PC745BMGHU350LE datasheet, PDF

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PC745BMGHU350LE: DescriptionRISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，55 Pages; ManufacturerAtmel (Microchip)

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PC745BMGHU350LE Overview

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255

PC745BMGHU350LE Parametric

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	BGA
package instruction	BGA,
Contacts	255
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B255
length	21 mm
low power mode	YES
Number of terminals	255
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	3.08 mm
speed	350 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	21 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Features

•

18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz (PC755)

15.7SPECint95, 9SPECfp95 at 350 MHz (PC745)

733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

Selectable Bus Clock (12 CPU Bus Dividers up to 10x)

Typical 6.4W at 400 MHz, Full Operating Conditions

Nap, Doze and Sleep Modes for Power Savings

Superscalar (3 Instructions per Clock Cycle) Two Instruction + Branch

4 Beta Byte Virtual Memory, 4-GByte of Physical Memory

64-bit Data and 32-bit Address Bus Interface

32-KB Instruction and Data Cache

Six Independent Execution Units

Write-back and Write-through Operations

INT

max = 400 MHz (TBC)

BUS

max = 100 MHz

Voltage I/O 2.5V/3.3V; Voltage Int 2.0V

Description

The PC755 and PC745 PowerPC

microprocessors are high-performance, low-power,

32-bit implementations of the PowerPC Reduced Instruction Set Computer (RISC)

architecture, especially enhanced for embedded applications.

The PC755 and PC745 microprocessors differ only in that the PC755 features an

enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in

replacement for the award winning PowerPC 750 microprocessor and is footprint and

user software code compatible with the MPC7400 microprocessor with AltiVec

™

tech-

nology. The PC745 is a drop-in replacement for the PowerPC 740 microprocessor and

is also footprint and user software code compatible with the PowerPC 603e micropro-

cessor. PC755/745 microprocessors provide on-chip debug support and are fully

JTAG-compliant.

The PC745 microprocessor is pin compatible with the TSPC603e family.

PowerPC

755/745

32-bit RISC

Microprocessor

PC755/745

GH suffix

HITCE 255

Ceramic Ball Grid Array

GH suffix

HITCE 360

Ceramic Ball Grid Array

G suffix

CBGA360

Ceramic Ball Grid Array

GS suffix

CI-CGA360

Ceramic Ball Grid Array

with Solder Column

Interposer (SCI)

ZF suffix

PBGA255

Flip-Chip Plastic Ball Grid Array

ZF suffix

PBGA360

Flip-Chip Plastic Ball Grid Array

Rev. 2138E–HIREL–01/05

ATMEL CONFIDENTIAL

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