DRAM Module, 256KX8, 100ns, CMOS, SIMM-30
| Parameter Name | Attribute value |
| Maker | ACCUTEK |
| Parts packaging code | SIMM |
| package instruction | , |
| Contacts | 30 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | PAGE |
| Maximum access time | 100 ns |
| JESD-30 code | R-XSMA-T30 |
| memory density | 2097152 bit |
| Memory IC Type | DRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 30 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | SINGLE |
| AK58256GP-10 | AK58256GP-70 | AK58256GP-80 | AK58256SP-80 | AK58256SP-10 | AK58256SP-60 | AK58256GP-60 | AK58256SP-70 | |
|---|---|---|---|---|---|---|---|---|
| Description | DRAM Module, 256KX8, 100ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 70ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 80ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 80ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 100ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 60ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 60ns, CMOS, SIMM-30 | DRAM Module, 256KX8, 70ns, CMOS, SIMM-30 |
| Parts packaging code | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| Contacts | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE |
| Maximum access time | 100 ns | 70 ns | 80 ns | 80 ns | 100 ns | 60 ns | 60 ns | 70 ns |
| JESD-30 code | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-N30 |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Maker | ACCUTEK | - | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK |