrical
Characterization
Capacitance : Within specified tolerance
Tan
δ
(DF) : 0.025 max.
IR(25℃) : More than 10,000㏁ or 500㏁×㎌
IR(125℃) : More than1,000㏁ or 10㏁×㎌
Whichever is Smaller
Dielectric Strength
The Capacitance /D.F. should be measured at 25℃,
1㎑±10%, 1.0±0.2Vrms
I.R. should be measured with a DC voltage not exceeding
Rated Voltage @25℃, @125℃ for 60~120 sec.
Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Board Flex
Appearance : No abnormal exterior appearance Bending to the limit (2㎜) for 5 seconds
Capacitance Change : Within ±10%
Terminal
Strength(SMD)
Beam Load
Appearance : No abnormal exterior appearance 18N, for 60±1 sec.
Capacitance Change : Within ±10%
Destruction value should not be exceed
Chip Length
≥
3.2㎜
a) Chip Thickness < 1.25㎜ : 15N
b) Chip Thickness
≥
1.25㎜ : 54.5N
X7R
(From -55℃ to 125℃, Capacitance change should be within ±15%)
Beam speed
2.5±0.25㎜/sec
Temperature
Characteristics
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Meet IPC/JEDEC J-STD-020 D Standard
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Embedded System
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